Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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46～60 item / All 65 items
![Development board for Qseven module [ROM-DB7502]](https://image.mono.ipros.com/public/product/image/a4f/2000513497/IPROS13576550574451312142.jpeg?w=280&h=280)
Development board for Qseven V2.0 / V2.1 RISC modules
- Compatible with Qseven V2.0 / V2.1 module boards - Mini-ITX form factor - Supports 1 PCIe, 1 GbE, 4 USB 2.0, 1 USB OTG 2.0, 1 SATA II, 1 I2C, 1 I2S, 1 CAN bus, and 8 GPIO - Smart battery support - Supports AT / ATX mode, input power +12V - Includes cable pack, built-in evaluation images & test utilities
Ultra-low noise, excellent stability, wideband ultra-small signal detection amplifier.
The "SA Series" is a low-noise amplifier that pursues technology to suppress factors that hinder measurement, such as noise and environmental influences, to the utmost limit. We offer the voltage input "SA-200 Series/SA-400 Series," which achieves low noise that was not attainable with previous amplifiers, and the current input "SA-600 Series," which realizes high gain and wide bandwidth. Please choose the model that matches the signal from your sensor. *For more details, please refer to the PDF document or feel free to contact us.
Here are some frequently asked questions (FAQ) related to production and technology of printed circuit boards.
At Sato-sen Co., Ltd., we provide high-quality printed circuit boards that meet the increasing demands for high functionality and high precision. We offer solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Here are some frequently asked questions regarding printed circuit boards: 【Production Related】 - Design: Supports DXF, DWG, and COB++, compatible with OrCAD Capture and BSchl. - Delivery Time: Can accommodate short delivery courses and can also shorten delivery times after ordering. - Quantity: Capable of producing even a single board. - Cost: Can reduce initial costs as we can handle everything from prototypes to mass production. - UL: UL compliant as we are a UL certified factory. For more details, please contact us.
PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.
The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.
![[Market Report] Global Market for Ceramic Substrates](https://image.mono.ipros.com/public/product/image/e69/2000948897/IPROS94976007637107731834.jpeg?w=280&h=280)
Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market
The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.
![[Market Report] Global Market for Ceramic Balls](https://image.mono.ipros.com/public/product/image/ce6/2000944964/IPROS21515631595989261468.jpeg?w=280&h=280)
Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance
The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.
Support for W356 width dual lane implementation in high-speed machines! Introduction of the mounter handled by Masu Shoji.
We would like to introduce the YAMAHA manufactured mount 'Z:LEX YSM20WR' handled by Masu Shoji. We have newly developed the ALF (Auto Loading Feeder) that innovates the replenishment of tape components with skill-less operation. In single lane mode, it standardly supports super-large substrates up to L810×W742, and it can also standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg. 【Features】 ■ Supports dual lane mounting with a width of W356 for high-speed machines ■ Standardly supports super-large substrates up to L810×W742 in single lane mode ■ Can standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg ■ Options to improve line operating rates without stopping the machine ■ Non-stop pallet exchange ATS (Auto Tray Sequencer) "sATS30NS" ■ Non-stop feeder bulk exchange system *For more details, please refer to the related links or feel free to contact us.
Non-stop feeder bulk exchange system! A mounter that achieves one of the fastest loading capabilities in the world.
We would like to introduce the YAMAHA manufactured mount 'Z:LEX YSM20R' handled by Masu Shoji. It adopts a new wide-scan camera with improved component compatibility, achieving a 5% speed increase compared to conventional devices, making it one of the fastest in the world. In addition, we have newly developed the ALF (Auto Loading Feeder) that innovates the replenishment of tape components without requiring skills, as well as optional features that improve line operating rates without stopping the machine. 【Features】 ■ Adoption of a new wide-scan camera with improved component compatibility ■ Optional features that enhance line operating rates without stopping the machine ■ Newly developed ALF that innovates the replenishment of tape components with skill-less operation ■ Non-stop pallet exchange ATS (Auto Tray Sequencer) "sATS30NS" ■ Non-stop feeder bulk exchange system *For more details, please refer to the related links or feel free to contact us.
Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.
We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.
Complete total support from development to design, assembly, and completion of electronic devices!
We would like to introduce our "Electronic Equipment Business." We provide complete total support from development to assembly and completion in various fields, including home appliances, industrial equipment, and medical health devices. Utilizing our unique prototype-focused manufacturing network, we aim for efficiency and cost reduction, not only domestically but also internationally. 【Features】 ■ Consulting for electronic equipment design and development ■ Shortening of design and development periods and lead times through comprehensive full support ■ Advanced CAD design using tools like Zuken CR8000 ■ Manufacturing of printed circuit boards from single-sided to 20 layers, as well as flexible circuit boards ■ High-density surface mounting of jumpers, axial, radial, and chip, IC, BGA, etc. *For more details, please feel free to contact us.
We have strengths in advanced technology for high multilayer and ultra-fine pitch developed for aerospace applications, and we respond to the needs for procuring advanced substrates overseas.
We would like to introduce our overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, and more. Our company is a PCB manufacturing company with a long track record of providing PCB solutions for major markets in high-speed telecom, networking, computing, ATE, mission-critical defense and aerospace (MIL-PRF-31032, AS9100), automotive, and medical sectors. 【Features】 ■ Global footprint (two locations in the U.S., four factories in Singapore and China) ■ Design for PCB layout, CAD, productivity improvement, and cost reduction ■ Complete NPI support ■ Material technology ■ Technical leadership (multilayer boards, HDI, etc.) 【We will be exhibiting at NEPCON Japan 2025!】 Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (Booth # E28-17) *Please register your visit via the link below and stop by our booth! (No waiting time)
KIBAN is a manufacturer that has shaped images with high flexibility. Solving development challenges, the "Master of Assurance" creates value beyond "safety."
【Features of Puriken】 ■ Product lineup: Supports various specifications from single-sided to high multilayer, through-hole, IVH, and build-up ■ Full support system: Full support from circuit board design to manufacturing and component mounting (coordinating optimal lead times) ■ Process tracking: Real-time tracking of circuit board manufacturing process progress (providing a convenient system to understand process progress) ■ Educational support: WEB factory tours via LIVE video (showing all equipment in the circuit board manufacturing process), also accommodating on-site seminars ◇ Examples of actual products Product applications: Power supply, measurement, motors, video, communication, audio, sensors, and others High-speed signal and high-frequency circuits: 4K and 8K video equipment, medical cameras, wireless devices, various antennas High current and high voltage: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment < Circuit Board Design > Supported CAD / In-house owned: CR-5000BD, CR-8000DF Design specifications: Digital, analog, mixed digital-analog, high-speed transmission, high current, high voltage, etc. < Circuit Board Manufacturing > Number of layers: Single-sided to 24 layers, fixture boards Specifications: Through-hole, pad-on-via, IVH, build-up, etc. * Many other product examples available! For more details, please download the materials or contact us.
Please let us assist you with support for each process, from deadline management and specification adjustments to full process support.
【Features of Puriken】 ■ Product lineup: Supports various specifications from single-sided to high multilayer, through-hole, IVH, and build-up ■ Full support system: Comprehensive support from circuit board design to manufacturing and component assembly (coordinating optimal lead times) ■ Process tracking: Real-time tracking of circuit board manufacturing process progress (providing a convenient system to understand process progress) ■ Educational support: WEB factory tours via LIVE video (showing all circuit board manufacturing process equipment), also accommodating on-site seminars ◇ Examples of actual products Product applications: Power supply, measurement, motors, video, communication, audio, sensors, and others High-speed signal and high-frequency circuits: 4K/8K video equipment, medical cameras, wireless devices, various antennas High current and high voltage: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment < Circuit Board Design > Supported CAD / In-house owned: CR-5000BD, CR-8000DF Design specifications: Digital, analog, mixed digital-analog, high-speed transmission, high current, high voltage, etc. < Circuit Board Manufacturing > Number of layers: Single-sided to 24 layers, fixture boards Specifications: Through-hole, pad-on-via, IVH, build-up, etc. * Many other product examples are available! For more details, please download the materials or contact us.
Is it still getting smaller? Trends in power electronics technology visible from the disassembly of the power control unit of the new Prius - Miniaturization technology 'busbar' and more.
We will hold a free webinar titled "Is it still getting smaller? Trends in power electronics technology revealed through the disassembly of the new Prius power control unit." In this webinar, we will provide insights into the challenges faced by power electronics engineers and potential solutions. Additionally, we will discuss trends in power electronics miniaturization technology, the effectiveness of front-loading development methods, and how Scideam reduces simulation time (developed by the Smart Energy Research Institute). We will also introduce the combination of printed circuit boards and busbars as a miniaturization technology for high-voltage and high-current printed circuit boards. [Webinar Overview] ■ Date and Time - Day 1: July 16 (Tuesday) 11:00-12:00 - Day 2: July 23 (Tuesday) 11:00-12:00 ■ Organized by - Ryosan Co., Ltd. *For more details, please refer to the related link URL below or feel free to contact us.
Announcement of Webinar / September 9 (Tuesday) 11:00 AM - 12:00 PM 【A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!!】
A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!! In cases where there are components or circuit configurations that may generate heat, and new or unknown factors necessitate heat countermeasures, delays or failures in design responses can occur due to a lack of experience in thermal design or the absence of analysis tools. This can lead to problems in actual devices and delays in development schedules. To conduct thermal analysis, tools are typically required, but many do not have the necessary resources, and hiring specialized firms can often be costly. In this webinar, we will introduce heat countermeasure techniques that can be implemented even when there is no time or budget for simulations. ■ Recommended for: - Engineers dealing with components or circuits where heat generation is a concern, such as power circuits, motor control, and LED boards. - AW designers ■ Date: Tuesday, September 9, 2025, 11:00 AM - 12:00 PM ■ Format: Webinar (using Zoom) ■ Organized by: Ryosan Corporation ■ Co-organized by: Priken Corporation ■ Participation Fee: Free *For more details, please refer to the related link URL below or feel free to contact us.
