JTAG Boundary Scan Test System
Streamlining debugging, implementation inspection, and defect analysis for boards equipped with BGA.
■ JTAG Boundary Scan Test - Debugging work efficiency is dramatically improved. - The area required for test pads can be reduced, allowing for miniaturization. - Electrical inspection and failure analysis of high-density mounted boards (with BGA) can be performed. ■ Benefits of Implementation - Inner layer signals of multilayer boards can be visualized. - The status of terminals on the backside of BGA can be visualized in real-time. - Terminals of FPGA and CPU can be manipulated freely. - There is no need to rewrite programs just to move I/O. - Physical contact with probes is not necessary. - Debugging can be done without software, so when problems occur, there is no need to verify whether the issue is with software or hardware. - Initial investments in fixtures and other equipment can be significantly reduced.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
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