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High-speed semiconductor mask laser drawing device 'ULTRA'
"ULTRA" is a high-speed, high-resolution laser drawing device suitable for semiconductor mask creation. The "ULTRA" is a cost-effective mask drawing device equipped with high productivity, high precision, high uniformity, and ultra-high precision alignment accuracy.
High-speed high-resolution laser exposure device
The "DWL 2000 GS" is a flexible, high-speed, high-resolution laser drawing device suitable for grayscale lithography. Grayscale lithography is a technique that reproduces slope patterns, such as microlenses and blazed diffraction gratings, on a resist, differing from traditional binary lithography. The "DWL 2000 GS" series has a maximum drawing area of 200x200 mm² or 400x400 mm², enabling high-speed, high-precision patterning on masks and wafers for applications requiring MEMS, BioMEMS, Micro-Optics, ASIC, Micro Fluidics, sensors, holograms, and other fine structures. To enhance surface roughness accuracy in grayscale lithography applications, it supports 1000 levels of grayscale. 【Features】 ■ High stability and high-speed, high-resolution exposure ■ Up to five selectable drawing modes ■ High-precision alignment camera system ■ Grayscale drawing mode *For more details, please refer to the catalog or feel free to contact us.
High-speed pattern generator
The "VPG+ Series" is a high-speed exposure system that can accommodate large mask manufacturing, resist master creation, and direct drawing on various flat substrates due to its fast exposure speed. It can be utilized in fields that require semiconductors, displays, sensors, MEMS, advanced packaging, LED production, life sciences, and microfabrication. 【Features】 ■ High resolution ■ High image quality ■ High throughput ■ Ideal for high-speed photomask production ■ Capable of direct drawing on any flat substrate *For more details, please refer to the catalog or feel free to contact us.
A high-speed drawing device compatible with 300x300mm square substrates has been added to the VPG series.
- High precision and high-speed rendering - Maximum drawing area 300x300mm²
