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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Electron beam lithography equipment
  6. Laser Direct Writing Device "DWL 66+"

Laser Direct Writing Device "DWL 66+"

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last updated:Jul 06, 2022

ハイデルベルグ・インストルメンツ
ハイデルベルグ・インストルメンツ
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High-performance laser lithography equipment for research and development.

The "DWL 66+" is a high-resolution laser direct writing system suitable for research and development applications, small lot production, mask creation, and maskless exposure. It is equipped with the necessary functions for the fabrication and analysis of microstructures as a standard system. With high processing capability and a wide range of applications, it contributes to research and development in applications requiring microstructure fabrication, such as MEMS and micro-optics. 【Features】 ■ For maskless exposure and mask creation ■ 2.5D grayscale exposure mode (standard 128 levels, optional 255 levels or 1000 levels) ■ Versatile with rich features and expandability for multiple applications ■ Switchable up to six drawing modes (0.3um-4.0um) (pixel size) ■ High-precision alignment with backside alignment capability ■ Maximum substrate size supported is 9 inches x 9 inches ■ Compatible with various data formats *For more details, please refer to the catalog or feel free to contact us.

    StepperElectron beam lithography equipmentOther semiconductor manufacturing equipment
『DWL

Laser Direct Writing Device "DWL 66+"

『DWL 66+』.PNG
『DWL 66+』.PNG
  • Related Link - http://himt.de/index.php/dwl-66.html

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basic information

【Example of Drawing Mode】 ■Drawing Mode: HR (High Resolution Mode 0.3um) ■Minimum Address Grid (nm): 5 ■Minimum Drawing Size (μm): 0.3 ■Edge Roughness (3σ, nm): 50 ■CD Uniformity (3σ, nm): 60 ■Overlay Accuracy (3σ, nm): 500 *For more details, please refer to the catalog or feel free to contact us.

Price range

P8

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Applications/Examples of results

【Applications】 ■ Small lot mask creation ■ Maskless exposure, laser direct writing, laser direct drawing, 2.5D grayscale exposure ■ Patterning for semiconductors, FPD, sensors, MEMS, microchannels, micro-optics, waveguides, DOE, holograms, and other applications requiring microstructure fabrication *For more details, please refer to the catalog or feel free to contact us.

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Laser Direct Writing System "DWL 66+"

Laser Direct Writing System "DWL 66+"

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High-precision laser drawing device 'DWL 2000 GS Series'

High-precision laser drawing device 'DWL 2000 GS Series'

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Maskless Aligner "MLA150"

Maskless Aligner "MLA150"

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3D printer "MPO 100" using 2-photon polymerization.

3D printer "MPO 100" using 2-photon polymerization.

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Company information

ハイデルベルグ・インストルメンツ

ハイデルベルグ・インストルメンツ

Optical Instruments

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Heidelberg Instruments, Inc. is the Japanese subsidiary of Heidelberg Instruments Mikrotechnik, a German company that develops and manufactures laser direct writing systems and mask writing systems. We provide sales and technical services for laser direct writing systems within Japan. We offer a wide range of products, including laser writing systems and maskless aligners. For anything related to laser lithography, please feel free to consult with us.

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