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Plasma Processing Equipment - メーカー・企業10社の製品一覧とランキング

更新日: 集計期間:Jul 16, 2025~Aug 12, 2025
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Plasma Processing Equipmentのメーカー・企業ランキング

更新日: 集計期間:Jul 16, 2025~Aug 12, 2025
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  1. null/null
  2. 長野日本無線 Nagano//Energy
  3. 日立ハイテク Tokyo//Industrial Machinery
  4. 4 null/null
  5. 4 ジェイ・サイエンス・ラボ Kyoto//Testing, Analysis and Measurement 本社

Plasma Processing Equipmentの製品ランキング

更新日: 集計期間:Jul 16, 2025~Aug 12, 2025
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  1. Handheld Atmospheric Pressure Plasma Treatment Device "Piezo Brush PZ3"
  2. Atmospheric Pressure Plasma Treatment Device 'NJZ-2820' 長野日本無線
  3. Atmospheric pressure plasma treatment device for hydrophilization and functional group introduction under atmospheric pressure.
  4. 4 Atmospheric pressure plasma treatment device for powders ジェイ・サイエンス・ラボ 本社
  5. 5 Tabletop Vacuum Plasma Treatment Device 'SL-0600' ストレックス

Plasma Processing Equipmentの製品一覧

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表示件数

Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Processable substrate size 550×650 mm. Achieves zero waste liquid and low running costs.

The "PC-RIE series" can perform processing such as ashing, desmearing, surface modification, and F-type gas etching for medium-sized LCD substrates, printed circuit boards, and more. Customers can choose a version that suits their needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Vacuum plasma technology provides a better environment compared to conventional processing → Cleaning, no waste liquid ○ Low running costs ○ Usable substrate size: 550×650 mm For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment

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Vacuum device for plasma treatment for parallel plate evaluation

Widely used in fine anisotropic processing such as semiconductor, liquid crystal fine patterning, and DNA chip manufacturing.

You can choose a version that suits your needs, ranging from a manually operated research and development type chamber with atmospheric gates, transport mechanisms, and cassette stations to a fully automated system. We emphasize process reproducibility and standardly equip our systems with chillers for electrode temperature control and APC, and we can add turbo pumps compatible with high vacuum processes. 【Features】 ○ RIE plasma etching equipment ○ Capable of anisotropic etching of silicon wafers up to 6 inches and small square substrates ○ Equipment for 8 and 12 inches can also be designed For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment

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Plasma treatment device (multi-purpose plasma etcher)

Plasma processing device (multi-purpose plasma etcher)

This device is a multipurpose single-sheet plasma unit that is effective for etching polyimide-based resins, nitride films, ashing (ash removal) of photoresists, and surface modification, using parallel plate high-frequency plasma. It supports wafer sizes from 50 to 200 mm (2 to 8 inches) and is compatible with BGA, CSP, and other formats. The plasma mode can be switched between DP mode and RIE mode via the operation panel. Additionally, it allows for the retrofitting of a transport unit, making it ideal for experimental and research facilities.

  • Etching Equipment
  • Ashing device
  • Other processing machines

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Atmospheric Pressure Plasma Treatment Device 'NJZ-2820'

An atmospheric pressure plasma treatment device that enables stable plasma treatment at atmospheric pressure! The miniaturization of the device makes it easy to integrate into production lines!

The atmospheric pressure plasma treatment device "NJZ-2820" is an optimal device for integration into production lines and production equipment, thanks to its high-efficiency plasma head. It enables stable plasma treatment at atmospheric pressure and reduces running costs by plasma-activating compressed air. The miniaturization of the device also makes it easy to integrate into production lines. 【Features】 ■ Generates high-density plasma using 2.45GHz microwaves ■ Allows plasma generation only when needed with quick ignition ■ Achieves miniaturization and cost reduction of the device *Please consult us regarding low-temperature plasma (below 70°C) and thermal treatment plasma using oxygen. *For more details, please request documentation or view the PDF data available for download.

  • Plasma Generator
  • Plasma surface treatment equipment
  • High frequency/microwave parts

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Remote Atmospheric Pressure Plasma Treatment Device

Has numerous achievements in leading companies in Asia.

The plasma generation section and the processing section are completely separated. The processing is carried out using only radical components. ■ Processing Targets Modification of the target work surface (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target work surface 【Features】 ■ Reduces damage to the processed film due to chemical processing using only radicals without electron or ion attacks ■ Ideal for processing conductive films and glass after electrode formation ■ Various reaction gases can be used: CDA (Clean Dry Air), N2, O2, Ar, etc. For more details, please contact us.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Plasma Generator

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Inline plasma treatment device

High-speed, uniform, double-sided processing for pre-treatment before plating and for pre-treatment before adhering materials such as LCP and PTFE.

The "inline plasma treatment device" can be used for pre-treatment before attaching low transmission loss substrates for high-speed communication, as well as for removing residues from desmear and dry film. It also supports inline transport. <Product Features> 1. High speed and high uniformity for both sides 2. Compatible with automatic transport 3. Uniform cooling within the surface *For more details, please download the PDF or contact us.

  • Other semiconductors

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Batch-type plasma processing device

"High-speed, uniform, double-sided processing" for pre-treatment before plating and for pre-treatment before attaching low transmission loss substrates for high-speed communication.

The "batch-type plasma treatment device" can be used for pre-treatment before adhering materials such as LCP and PTFE, as well as for removing residues from desmear and dry films. It has a proven track record of over 200 units operating in mass production factories around the world. <Product Features> 1. High-speed, highly uniform double-sided treatment 2. Abundant track record 3. Uniform cooling within the surface *For more details, please download the PDF or contact us.

  • Other semiconductors

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Plasma treatment device for blow bottles

We can manufacture models tailored to processing capacity! Plasma treatment devices that do not cause bottle deformation due to heat.

This product is a plasma treatment device that improves surface properties by irradiating the bottle surface with arc plasma, enhancing wettability and improving printing and adhesion characteristics. Since it uses plasma irradiation, there is no deformation of the bottle due to heat, and models can be manufactured according to processing capacity. For more details, please feel free to contact us. 【Features】 ■ Enhances wettability and improves printing and adhesion characteristics ■ No bottle deformation due to heat because of plasma irradiation ■ Models can be manufactured according to processing capacity * For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements

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AETP Vacuum Plasma Treatment Device AVP Series

Are you looking for a surface treatment that does not use a primer? This vacuum plasma device is ideal for the surface activation of organic materials and the surface cleaning of inorganic materials.

A low-pressure plasma is generated in a vacuum chamber to modify the material surface. Our products operate at high excitation frequencies (GHz), resulting in a high concentration of ions in the plasma, which maximizes the treatment effect. By using not only compressed air but also process gases, various functions can be imparted to the material surface.

  • 企業:AETP Japan
  • 価格:1 million yen-5 million yen
  • Other processing machines

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No need to choose sample shapes, process freely! Barrel-type plasma treatment device.

Cleaning and modification of fine patterns and the inner surfaces of tube shapes are possible! Cleaning and modification can be done without using solutions, achieving good environmental performance and low running costs.

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oil (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical processing chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safe specifications suitable for mass production equipment For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment

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Atmospheric pressure plasma treatment device

Achieving contamination-free and clean plasma reforming.

<Features> ● Since plasma is generated inside a quartz glass tube, impurities such as particles do not fall onto the treated object, allowing for clean plasma treatment. ● The plasma generation unit has few consumable parts, and with regular maintenance, it can achieve a long lifespan of over 10,000 hours. ● Plasma treatment can be performed at atmospheric pressure, eliminating the need for a vacuum system and reducing capital investment. ● This device is divided into a plasma generation unit and a controller unit, allowing for easy integration of just the plasma generation unit into your existing or new equipment to build an inline system. ● It can perform pinpoint high-speed plasma treatment on targeted areas. ● It comes standard with input/output control functions for customer-side equipment, enabling control of plasma irradiation ON/OFF based on signals from the customer-side equipment.

  • Other semiconductor manufacturing equipment

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