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Reflow oven Product List and Ranking from 17 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Reflow oven Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 千住金属工業 Tokyo//Electronic Components and Semiconductors
  2. シンアペックス Nagano//Industrial Electrical Equipment
  3. 弘輝テック Saitama//Industrial Machinery
  4. 4 タイセー 本社 Chiba//Industrial Machinery
  5. 5 オリジン Saitama//equipment
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Reflow oven Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. N2 Reflow Furnace "SNR-GT II Series" 千住金属工業
  2. Senju Metal Industry Reflow Oven SNR-850MB 千住金属工業
  3. Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series" 弘輝テック
  4. Tabletop Conveyor Reflow Oven SVO-340C シンアペックス
  5. 5 Air flow furnace エイテックテクトロン

Reflow oven Product List

31～42 item / All 42 items

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Tabletop Vacuum Solder Reflow Device 'VSS-450-300'

Tabletop Vacuum Solder Reflow Device 'VSS-450-300'

Implementation without flux is possible through formic acid reduction. There is the advantage of not having to worry about future risks associated with the use of flux.

The main point of this device is that it enables flux-free implementation through formic acid reduction. Since flux is not used at all, there are advantages such as "no need for cleaning processes and their inspection processes" and "no need to worry about flux residues and re-corrosion caused by residues." Additionally, since flux is also a factor for voids, and formic acid weakens the surface tension of solder, it improves the removal of voids and contributes to being void-free. Furthermore, unlike conventional hydrogen reduction, formic acid reduction has a lower starting temperature for the reduction reaction than hydrogen, allowing for the removal of oxide films from substrates and electronic components without causing thermal damage.

  • Reflow Equipment

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200

A super high-speed heating model capable of a maximum heating rate of 600 K/min, suitable for metal sintering. Manufactured by Unitemp Japan.

The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment

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Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S

Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S

Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.

The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment

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Solder Reflow Device "RSO-300/200"

Solder Reflow Device "RSO-300/200"

Supports both formic acid gas and hydrogen gas reduction! Achieves lead-free, voidless, and flux-free!

The "RSO-300/200" is a multifunctional solder reflow device that can handle various reflow processes such as atmospheric, nitrogen, vacuum, formic acid, and hydrogen with a single unit, equipped with a touch panel. By equipping the bottom of the hot plate with a cross arrangement of 12 vertical and 12 horizontal high-speed infrared (IR) heaters, it achieves stable heating and rapid temperature rise that is less affected by the heat capacity of the target object. In addition to standard reflow, it is also suitable for sintering metal nanopaste and other materials. 【Features】 ■ High-purity quartz chamber: Optional ■ Cross arrangement: Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Cooling by nitrogen purge ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Solder Reflow Device "RSS-110"

Solder Reflow Device "RSS-110"

Compatible with 100V power supply! A compact model that is among the smallest in the industry, compatible with Φ4 inch and 100mm square!

The "RSS-110" is a solder reflow device that achieves lead-free, void-free, and flux-free soldering. Equipped with a multifunctional touch panel, it can handle various reflow processes such as air, nitrogen, vacuum, formic acid, and hydrogen with a single unit. The device dimensions are 260×420×220mm (W×D×H), and the weight is approximately 10kg. 【Standard Hardware Specifications (Partial)】 ■ Effective object size (W×D×H): 105mm×105mm×35mm ■ Maximum reachable temperature: 400℃ ■ Maximum heating rate: 120K/min (2K/sec) ■ Heating method: Cartridge heater ■ Maximum cooling rate: 180K/min (T=400℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Solder Reflow Device "RSS-160"

Solder Reflow Device "RSS-160"

Dual support for formic acid gas and hydrogen gas reduction! A multifunctional solder reflow device equipped with a touch panel!

The "RSS-160" is a solder reflow device capable of heating at a rate of 100K/min using a cartridge heater. It supports Φ6 inch and 150mm square sizes, achieving lead-free, voidless, and fluxless soldering. It can handle various reflow environments including atmosphere, nitrogen, vacuum, formic acid, and hydrogen with a single unit. 【Standard Hardware Specifications (Partial)】 ■ Effective object size (W×D×H): 155mm×155mm×35mm ■ Maximum reachable temperature: 400℃ ■ Maximum heating rate: 100K/min (approximately 1.7K/sec) ■ Heating method: Cartridge heater ■ Maximum cooling rate: 100K/min (T=400℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Formic Acid Reduction Reflux Device [Case Study: Flux Residue]

Formic Acid Reduction Reflux Device [Case Study: Flux Residue]

Solve it with the Unitemp reflow device! Reducing gas works by reacting with the oxygen on the metal surface to restore it to its original state without an oxide film!

Until now, we have been using flux to remove the oxide film, but if it remains on the substrate (flux residue), it eventually corrodes and causes failures such as loss of electrical conductivity and soldered components detaching. Recently, as structures have become more complex, there has been a concern about whether the cleaning solution reaches all areas, making it impossible to eliminate the risk of flux residue. Our company supports solder reflow using a "reduction method" with formic acid and hydrogen. This allows for the removal of the oxide film without using flux, thus preventing flux residue and, of course, eliminating the need for a cleaning process. [Case Summary] ■Issue - Flux was used, but if it remains on the substrate (flux residue), it causes failures. ■Solution - Ensured solder wettability without using flux through reduction method reflow. - Choosing formic acid reduction allows for easy equipment and running costs, achieving flux-free and cleaning-free solder reflow. *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Ultra-compact vacuum high-power reflow furnace (TR-125VH3)

Ultra-compact vacuum high-power reflow furnace (TR-125VH3)

Introducing the ultra-compact vacuum high-power reflow furnace (TR-125VH3) in the world's smallest class of reflow furnace series!

The ultra-compact vacuum high-power reflow furnace (TR-125VH3) from Taisei Corporation has a heating speed that is three times faster than our conventional models! (21℃/min) By combining it with a cooling reflow plate, cooling performance is improved! It prevents oxidation in a vacuum or nitrogen atmosphere, allowing for high-quality soldering, and due to low-temperature heating, it prevents deterioration and distortion of components. It eliminates the need for flux and cleaning agents, leading to cost reduction and lower environmental impact. This is an essential machine for researchers and developers pursuing cutting-edge technology, enhancing development quality and speeding up development processes.

  • Other semiconductors

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Centrosarm Vacuum Solder Reflow Oven

Centrosarm Vacuum Solder Reflow Oven

This is a batch-type vacuum reflow furnace compatible with voidless and fluxless reflow. We offer a variety of lineups that support everything from development to mass production.

In conventional atmospheric reflow, there are approximately 20% void areas remaining in the solder, which leads to a deterioration in joint strength. The batch-type vacuum reflow furnace "c.VACUNITE series" from Centrolsam (Germany) can reduce the void areas to less than 2% by using vacuum. Additionally, it can accommodate fluxless reflow by using 100% hydrogen or reducing effect gases such as formic acid. As an option, it also supports plasma cleaning of the bonding surface using MW plasma.

  • Reflow Equipment

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Formic acid reduction vacuum reflow furnace

Formic acid reduction vacuum reflow furnace

Formic acid molecules approach the work surface and actively remove (reduce) the oxide film.

We would like to introduce our "Flux-less Vacuum Reflow." Instead of flux, formic gas removes the oxide film on the metal surface, eliminating the need for flux cleaning in subsequent processes. (When using solder foil, dedicated paste, etc.) Additionally, by utilizing vacuum and re-pressurization, it effectively reduces solder splash and voids. 【Features】 ■ Direct vaporization of formic acid - High-speed vaporization (4g/sec) - No carrier gas required ■ High-speed heating through radiant heat - Maximum temperature: over 400℃ - High heating efficiency due to radiant heat *For more details, please download the PDF or feel free to contact us.

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  • Reflow Equipment

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Used equipment sales

Used equipment sales

We provide support even after the sale! Delivering "trusted used implementation equipment" nationwide.

Since our founding, we have not only played a role in the distribution of used implementation equipment but have also established ourselves as a technical group that engages in purchasing, refurbishing, and maintenance. Rather than delivering used machines in their original condition, we perform cleaning, maintenance, and installation in-house, and we have gained the trust of our customers by providing after-sales support. If you are looking for specific equipment, please do not hesitate to contact us. 【Equipment We Handle】 ■ Mounter ■ Printing Machine ■ Inspection Machine ■ Reflow Oven ■ Insertion Machine ■ Fluxer/Solder Bath ■ Peripheral Equipment *We can also search for equipment that is not in our inventory, so please include the manufacturer, model name, flow standards, and any other confirmation details in the inquiry form linked below. *Please understand that some models may not be eligible for maintenance. *For more details, please refer to the PDF document or feel free to contact us. (Website for used equipment: Updated May 2022)

  • Other mounting machines
  • Used goods purchase
  • Sales Management

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