Suntech Corporation Business Introduction
We will cut the IC chips smaller, thinner, and process them with greater precision.
Suntech Co., Ltd. provides cutting (dicing) and grinding (thinning) processing technologies primarily for semiconductor silicon wafers. Additionally, these processing technologies are applied to various materials that are considered difficult to process, such as blue glass, ceramics, and solder sheets. We utilize technologies such as back grinding (grinding and polishing), dicing, chip tray technology, and visual inspection technology. Furthermore, Suntech's prototype technology support division offers clean rooms and processing equipment. For more details, please contact us or refer to our catalog.
- 企業:サンテック
- 価格:Other