Copper sulfate plating additive for semiconductor wafers - TORYZA LCN FRV
FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.
In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.
- 企業：奥野製薬工業 大阪・放出、東京、名古屋など
- 価格：Other
