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Reflow oven Product List and Ranking from 17 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Reflow oven Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 千住金属工業 Tokyo//Electronic Components and Semiconductors
  2. シンアペックス Nagano//Industrial Electrical Equipment
  3. 弘輝テック Saitama//Industrial Machinery
  4. 4 タイセー 本社 Chiba//Industrial Machinery
  5. 5 オリジン Saitama//equipment
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Reflow oven Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. N2 Reflow Furnace "SNR-GT II Series" 千住金属工業
  2. Senju Metal Industry Reflow Oven SNR-850MB 千住金属工業
  3. Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series" 弘輝テック
  4. Tabletop Conveyor Reflow Oven SVO-340C シンアペックス
  5. 5 Air flow furnace エイテックテクトロン

Reflow oven Product List

16～30 item / All 42 items

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Ultra-compact vacuum reflow furnace TRF-125V

Ultra-compact vacuum reflow furnace TRF-125V

Finally on sale! ~Ultra-compact vacuum reflow oven~

We are pleased to announce the launch of the vacuum reflow oven (TRF-125V) in our highly acclaimed reflow oven series! ■ Despite its reasonable price, this unit allows for reflow in a vacuum environment or using nitrogen gas! ■ With its ultra-lightweight and compact design, it is one of the smallest in the world, making it easy to install in labs! ■ High temperature control capability with PID control! ■ Many options available, including a manometer, magnifying glass, general-purpose regulator, gas cylinders (N2, CO2), vacuum pump, and more!

  • Reflow Equipment

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Ultra-compact vacuum reflow oven TR-125V2

Ultra-compact vacuum reflow oven TR-125V2

The definitive version of the ultra-compact vacuum reflow oven!!

We are excited to announce the launch of the ultra-compact vacuum reflow oven (TR-125V2) in our highly acclaimed ultra-compact reflow oven series! This ultra-compact vacuum reflow oven is perfect for those who want to introduce a reflow oven but are struggling with high prices or lack of space, as well as for those who already own a reflow oven but find it cumbersome and time-consuming to operate a large reflow oven.

  • Other semiconductors

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Fujino Trading Co., Ltd. Business Introduction

Fujino Trading Co., Ltd. Business Introduction

Total production of equipment made possible by a trading company.

Tsuneno Corporation focuses on the sale of FA-related equipment and has established overseas bases to expand its global presence, enabling it to handle hundreds of thousands of products. Specific products we handle range from soldering-related devices and labor-saving equipment to control system devices and large-scale automatic assembly equipment. 【Features】 ■ High proposal capability ■ Utilization of networks ■ Global expansion ■ Manufacturing consolidated with related/cooperating factories ■ Product strength capable of handling hundreds of thousands of items ■ Joint development with partner companies *For more details, please download the PDF or feel free to contact us.

  • Machinery and equipment installation/dismantling/relocation
  • Calibration and repair

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Point soldering device "ZEVA m type"

Point soldering device "ZEVA m type"

A point soldering device that inherits the achievements of selective nozzles 6745 and 6746!

The "ZEVAｍ type" is a point soldering device that allows soldering with two types of nozzles by adding a solder pot as an option. It is a product that inherits the achievements of the selective nozzles 6745 and 6746. 【Product Dimensions】 ■ Length: 2,370mm ■ Width: 1,285mm ■ Height (without light tower): 1,220mm *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment

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Vacuum Solder Reflow Oven HVR Series

Vacuum Solder Reflow Oven HVR Series

This is an inline vacuum solder reflow furnace compatible with voidless flux-free technology.

Recently, with the evolution of power semiconductors and advanced packaging, high-quality solder joints are in demand. Therefore, void (bubble) suppression and flux-free solder reflow have become essential. The HVR series can reduce the void rate to less than 1% by evacuating the chamber, allowing voids to escape from the molten solder. Additionally, by using formic acid as a reducing gas, it supports flux-free soldering. A feature of the HVR series is that the solder reflow process (reduction, solder melting, cooling) is continuously processed in a single chamber, and product transport is fully automated by robots. This concept enables inline product input and retrieval, improving productivity by connecting units. We have a demonstration unit available, so if you would like to see the actual machine or request a solder joint demonstration, please feel free to contact us.

  • Soldering Equipment

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Formic Acid Reduction Vacuum Reflow Furnace / Batch Type 'Model: SQ1'

Formic Acid Reduction Vacuum Reflow Furnace / Batch Type 'Model: SQ1'

Equipped with our unique decomposition processing unit! Completely neutralizes formic acid in exhaust.

The "Model: SQ1" is a compact batch-type formic acid reduction vacuum reflow furnace equipped with a heating and cooling mechanism in a single chamber, suitable for research and development as well as small-scale production. The formic acid reduction process eliminates the need for flux and flux cleaning in subsequent processes. Additionally, it allows for the use of a vacuum process effective in reducing voids. Since there is no need to transfer formic acid to a dedicated tank, customers can use the bottles or tanks they have prepared as is. 【Features】 ■ Equipped with our unique gas generator, achieving instantaneous vaporization ■ Incorporates our proprietary heating and cooling mechanism that combines radiation heating with IR heaters and forced water cooling with water-cooled plates ■ Contributes to shortening the reflow process from heating to cooling ■ No need to transfer formic acid to a dedicated tank ■ Equipped with our unique decomposition treatment unit, completely neutralizing formic acid in the exhaust *For more details, please refer to the related links or feel free to contact us.

  • Reflow Equipment

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Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series'

Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series'

No need to transfer formic acid to a dedicated tank! You can use the bottles or tanks prepared by the customer as they are.

The MPX series is a vacuum reflow furnace suitable for mass production, capable of installing multiple independent chamber modules that integrate heating and cooling. Thanks to the formic acid reduction process, there is no need for flux or flux cleaning in subsequent processes. Additionally, it is possible to utilize a vacuum process that is effective in reducing voids. It features our unique heating and cooling mechanism that combines radiation heating from IR heaters with forced water cooling from water-cooled plates. 【Features】 - Equipped with our proprietary gas generator, achieving instantaneous vaporization. - Incorporates our unique heating and cooling mechanism that combines radiation heating from IR heaters with forced water cooling from water-cooled plates. - Contributes to the reduction of the reflow process from heating to cooling. - No need to transfer formic acid to a dedicated tank. - Equipped with our unique decomposition processing unit, completely neutralizing formic acid in the exhaust. *For more details, please refer to the related links or feel free to contact us.

  • Reflow Equipment

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Tabletop Conveyor Reflow Oven SVO-340C

Tabletop Conveyor Reflow Oven SVO-340C

Compact tabletop conveyor reflow oven compatible with heating up to 400℃.

This is a space-saving tabletop reflow oven (heating furnace) using infrared heaters. It can be used not only for reflow soldering but also for low-speed operation at a constant temperature, making it suitable for applications such as drying circuit boards and thermosetting bonding agents.

  • Heating device

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Tabletop reflow oven (heating furnace) SVO-1

Tabletop reflow oven (heating furnace) SVO-1

Tabletop reflow furnace (heating furnace) compatible with heating up to 400℃.

This is a tabletop heating furnace capable of heating printed circuit boards and flat workpieces up to 250x330mm as standard. The heating temperature profile can be set for up to 8 zones. It can be used not only for reflow soldering but also for long-term operation at a constant temperature, making it suitable for applications such as drying circuit boards, thermal curing of underfill materials, and die bonding pastes.

  • Reflow Equipment

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Vacuum and Pressure Reflow Furnace 'VPF300'

Vacuum and Pressure Reflow Furnace 'VPF300'

With technical data included, significantly reduces void ratio under a maximum pressure of 0.4 MPa. Improves process efficiency with rapid cooling. Compatible with fluxless soldering.

The VPF300 is a vacuum and pressure reflow oven that not only creates a vacuum (reduced pressure) inside the chamber but can also apply pressure up to 0.4 MPa, significantly reducing the void rate inside the solder and achieving high-quality soldering. Process conditions such as chamber pressure and heating temperature can be set for each workpiece, and efficient heating and cooling are possible thanks to its unique rapid cooling function. Additionally, it supports formic acid reduction reflow and forming gas reflow, allowing for the establishment of a flux-free soldering process. The 2023 model has improved the cooling mechanism, enhancing maintainability. 【Features】 ■ A wide effective heating area of 300×300 mm ■ Maximum heating temperature of 450℃ ■ The vacuum chamber is equipped with an observation window ■ Features an intuitive touch panel GUI for easy operation *Product documentation can be viewed via "PDF Download." Please feel free to contact us if you wish to request a test.

  • Reflow Equipment
  • Soldering Equipment

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N2 Reflow Device VFR-4010N

N2 Reflow Device VFR-4010N

Achieve easy maintenance with a special filter! You can switch between hot air, warm air, and warm air + far infrared!

The "N2 Reflow Device VFR-4010N" is a unit that combines a unique heating method using a special far-infrared panel heater along with hot air circulation. Depending on the substrate (thickness) and mounted components, it is possible to utilize not only hot air circulation but also the advantages of far-infrared effects for production. This device is designed with consideration for substrates and components. 【Features】 ■ Hot air circulation reflow oven with far-infrared combination ■ Adoption of special far-infrared panel heater ■ Minimizes flux accumulation in the oven, extending maintenance intervals ■ Special filter for mist recovery in the oven (can be reused after cleaning) ■ Energy-saving through reduced heat loss with high-efficiency insulation structure *For more details, please refer to the PDF materials or feel free to contact us.

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  • Reflow Equipment

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Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series"

Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series"

Decomposing flux with a special far-infrared panel heater to prevent sticking inside the furnace!

The "VFR Series" is a reflow oven that utilizes a special far-infrared panel heater and hot air circulation system. It minimizes flux adhesion inside the oven, achieving extended maintenance periods. It also allows for mist recovery with a special filter (the filter can be reused after cleaning). Please feel free to contact us when you need assistance. 【Features】 ■ Special far-infrared panel heater and hot air circulation system ■ Minimizes flux adhesion inside the oven, extending maintenance periods ■ Mist recovery with a special filter (the filter can be reused after cleaning) *For more details, please refer to the PDF document or feel free to contact us.

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  • Reflow Equipment

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【Ultra Low Price】Lead-Free Profile Compatible 'Compact Tabletop Reflow Oven'

【Ultra Low Price】Lead-Free Profile Compatible 'Compact Tabletop Reflow Oven'

Responding to the demand to significantly reduce costs for non-production uses such as research and development, experiments, and evaluations! A conveyor-type tabletop reflow oven equipped with the minimum necessary functions.

Achieving ultra-low prices! We have started selling the 'Compact Tabletop Reflow Oven' equipped with essential functions, featuring a 3-zone heating system and a 250mm wide mesh conveyor. 【Features】 ■ Compatible with general lead-free profiles as well as uniform heating profiles ■ Suitable for non-production environments such as research and development, experiments, prototypes, and evaluations ■ Customization options available upon inquiry Feel free to contact us for pricing, delivery times, profile measurements, on-site visits, and demonstrations. * We are also looking for new applications for the heating furnace. * For more details, please refer to the PDF document or contact us directly.

  • Other mounting machines

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Kiyoshi Metal Industry Clean Reflow Furnace CX-430

Kiyoshi Metal Industry Clean Reflow Furnace CX-430

Reflow furnace compatible with semiconductor clean rooms

This is the latest reflow furnace for micro soldering that enables wafer-level solder bump formation and face-down mounting of bare chips.

  • Other semiconductor manufacturing equipment

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Air flow furnace

Air flow furnace

Air flow furnace

Next-generation flow device. Achieving evolving high performance with energy savings and low cost. Developed with a target of reducing carbon dioxide by over 50% to prevent global warming, this is the long-awaited "revolutionary air flow furnace" that completely redefines conventional concepts. 【Features】 Ultra energy-saving system ● A groundbreaking low power consumption performance that is half of the conventional power consumption. ● Achieved a production power setting of 4.5 kW with a nozzle height of 20 mm. Insulation structure that does not affect factory air conditioning ● Adopts polyimide film for the outer case, keeping the cover temperature almost the same as the factory room temperature. Nozzle height adjustment mechanism ● Automatically changes the nozzle height to prevent energy loss. Quick temperature setting changes ● Allows for quick setup changes in a short time. Low running costs + low environmental impact ● Electricity cost reduction: 533,000 yen/unit per year + α (air conditioning costs, etc.) ● CO2 reduction: 8.2 tons/unit per year □ For more details, please contact us.

  • Reflow Equipment
  • Circuit board processing machine

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