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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Electron beam lithography equipment
  6. Laser drawing device "DWL 2000 GS" series

Laser drawing device "DWL 2000 GS" series

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DWL 2000 GS DWL 4000 GS

last updated:Apr 17, 2023

ハイデルベルグ・インストルメンツ
ハイデルベルグ・インストルメンツ
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High-speed high-resolution laser exposure device

The "DWL 2000 GS" is a flexible, high-speed, high-resolution laser drawing device suitable for grayscale lithography. Grayscale lithography is a technique that reproduces slope patterns, such as microlenses and blazed diffraction gratings, on a resist, differing from traditional binary lithography. The "DWL 2000 GS" series has a maximum drawing area of 200x200 mm² or 400x400 mm², enabling high-speed, high-precision patterning on masks and wafers for applications requiring MEMS, BioMEMS, Micro-Optics, ASIC, Micro Fluidics, sensors, holograms, and other fine structures. To enhance surface roughness accuracy in grayscale lithography applications, it supports 1000 levels of grayscale. 【Features】 ■ High stability and high-speed, high-resolution exposure ■ Up to five selectable drawing modes ■ High-precision alignment camera system ■ Grayscale drawing mode *For more details, please refer to the catalog or feel free to contact us.

    StepperElectron beam lithography equipmentOther semiconductor manufacturing equipment
2022-11-HIMT_DWLGS_840x740_150dpi_HighRes.jpg

Laser drawing device "DWL 2000 GS" series

2022-11-HIMT_DWLGS_840x740_150dpi_HighRes.jpg
2022-11-HIMT_DWLGS_840x740_150dpi_HighRes.jpg
  • Related Link - https://heidelberg-instruments.com/en/products/dwl…

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basic information

【Device Performance】 *When using binary drawing and selecting Write Mode 1 ■ Minimum Drawing Size [μm]: 0.5 ■ Minimum L&S [HP, μm]: 0.7 ■ Line Edge Roughness [3σ, nm]: 40 ■ CD Uniformity [3σ, nm]: 60 ■ Registration [3σ, nm]: 200 *For more details, please refer to the catalog or feel free to contact us.

Price range

P9

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Applications/Examples of results

【Applications】 ■ 2.5D grayscale exposure for thick film resist (micro lenses, Fresnel lenses, DOE, holographic printing, security applications, etc.) ■ Exposure to masks and wafers and other substrates ■ Patterning for semiconductors, sensors, MEMS, MOEMS, microchannels, waveguides, and all other applications requiring fine structures *For more details, please refer to the catalog or feel free to contact us.

catalog(4)

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High-precision laser drawing device 'DWL 2000 GS Series'

High-precision laser drawing device 'DWL 2000 GS Series'

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Laser Direct Writing System "DWL 66+"

Laser Direct Writing System "DWL 66+"

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High-speed laser drawing device "VPG+ Series"

High-speed laser drawing device "VPG+ Series"

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Maskless Aligner "MLA300"

Maskless Aligner "MLA300"

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Company information

ハイデルベルグ・インストルメンツ

ハイデルベルグ・インストルメンツ

Optical Instruments

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Heidelberg Instruments, Inc. is the Japanese subsidiary of Heidelberg Instruments Mikrotechnik, a German company that develops and manufactures laser direct writing systems and mask writing systems. We provide sales and technical services for laser direct writing systems within Japan. We offer a wide range of products, including laser writing systems and maskless aligners. For anything related to laser lithography, please feel free to consult with us.

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