Semiconductor Manufacturing Equipment Product List and Ranking from 60 Manufacturers, Suppliers and Companies

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Semiconductor Manufacturing Equipment Manufacturer, Suppliers and Company Rankings

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

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ワイ・デー・ケー Tokyo//Manufacturing and processing contract
エヌ.エフ.ティ Fukuoka//Manufacturing and processing contract
4 タカキ製作所本社/本社工場 Oita//Manufacturing and processing contract
5 日精本社 Tokyo//Machine elements and parts

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Semiconductor Manufacturing Equipment Product ranking

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Standard models of nano-precision positioning stages, four types.
Integrated system from design to manufacturing and inspection: "Equipment Design" ワイ・デー・ケー
Assembly of various production and inspection equipment "Equipment Assembly" ワイ・デー・ケー
4 Nippon Seiki Co., Ltd. Materials Department "Business Introduction" 日精本社
4 MURONE Corporation Business Introduction MURONE 本社

Semiconductor Manufacturing Equipment Product List

16～30 item / All 94 items

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[Achievements Introduction] Semiconductor and LCD Related

We handle everything from development to production! We have experience in machine design for wafer bonding equipment and plasma etching equipment.

We would like to introduce our achievements in the design of machinery related to semiconductors and LCDs. We have numerous design accomplishments, including "wafer bonding equipment," "plasma etching equipment," "thickness measurement equipment," and "loaders/unloaders." We also have items that cover everything from development to manufacturing, so please feel free to contact us for more details. 【Achievements (Partial)】 ■ Wafer bonding equipment ■ Wafer transport equipment ■ Wafer packaging and unpacking equipment ■ Wafer thickness measurement equipment ■ Plasma etching equipment ■ Laminators, mountaineers *For more details, please refer to the related links or feel free to contact us.

Company：ケーイーエス
Price：Other

Mechanical Design

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Ultra-Precision Machining Examples (IC Package)

Uniform discharge without unevenness, surface roughness Ra ±0.2μ, minimum achievable surface roughness Ra 0.2μ, high-precision discharge machining within ±2μ.

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, that designs and manufactures semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a track record of deliveries in 11 countries, primarily in Japan and Southeast/East Asia, and we provide a wide range of services with advanced technology based on our experience in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units Electrical discharge machines - 26 units Wire electrical discharge machines - 8 units Small hole electrical discharge machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *Additionally, we have various measuring instruments, inspection equipment, pressure testing presses, and jigs available. Please feel free to contact us.

Company：エヌ.エフ.ティ
Price：Other

Mold Design
Other semiconductor manufacturing equipment

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[Case Study on Problem Solving] Mold Edition: Achieving Test Shots in Thailand

On-site inspection at our factory in Thailand is possible! There are also benefits in terms of reducing transportation costs and shortening construction time.

We would like to introduce a case where our company solved the challenge faced by a client who wanted to conduct trial runs domestically in Thailand without shipping molds overseas. There were no mold manufacturers in Thailand conducting trial runs for overhaul molds; all were sent to the manufacturing country, incurring time and costs. At our factory in Thailand (NI Thailand), we can perform trial pressure tests, allowing for local engineers to oversee the process within Thailand. This also contributes to the skill enhancement of the client's local representatives, and by not shipping molds overseas, we can reduce transportation costs and shorten construction periods. [Case Study] ■ Challenge: Wanting to conduct trial runs domestically in Thailand without shipping molds overseas ■ Solution: Introduced trial pressure presses at the NFT Thailand factory, enabling local support *For more details, please refer to the external link page or feel free to contact us.

Company：エヌ.エフ.ティ
Price：Other

Other contract services
Other molds

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[Case Study for Problem Solving] Mold Edition: Improvement of Resin Bleeding in the Lead Section

Changed the grinding direction of the parting surface to the short side! We were able to successfully reduce the bleeding.

We had a challenge with poor plating caused by resin bleeding into the lead section. Here, we would like to introduce a case where our company provided a solution. Although the frame was changed, there was no improvement, and we were struggling to find a solution through mold modifications. In this case, while the usual polishing direction of the parting surface is longitudinal, we changed the polishing direction of the parting surface to the transverse direction (perpendicular to the L/F rolling direction) as a countermeasure against base resin bleeding occurring in the L/F substrate rolling roll. As a result, we were able to successfully reduce the bleeding. [Case Study] ■ Issue: Poor plating due to resin bleeding into the lead section ■ Solution: Improvement through polishing of the parting surface *For more details, please refer to the external link page or feel free to contact us.

Company：エヌ.エフ.ティ
Price：Other

Other contract services
Other molds

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[Case Study of Problem Solving] Mold Edition: Measures Against Resin Leakage - Fine Groove Processing

We successfully carved fine grooves in an area 0.5mm wide to stop resin leakage.

We would like to introduce a case where our company solved the issue of resin leakage in slit-type packages for a client. The resin leakage was affecting the substrate ball pad area, resulting in poor yield and causing difficulties. By utilizing NFT design and polishing technology, we successfully stopped the resin leakage by creating two fine grooves in an area of 0.5mm width. [Case Study] ■ Issue: Continuous resin leakage in slit-type packages ■ Solution: Carving multiple fine grooves horizontally on the package to stop the leakage *For more details, please refer to the external link page or feel free to contact us.

Company：エヌ.エフ.ティ
Price：Other

Other contract services
Other molds

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[Case Studies for Problem Solving] Equipment Edition: Troubleshooting Existing Equipment

In the event of a problem, we will check the equipment on-site and hold meetings! We will assist in resolving the issue.

We would like to introduce a case where our company resolved issues with aging existing equipment. We were facing difficulties in resolving equipment troubles due to reasons such as the original manufacturer being unable to respond or the manufacturer no longer existing. Therefore, since our company has a wealth of experience in manufacturing and repairing parts for equipment from other companies, we were able to assist in resolving the issues. When problems arise, we also conduct on-site equipment checks and meetings. 【Case Study】 ■ Issues - Troubles with aging existing equipment - The original manufacturer is unable to respond, or the manufacturer has gone out of business ■ Solutions - We have extensive experience in manufacturing and repairing parts for equipment from other companies, allowing us to assist in resolving issues - When problems occur, we conduct on-site equipment checks and meetings *For more details, please refer to the external link page or feel free to contact us.

Company：エヌ.エフ.ティ
Price：Other

Calibration and repair

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Techno Takano Co., Ltd. Business Introduction

A group of engineers providing consistent service from assembly to delivery.

At Techno Takunobu Co., Ltd., we assemble semiconductor manufacturing equipment and FA devices. 【Assembly and Adjustment Work in Clean Room】 ■ Semiconductor and LCD-related equipment Our factory: Equipment assembly, electrical work, adjustment, inspection, equipment cleaning and packaging, direct shipping Customer factory: Delivery, Set-Up, adjustment, start-up ■ General industrial equipment (FA equipment, packaging machines, medical devices) Our factory: Assembly, electrical work, adjustment, inspection, packaging, shipping Customer factory: Assembly, delivery, Set-Up, modification, maintenance *For more details, please contact us or download the catalog.

Company：高布滋賀支店
Price：Other

Other services
others

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Integrated system from design to manufacturing and inspection: "Equipment Design"

We provide design technology that complies with various standards such as semi/UL CSA/CE.

We respond to our customers' needs through a consistent system that covers specifications meetings, detailed design, precision parts processing, equipment assembly, and equipment inspection. We are also utilized as a base for new development and prototype production for fabless companies. ■ Areas of Expertise 　◇ Industrial equipment centered around semiconductor manufacturing equipment that requires high reliability 　◇ Production equipment that plays an active role in our customers' production lines 　◇ Control equipment and analytical instruments used in the medical field 　◇ Financial terminal equipment used in financial institutions

Company：ワイ・デー・ケー
Price：Other

Contract manufacturing
Processing Contract
Mechanical Design

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Assembly of various production and inspection equipment "Equipment Assembly"

Manufacturing of semiconductor, LCD manufacturing equipment, inspection equipment units, equipment manufacturing, and conveyor robot manufacturing.

We respond to our customers' needs through a consistent system that encompasses specification meetings, detailed design, precision parts processing, equipment assembly, and equipment inspection. We are also utilized as a base for new development and prototype production for fabless companies. ■ Areas of Expertise ◇ Equipment industry centered around semiconductor manufacturing equipment that requires high reliability ◇ Production equipment that operates on customers' production lines ◇ Control equipment and analytical instruments used in the medical field ◇ Financial terminal equipment used in financial institutions

Company：ワイ・デー・ケー
Price：Other

Contract manufacturing
Processing Contract
Mechanical Design

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[Process Report Presentation] Joining Method Using Eutectic Reaction

What is a reliable eutectic bonding?

Texus Corporation inherits the die bonding technology of Nidec Tosok Corporation and is implementing automation of semiconductor manufacturing equipment, starting with die bonding, based on that technology. [Content] - Bonding using eutectic reaction in the die bonding process For more details, please download the materials and contact us.

Company：テクサス
Price：Other

Other mounting machines
Printed Circuit Board

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Asahi Kogyo Co., Ltd. Business Introduction

From manufacturing equipment to plant construction. Evolving with the times and challenging new fields!

Asahi Kogyo Co., Ltd. engages in a wide range of businesses including production systems for automobiles, industrialized housing, and electronics (LCD, organic EL (OLED), solar cells, etc.), various automation systems such as robotic systems, construction maintenance of industrial machinery and chemical plants, and the construction of solar power plants. By building cooperative relationships both domestically and internationally, we have established a supply system for low-cost, high-quality materials and processed products. We will continue to advance the development of new manufacturing equipment in various fields. 【Business Activities】 ○ Flat panel display, solar cell, and semiconductor manufacturing equipment ○ Various automation systems ○ Various industrial machinery ○ Equipment manufacturing, piping, installation, electrical and instrumentation work, and maintenance of rotating machinery for various plants ○ Construction and maintenance of power generation facilities and power supply equipment such as solar power plants ○ Design, manufacturing, installation of the above equipment, and associated civil engineering work For more details, please contact us or download the catalog.

Company：アラインテック機械システム事業部　営業部
Price：Other

Other industrial robots

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Parts manufacturing for construction machinery, forklifts, industrial machinery, and semiconductor manufacturing equipment.

Factory tours available! Achieving high quality at low cost! We are confident in our equipment. We provide total production from materials to assembly. Please feel free to consult with us.

NAGATSU Industrial Co., Ltd. / NAGATSU Manufacturing Co., Ltd. High-quality "manufacturing" is born from precision equipment and systems. At NAGATSU, we actively introduce a variety of equipment and computers. We have established a consistent system from parts to assembly and inspection, achieving quality improvement and stable supply on the production line through a thorough on-site approach. We also welcome factory tours, which have received positive feedback from our visitors. 【Features】 - Diverse machining technologies * Please also take a look at our equipment materials. - Total production from materials to assembly - Promoting advanced "manufacturing" by utilizing ICT (Information and Communication Technology) - Global production system 【Products Handled】 - Small lot and diverse products - Construction machinery parts - Industrial vehicle parts - Machine tool parts - Lifting equipment parts - Welded products We supply parts across a wide range of fields, from construction machinery to industrial machinery and semiconductor manufacturing equipment. ◯ For more details, please contact us or refer to our catalog.

Company：長津製作所美豆工場
Price：Other

Contract manufacturing

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[Case Study] Major Semiconductor Manufacturing Company

Place a bulk order for semiconductor in-house production equipment to our company, utilizing VA proposals and overseas factory production! Achieve significant cost reduction.

We would like to introduce a case study where we solved a challenge from the production technology department of a major semiconductor manufacturing company. The company had been relying on an existing equipment manufacturer for their semiconductor manufacturing equipment, specifically IC chip handler devices. However, due to a significant increase in production, they requested a substantial cost reduction through the expansion of manufacturing equipment and consulted us. In response, we leveraged our in-house assembly and adjustment experience and technical expertise to review the precision in the drawings and verify the fit and tolerance, eliminating unnecessary machining precision to propose cost reductions, even by a single yen. As a result, by utilizing the 24-hour operation of overseas factories, we were able to achieve a significant reduction in lead time and cost. [Case Overview] ■ Challenge: Unable to meet the substantial cost reduction demands when relying on the existing equipment manufacturer. ■ Solution: Utilization of in-house production equipment, verification of drawing contents, value analysis proposals, and cost reduction proposals through the expansion of parts manufacturing to the Vietnam factory. *For more details, please refer to the PDF document or feel free to contact us.

Company：シオガイ精機
Price：Other

Mechanical Design
Processing Contract
Contract manufacturing

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Nara Factory

Assembly of semiconductor manufacturing equipment and others is being carried out! Precision measurements are also conducted using high-precision inspection equipment.

Murakami Seiki prides itself on being able to assemble products at a low cost while meeting strict precision standards. The reason for this is that we can handle both parts processing and assembly as a package. In addition to reducing management labor and intermediate margins, we also have innovations in the parts processing stage before assembly. At our Nara factory, established in 2019, we assemble precision measuring instruments, precision machine tools, and semiconductor manufacturing equipment. The quality we deliver is absolute. As proof of that trust, we also measure precision using high-accuracy inspection equipment such as autocollimators. 【Business Activities】 ■ Assembly of precision measuring instruments, precision machine tools, and semiconductor manufacturing equipment ■ Flatness measurement using lasers *For more details, please refer to the PDF document or feel free to contact us.

Company：村上精機
Price：Other

Processing Contract
Contract measurement

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Are you able to use "truly suitable parts" in semiconductor manufacturing equipment for the backend process?

Examples of solving issues in semiconductor manufacturing equipment, such as "chip scratches and cracks" and "chip carry-back problems during work," with "suitable parts" are presented.

This document is a collection of case studies addressing challenges in semiconductor manufacturing equipment proposed by Orte Corporation, Ltd. It introduces our specialty in consumable parts and presents numerous examples of issues frequently raised by users, such as chip damage, instability problems with dispensers and epoxy transfer, and cases related to torch electrodes for wire bonding. Our company offers a wide range of specifications with distinct features, even in cases where general-purpose parts recommended by equipment manufacturers may not suffice. ◆ We are currently offering a collection of case studies and a comprehensive catalog as a gift! You can view it via PDF download. 【Featured Cases (Excerpt)】 ■ Types of consumable parts ■ Causes and solutions for chip snagging scratches ■ Causes and solutions for cracking (microcracks) ■ Troubles and solutions due to dispenser clogging... ■ Causes and solutions for bonding errors (adhesion failures)... ■ Ultra-precise 3D printed model with a molding resolution of 2μm *For more details, please refer to the PDF document or feel free to contact us.