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フォトプレシジョン

addressTokyo/Hachioji-shi/2-7-5 Seninmachi
phone042-666-8211
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last updated:Nov 12, 2020
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フォトプレシジョン List of Products and Services

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Frosted glass (frosted glass)

It is used for decorations of antique-style glass products and stained glass!

"Gruichip glass (frosted glass)" is glass adorned with a feather-like pattern on its surface. It is used for the decoration of antique-style glass products and stained glass. Due to the frost-like shape of the pattern, it is sometimes referred to as "kessō glass," and also called "nikawa glass" because glue is used in the manufacturing process. The patterns created from the stress when the glue dries result in beautiful lace patterns, each unique. [Features] - Glass adorned with a feather-like pattern on the surface - Used for the decoration of antique-style glass products and stained glass - Beautiful lace patterns, each one unique *For more details, please refer to the PDF document or feel free to contact us.

  • Glass

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Introduction to 3D Photolithography Processing Technology

Processing technology using "electrolytic plating"!

"3D Photolithography" is a processing technology that can uniformly form a resist film on any conductive surface. It was developed using "electroplating," which involves immersing the entire substrate in a liquid phase to deposit a metal film. This technology enables photolithography processing to be applied to the entire three-dimensional shape, including edges and corners. [Features] - Uniform formation of resist film on any conductive surface - Utilizes "electroplating" - Photolithography processing possible on the entire three-dimensional shape, including edges and corners *For more details, please refer to the catalog or feel free to contact us.

  • Technology Development

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Introduction to High Aspect Ratio Resist Processing Technology

Aspect ratio 1:5 processing achievements! Can be used in a wide range of fields!

Our company is capable of processing using "high aspect ratio resist" with a high aspect ratio between pattern line width and film thickness (height). We have a proven track record of processing with an aspect ratio of 1:5. With this technology, the resist pattern becomes not just a protective film, but a fine three-dimensional structure, expanding its range of applications. 【Features】 ■ Proven track record of processing with an aspect ratio of 1:5 ■ Wide range of applications *For more details, please refer to the catalog or feel free to contact us.

  • Technology Development

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Introduction to Electroplating Processing Technology

Introduction of a plating system compatible with 6-inch wafers! Processing technology capable of forming films of a few micrometers.

"Electroplating" is a processing technology that involves immersing a substrate in an aqueous solution containing ionized metal and passing electricity through the liquid to deposit metal onto the surface of the substrate. Film formation by vapor deposition is usually less than 1μm, but plating can form films of several micrometers. Additionally, there is a technique called "semi-additive method" that utilizes this technology to create fine plating patterns. [Features] - Electricity is passed through the liquid to deposit metal on the surface of the substrate. - Can be used in precision processing fields to increase the thickness of metal films. - Capable of forming films of several micrometers. - Applicable to the "semi-additive method" for creating fine plating patterns. - A plating system compatible with 6-inch wafers has been introduced. *For more details, please refer to the catalog or feel free to contact us.

  • Technology Development

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Introduction to Silicon Etching Processing Technology

By selecting the type of crystal orientation, you can choose the type of groove processing!

"Silicon etching" is a processing technology that corrodes the silicon substrate itself to form three-dimensional structures. There are two types of silicon corrosion: one that progresses in a specific direction (anisotropic) and one that progresses in all directions (isotropic). When performing anisotropic etching, single-crystal silicon is used for the substrate, and an etching solution such as KOH aqueous solution is employed. Single-crystal silicon wafers are categorized by crystal direction, and by selecting this, it is possible to choose the type of groove processing. Additionally, isotropic etching can also be performed depending on the type of etching solution used. [Features] - Corrodes the silicon substrate itself to form three-dimensional structures - Allows selection of groove processing types by choosing the type of crystal direction - Isotropic etching is possible depending on the type of etching solution *For more details, please refer to the catalog or feel free to contact us.

  • Technology Development

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Introduction to Glass Etching Processing Technology

Corrode the surface of the glass with chemicals such as hydrofluoric acid!

"Glass etching" is a processing technique that involves corroding the surface of glass with chemicals such as hydrofluoric acid to create grooves and relief patterns. Quartz and borosilicate glass such as BK7 are used as substrate materials. Additionally, a metal thin film patterned by photolithography is used as a mask, allowing for the formation of high-precision patterns. [Features] - Uses quartz and borosilicate glass such as BK7 as substrate materials - Utilizes a metal thin film patterned by photolithography as a mask - Capable of forming high-precision patterns - Allows for dimensional control in the depth direction - The surface is relatively smooth finished *For more details, please refer to the catalog or feel free to contact us.

  • Technology Development

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Introduction to Thin Film Coating Processing Technology

Thin film coating that can coat most metals, metal oxides, and dielectric films!

Our company offers film deposition processing using PVD techniques, including resistance heating vacuum deposition, EB heating vacuum deposition, and sputtering methods. By utilizing these processing technologies, we can coat almost all metals, metal oxides, and dielectric films. Please feel free to consult us if you have any requests. 【Features】 ■ Film deposition processing is possible using resistance heating vacuum deposition, EB heating vacuum deposition, and sputtering methods. ■ Coating of almost all metals, metal oxides, and dielectric films is possible. *For more details, please refer to our catalog or feel free to contact us.

  • Technology Development

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High aspect ratio resist

High aspect ratio resist

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. We have achieved the ability to give height to flat resist patterns! ■□■ Features ■□■ ■ The resist pattern is used as a protective film to shield metal thin films and other materials from etching solutions during the etching process. ■ To achieve high-precision metal patterns, high-resolution photoresists with excellent adhesion and meltability are being researched and developed. For more details, please download the catalog or contact us.

  • Processing Contract

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Thin film coating compatible with metals, metal oxides, and dielectric films.

Thin film coating compatible with metals, metal oxides, and dielectric films.

Photo Precision Co., Ltd. contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. Here is an introduction to our "Thin Film Coating." We can coat most metals and metal oxides! ■□■ Features ■□■ ■ We have in-house resistance heating vacuum deposition, EB heating vacuum deposition, and sputtering equipment. ■ Resistance Heating Vacuum Deposition A deposition method that heats and evaporates thin film materials (targets) in a vacuum and deposits them onto the substrate surface. ■ E.B. Heating Vacuum Deposition A deposition method that heats and evaporates the target in a vacuum and deposits it onto the substrate surface. ■ Sputtering A film formation method where argon positive ions impact the target, and the atoms ejected by the impact arrive at the substrate surface to form a film. ■ Please feel free to inquire about other types of films, film thicknesses, and multilayer films. We can accommodate a wide range of substrate types and sizes.

  • Processing Contract

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Sandblasting process

Sandblasting process

Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology, presents information on 'sandblasting processing.' This technique involves striking sand against relatively hard substrates such as glass, silicon, and quartz using air pressure to carve out grooves and holes on the substrate surface. ■□■ Features ■□■ ■ Patterns can be created on the substrate surface using dry film resist for sandblasting, allowing for the desired groove processing by masking. ■ The processed surface becomes sandy. ■ Depth control is possible by adjusting the processing time. ■ For more details, please download the catalog or contact us.

  • Processing Contract

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Silicon etching

Silicon etching

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. "Silicon Etching" Overview A technology that etches the silicon substrate itself to form three-dimensional structures. ■□■ Features ■□■ ■ Utilizing the crystal orientation of silicon, it enables groove processing with flat groove walls (anisotropic etching). V-shaped and rectangular grooves can be formed. ■ Depending on the type of etching solution, rounded edges can be created on the groove walls, allowing for isotropic etching as well. ■□■ Types of Processing ■□■ ■ V-Groove Processing - Using silicon material with a <100> surface orientation, V-shaped grooves are formed. - The angle of the slope is always the same (54.7°). ■ Rectangular Groove Processing - Using silicon material with a <110> surface orientation, rectangular grooves are formed. - Due to the crystal structure, the direction of the grooves tilts at 54.7° relative to the side surface. ■ Isotropic - Etching progresses uniformly in all directions. For more details, please download the catalog or contact us.

  • Processing Contract

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Electroplating

Electroplating

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. This is an introduction to "Electroplating." Processing that involves placing a substrate in an aqueous solution containing ionized metal and passing electricity through the liquid to deposit metal onto the surface of the substrate. ■□■ Features ■□■ ■ Introduction of a plating system compatible with 6-inch wafers ■ While film formation by vapor deposition is usually less than 1μm, plating can form films of several μm ■ Suitable for processing three-dimensional shapes ■ As a metal film, it can be used for circuit formation requiring specific film thicknesses or as a sacrificial film for lift-off, and it is also possible to form fine bumps by raising part of the pattern ■ For other functions and details, please download the catalog or contact us.

  • Processing Contract

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Glass etching processing

Glass etching processing

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. This is an introduction to "Glass Etching Processing." A technique that etches the surface of glass using chemicals such as hydrofluoric acid to create grooves and recessed patterns. ■□■ Features ■□■ ■ Quartz and borosilicate glass such as BK7 are used as substrate materials. ■ Metal thin films patterned by photolithography are used as masks, allowing for high-precision pattern formation. ■ Dimensional control in the depth direction is also possible. ■ Since the etching is done chemically, the surface finishes relatively smoothly. ■ For more details, please download the catalog or contact us.

  • Processing Contract

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Electrostatic resist.

Electrode formation with a three-dimensional structure requires at least electroplating method 3D photolithography technology.

3D photolithography is a three-dimensional patterning technology suitable for the formation of electrode structures. In next-generation core technologies such as MENS devices, techniques for processing complex and delicate patterns in three-dimensional structures are required. Our company offers 3D photolithography technology that utilizes an electroplating method, where the entire substrate is immersed in a liquid phase to deposit a metal film.

  • Circuit board processing machine

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