ジャパンクリエイト Product Lineup

We would like to introduce the "sputtering equipment" handled by Japan Create. We offer a range of products including the "load-lock type sputtering equipment" equipped with our unique sputter cathode, as well as "multi-target sputtering equipment" and "sputtering equipment for three-dimensional objects." We also have a track record of custom-made equipment such as ultra-high temperature sputtering systems for thin-film MEMS, IBS systems for research and development, and sputtering equipment with GB for organic EL. Please feel free to contact us when you need assistance. 【Features of Load-Lock Type Sputtering Equipment】 ■ Compatible with moving magnets, allowing for full-area erosion ■ Equipped with our unique rapid heating mechanism for substrates, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputter deposition ■ Capable of low-temperature processes such as lift-off ■ Tray transport is also supported *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "sputtering equipment." We have a track record that includes "ultra-high temperature sputtering equipment for thin film MEMS," "sputtering equipment with GB for organic EL," and "IBS equipment for research and development." We are conducting sample processing with a demo machine. Please feel free to contact us when needed. 【Manufacturing Achievements (Excerpt)】 ■ Ultra-high temperature sputtering equipment for thin film MEMS ■ Batch-type sputtering equipment for thin film MEMS ■ Multi-component composite sputtering equipment ■ Sputtering equipment with GB for organic EL ■ Load-lock type binary sputtering equipment *For more details, please refer to the PDF document or feel free to contact us.

The "Load Lock Type Sputtering Device" is compatible with moving magnets and allows for full-area erosion. Equipped with our unique sputter cathode and rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. With plasma analysis and feedback control through a light emission analysis system, it enables high-speed and stable reactive sputtering film formation. 【Features】 ■ Equipped with our unique sputter cathode ■ Compatible with moving magnets and allows for full-area erosion ■ Equipped with our unique rapid temperature rise and fall substrate heating mechanism, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputtering film formation ■ Also supports low-temperature processes such as lift-off *For more details, please refer to the PDF document or feel free to contact us.

The "Multi-Target Sputtering System" is equipped with up to four sputter cathodes, enabling the deposition of layered films such as metal films and oxide films. It is also compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. Additionally, it features a three-axis mechanism (elevation, revolution, rotation) on the substrate stage to achieve a uniform film thickness distribution. 【Features】 ■ Equipped with our proprietary sputter cathodes ■ Incorporates our unique rapid elevation and heating mechanism for substrates, achieving substrate temperatures of 900°C ■ Capable of mounting up to four sputter cathodes for the deposition of layered films such as metal films and oxide films ■ Supports tray transport ■ Compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. *For more details, please refer to the PDF document or feel free to contact us.

The "Sputtering Device for Three-Dimensional Objects" is equipped with our proprietary sputter cathode. It features a 4-axis mechanism (elevation, revolution, rotation, tilt) on the work stage, achieving high coverage in the deposition of three-dimensional objects. It also includes a heating mechanism and bias power supply, enabling reverse sputtering, high-temperature sputtering, and film stress control. It can accommodate up to three sputter cathodes, allowing for the layered deposition of metal films, oxide films, and more. 【Features】 - Equipped with our proprietary sputter cathode - 4-axis mechanism on the work stage achieves high coverage in the deposition of three-dimensional objects - Can accommodate up to three sputter cathodes for layered deposition of metal films, oxide films, etc. - Custom orders can also be manufactured - Sample processing is conducted using a demonstration machine *For more details, please refer to the PDF document or feel free to contact us.

Our company has established a consistent production system that covers everything from development to material procurement, processing, assembly, and quality assurance, and we accept custom orders for equipment from various companies. "If only I could design something like this..." "I want to improve work efficiency..." "I want to reduce labor costs..." If you have any concerns, please feel free to consult with us first. We are confident in our quality control and support system. Additionally, we conduct sample processing with demo machines, so please do not hesitate to contact us when needed. 【Production Achievements (Excerpt)】 ■ Ultra-high temperature sputtering equipment for thin-film MEMS ■ Batch-type sputtering equipment for thin-film MEMS ■ Multi-composite sputtering equipment ■ Sputtering equipment with GB for organic EL ■ Load-lock type binary sputtering equipment *For more details, please refer to the PDF materials or feel free to contact us.

The "Piezoelectric Film Formation Sputtering Device" is a product capable of detecting elements that contribute to the reduction of piezoelectric properties, thanks to the incorporation of a plasma emission monitor. It allows for continuous film formation from a single crystal epitaxial buffer layer to the piezoelectric film. Additionally, high-speed and stable reactive sputter deposition is possible through plasma analysis and feedback control using a luminescence analysis system. Equipped with our unique rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. 【Features】 ■ Deposition structure that maximizes the axis length contributing to piezoelectricity ■ Equipped with our proprietary sputter cathode ■ Compatible with moving magnets, allowing for full-area erosion ■ Tray transport compatibility ■ Combinations with CVD chambers, deposition chambers, plasma cleaning chambers, etc., are also supported *For more details, please refer to the PDF document or feel free to contact us.

The "piezoelectric film formation sputtering device" is a product that enables continuous film formation from a single crystal epitaxial buffer layer to a piezoelectric film. Through plasma analysis and feedback control using a plasma emission monitor, it allows for fast and stable reactive sputtering, as well as the detection of elements that contribute to the degradation of piezoelectric properties. It is equipped with our unique rapid heating and cooling substrate heating mechanism, achieving a substrate temperature of 900°C. *For more details, please refer to the PDF materials or feel free to contact us.

This product is a device that applies our specialized sputtering technology to form films on various three-dimensional shapes made of metal, ceramics, and resin. It can be used for applications such as cosmetics, electronic components, battery parts, and the development of high-performance materials. In addition, we can propose various devices for miniaturization/large-scale production, CVD/various plasma treatments, and barrel/drum types. 【Features】 ■ Space-saving ■ Large capacity ■ Equipped with a unique sputter cathode ■ Screw-type stirring mechanism *For more details, please refer to the PDF materials or feel free to contact us.

This product is a device that applies our specialized sputtering technology to form films on various three-dimensional shapes made of metal, ceramics, and resin. It can be used for applications such as cosmetics, electronic components, battery parts, and the development of high-functionality materials. In addition, we can propose various devices for miniaturization/large-scale production, CVD/various plasma treatments, barrel/drum types, and more. 【Features】 ■ Space-saving ■ Large capacity ■ Equipped with a unique sputter cathode ■ Stirring mechanism *For more details, please refer to the PDF materials or feel free to contact us.

In the semiconductor industry, as miniaturization and high integration progress, the formation of reliable wiring is a crucial factor that influences product performance. In particular, the uniform deposition of wiring materials and stability in the process are essential for improving yield and extending product lifespan. Improper deposition can lead to a decline in electrical characteristics and potential early failures. Japan Create's sputtering equipment addresses these challenges and achieves high-quality wiring formation. 【Application Scenarios】 - Formation of wiring layers in semiconductor devices - Deposition of various metal thin films - Research and development applications 【Benefits of Implementation】 - Improved device performance through high-precision wiring formation - Yield enhancement through stable deposition processes - Flexibility to meet diverse needs