Are you able to use "truly suitable parts" in semiconductor manufacturing equipment for the backend process?
Examples of solving issues in semiconductor manufacturing equipment, such as "chip scratches and cracks" and "chip carry-back problems during work," with "suitable parts" are presented.
This document is a collection of case studies addressing challenges in semiconductor manufacturing equipment proposed by Orte Corporation, Ltd. It introduces our specialty in consumable parts and presents numerous examples of issues frequently raised by users, such as chip damage, instability problems with dispensers and epoxy transfer, and cases related to torch electrodes for wire bonding. Our company offers a wide range of specifications with distinct features, even in cases where general-purpose parts recommended by equipment manufacturers may not suffice. ◆ We are currently offering a collection of case studies and a comprehensive catalog as a gift! You can view it via PDF download. 【Featured Cases (Excerpt)】 ■ Types of consumable parts ■ Causes and solutions for chip snagging scratches ■ Causes and solutions for cracking (microcracks) ■ Troubles and solutions due to dispenser clogging... ■ Causes and solutions for bonding errors (adhesion failures)... ■ Ultra-precise 3D printed model with a molding resolution of 2μm *For more details, please refer to the PDF document or feel free to contact us.
- Company:オルテコーポレーション 本社
- Price:Other