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substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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substrate Product List

151～165 item / All 199 items

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Circuit board "Arm Frogs BLUE"

Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory

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TTL Exhibition Participation Guide: JPCAShow 2025

TTL Exhibition Participation Guide: JPCAShow 2025

Newly developed material.

◆FPC (Flexible Printed Circuit Board)◆ 　　　~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ 　　　　　FPC manufacturing requires multiple critical processing steps. 　　　　　Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. 　　　　　This time, we will introduce the "strengths" we have cultivated over many years in each process! 　　　　　<Design> Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Treatment> High precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High precision outline processing ±50μm, diverse tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ 　　　Proposals for utilizing FA and collaborative robots

  • 出展案内_JPCAshow2025.png
  • Printed Circuit Board

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[Exhibition Report] We exhibited at JPCAshow 2025!

[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots

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High-frequency fluororesin FPC substrate

High-frequency fluororesin FPC substrate

Effective in millimeter wave bands such as 5G communication! Products with low transmission loss, low dielectric constant, and high flexibility.

The "High-Frequency Fluororesin FPC Substrate" manufactured by Sumitomo Electric Industries enables low-loss data transmission of high-frequency signals ranging from 20GHz to 100GHz. As a type of flexible substrate, it allows for wiring in tight spaces, contributing to the miniaturization and lightweight design of devices. When used with millimeter-wave planar antennas, it can achieve either antenna miniaturization or enhanced performance per antenna size. 【Features】 ■ Low Transmission Loss: Can be utilized as a wiring material that achieves low transmission loss in high-frequency signal transmission. ■ Thinness and Narrow Pitch: Achieves both thinness and narrow pitch, while offering high design flexibility, contributing to airflow within enclosures and high-density designs. ■ Excellent Gain: By routing antenna circuits on a fluororesin substrate, it can be utilized as an antenna with efficient space usage and excellent gain. *For more details, please download the PDF or feel free to contact us.

  • 高周波用フッ素樹脂製FPC基板2.jpg
  • Printed Circuit Board

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We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

Anyway, it's fast! Leave the printed circuit boards to 【SHOWA】!

Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.

  • Printed Circuit Board

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Development Board Example: "High-Speed Optical Data Processing Board"

Development Board Example: "High-Speed Optical Data Processing Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Data Processing Board" samples large amounts of data from the upper layer at high speed and converts and transmits it into optical data according to requirements. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interface - Optical Input/Output SFP (3.125Gbps) × 3 channels - PCI Express Gen1 × 4 ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers

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Exhibiting at the Nepcon Autumn Show @ Makuhari Messe! Leave printed circuit boards to Matsuwa Sangyo!

Exhibiting at the Nepcon Autumn Show @ Makuhari Messe! Leave printed circuit boards to Matsuwa Sangyo!

We will be exhibiting at the Nepcon Japan Autumn Exhibition at Makuhari Messe from September 4 to 6! Please feel free to consult us about anything related to circuit boards!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory with a fully integrated process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Through-hole substrates ⇒ as short as 1.05 days! Through-hole resin-filled substrates ⇒ as short as 2.1 days! 1-2-1 build-up substrates ⇒ as short as 3 days! FPC substrates ⇒ as short as 2 days! 4-layer rigid FPC substrates ⇒ as short as 5 days! Surface treatment with gold flash is also handled in-house, so there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even for materials we have no processing experience with, we are flexible in our response! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate..." Why not start with a light consultation? We will be exhibiting at the Nepcon Japan Autumn Exhibition held at Makuhari Messe from September 4 (Wed) to September 6 (Fri)! On the day, members who can consult on technology will be gathered at our booth, so please stop by the Matsuwa Sangyo booth [6-37]! Pre-registration for your visit can be done here↓!

  • Printed Circuit Board

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Delivery record: Platform substrate

Delivery record: Platform substrate

Systematizing measurement and mechatronics! Introducing the delivery achievements of Applied Electric.

At Applied Electric, we specialize in non-standard small-lot production and are constantly handling and delivering a wide variety of products, numbering in the thousands. In response to customer requests, we develop and design controllers that serve as the core of inspection and control devices, using suitable CPUs and FPGAs. [Development Examples] ■ CPU: H8, SH-2, SH-2A, SH-3, SH-4, SH-4A, RX, i.MX3x, ARM, DSP ■ Communication: USB2.0, USB3.0, 1G/100/10baseT, RocketIO, MIPI ■ Bus: VME, CompactPCI, PCI, PCIExpress *For more details, please refer to the PDF materials or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Other inspection equipment and devices
  • Circuit board design and manufacturing

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Printed circuit board assembly fine pitch board

Printed circuit board assembly fine pitch board

We provide support for everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creative, Evolving, Developing Enterprises."

  • Circuit board design and manufacturing

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All LCP Flexible Printed Circuit Board (FPC)

All LCP Flexible Printed Circuit Board (FPC)

Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board

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Special substrate

Special substrate

The era is 【SPECIAL PCB!】

Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855

  • Circuit board design and manufacturing
  • EMS
  • Printed Circuit Board

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Flexible (FPC) substrate / Rigid-flex substrate

Flexible (FPC) substrate / Rigid-flex substrate

We also accept orders starting from one piece. For small quantities, we offer reasonable prices without using a die.

- It has thinness and flexibility, allowing it to be bent repeatedly for use, and it maintains its electrical characteristics even when deformed. - We also offer rigid-flex PCBs, flexible PCBs with resist specifications, and flexible PCBs that excel in noise countermeasures, so please feel free to contact us.

  • Printed Circuit Board

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Electronic device development

Electronic device development

We provide board development solutions.

We provide planning and development solutions for electronic device development through a comprehensive technical approach from both hardware and software. With our accumulated technology and the latest electronics technology, we respond to various requests in hardware development and help realize our customers' product visions.

  • Printed Circuit Board
  • EMS

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Foresight glass print wiring board

Foresight glass print wiring board

We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.

It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.

  • Touch Panel

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Evaluation of the "56G-PAM4 Board" implementation completed.

Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

  • Communications
  • Circuit board design and manufacturing

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