Copper Plating Additives - メーカー・企業と製品の一覧

Copper sulfate plating additive for wafers - TORYZA LCN series

Newly developed copper sulfate plating chemicals for wiring of semiconductor wafers.

Okuno Pharmaceutical Industry has newly developed the "TORYZA LCN" series of copper sulfate plating additives, which are optimal for semiconductor wafer re-wiring and copper pillar formation. TORYZA LCN FRV is an electro-copper plating additive that excels in film thickness uniformity and is ideal for pattern formation in re-wiring. TORYZA LCN SP is an electro-copper plating additive that is optimal for forming copper posts and copper pillars on semiconductor wafers and package substrates. TORYZA LCN SV is best suited for micro bumps and trench filling for silicon interposers. TORYZA LCN SD is an electroplating additive for semiconductors that excels in the embedding of blind via holes and trenches. Okuno Pharmaceutical Industry offers numerous plating process proposals tailored to your needs for wafers.

企業：奥野製薬工業大阪・放出、東京、名古屋など
価格：Other

Chemicals

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High Reliability Granular Copper Plating Additive "Top Cluster AR"

Granular copper plating film for lead frames that contributes to improved adhesion strength with sealing resin.

Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion devices. In recent years, as high voltage and high current capabilities have advanced, there has been a growing need for packaging technologies with higher connection reliability. If the lead frame, which connects the semiconductor device and the circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive for plating granular copper that achieves high adhesion between the frame, coating, and mold resin.

企業：奥野製薬工業大阪・放出、東京、名古屋など
価格：Other

Chemicals

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Copper sulfate plating additive for wafers - TORYZA LCN series

Newly developed copper sulfate plating chemicals for wiring of semiconductor wafers.

As the functionality, performance, and miniaturization of semiconductors continue to evolve, new technologies related to three-dimensional integration of semiconductors are being developed one after another. Consequently, addressing the miniaturization of wiring (narrow pitch) and heat dissipation measures has become increasingly important. To meet various demands, our company has newly developed sulfuric acid copper plating chemicals, the TORYZA LCN series, for semiconductor wafer wiring.

企業：奥野製薬工業大阪・放出、東京、名古屋など
価格：Other

Chemicals

ブックマークに追加いたしました

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ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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Copper Plating Additives - メーカー・企業と製品の一覧

Copper Plating Additivesの製品一覧

Copper sulfate plating additive for wafers - TORYZA LCN series

High Reliability Granular Copper Plating Additive "Top Cluster AR"

Copper sulfate plating additive for wafers - TORYZA LCN series