Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 36 items
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
◆Bonding accuracy XY: ±40µm, Θ: ±3° 3σ ◆Inspection and detection of solder joint quality using DBI ◆Powerful setup wizard ◆Option to choose heater rail unit or adapter rail replacement
Ideal for bonding small pin ICs such as QFN.
◆Best TCO ~Small footprint, reduced changeover time~ ◆Best Quality ~Supports fast-drying paste~ ◆Wide lead frame compatibility ~Lead frame size: W102mm × L300mm~ ◆Equipped with newly developed twin dispense system ~Compatible with various pastes, stable coating performance~ ◆High precision small chip pickup ~Supports sizes from 0.15 to 8.0mm~
High-speed Die Bonder compatible with micro and thin chips!
We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.
Thoroughly manage the situation and take action based on the guidelines to "raise" it.
Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.
Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!
Die Bonder for Hoop Frame "DBD4200R" Compatible with small chips starting from 0.15mm. 【Specifications】 ■ Joining process: Eutectic/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bond accuracy (XY): +/-35μm ■ Bond accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Maximum width supported: Up to 78mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.25 seconds/chip (Eutectic), depending on various conditions ■ Transport method: Roller transport ■ External dimensions: 1,740x1,150x1,185mm ■ Weight: 1,000kg ■ Major options: Rotary bond head, uncoiler, cutter, wafer map, post-bond recognition, etc. *For more details, please refer to the catalog or feel free to contact us.
Tanzaku frame double-sided adhesive, compatible with both epoxy and DAF, suitable for fast-drying paste.
The "EBD4350S" die bonder for short strips is an epoxy die bonder compatible with fast-drying paste. 【Specifications】 ■ Joining process: Epoxy/DAF/dual-use machine specifications ■ Chip size: □0.15~3.0mm ■ Bond accuracy (XY): +/-35μm, +/-25μm (when using backside recognition) ■ Bond accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible workpieces: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches, disco ring or expand ring ■ Machine cycle time: 0.35 seconds/chip, depending on various conditions ■ Transport method: Gripper transport ■ External dimensions: 1,680x1,135x1,645mm ■ Weight: 1,300kg ■ Major options: Rotary bond head, backside recognition, up-down mechanism, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.
![[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.](https://image.mono.ipros.com/public/product/image/6f4/2000239395/IPROS03001692673784456856.png?w=280&h=280)
Bonding position accuracy of 0.5µm!
In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.
Multi-Wafer Handling Die Bonder (Auto)
The company's equipment is a die bonder that achieves high precision and high throughput for mass production.
Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.
Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.
Supporting the ever-evolving semiconductor applications!
We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.
