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The "contact probe" is a component used for probe pins in the electrical inspection process of semiconductor wafers and IC packages. It achieves stable processing accuracy even with extremely small diameters and short dimensions, making it suitable for fine electrodes and precision contact parts. It balances short delivery times and quality stability through in-house completion, minimizing variations between processes. Additionally, it ensures both signal stability and durability through heat treatment and various plating processes (Ni-P, Au, AuCo, Pd, Rh), achieving contact reliability and long lifespan in high-frequency and microcurrent measurements. 【Features】 - Supports precision cutting processing from a material diameter of φ0.6mm - Numerous manufacturing achievements for fine parts with a minimum processing diameter of φ0.05 and a total length of less than 1mm - Drilling processing can accommodate a minimum diameter of φ0.1 - Thickness specifications can be accommodated for various platings such as Ni-P, Au, PdCo, and Rh, and heat treatment is also supported - A comprehensive in-house system from high-precision processing to surface treatment - By collaborating with our inspection company located overseas, we have established a high-quality system that meets global quality standards *For more details, please feel free to contact us.

The downloadable materials introduce high-precision cutting examples of fine contact probe components used in semiconductor electrical inspection processes. With the miniaturization and high-density of semiconductor devices, fine probe components require fine diameters, high precision, and stable supply. Our company achieves dimensional accuracy of ±0.005mm across a wide size range from φ0.05 to φ10mm through the optimization of processing conditions specialized for fine component machining and know-how based on material characteristics. We can handle everything from prototypes to mass production (tens of thousands of units) with consistent quality. 【Product Specifications】 ■ Application: Contact probe components for semiconductor electrical inspection ■ Machining Range: φ0.05 to φ10mm ■ Dimensional Accuracy: ±0.005mm ■ Quantity Supported: Prototypes to mass production (tens of thousands of units) ■ Processes Supported: Cutting, cleaning, inspection 【Supported Materials】 Brass, beryllium copper, phosphor bronze, SK materials, Pd, SUS, etc. We conduct dimensional measurements, appearance inspections, and surface condition checks using image inspection machines, establishing a consistent quality management system from processing to inspection. If you are facing challenges with fine machining, precision cutting, or mass production of semiconductor inspection components, please feel free to consult us. *For more details, please download the PDF materials.