テクノアルファ Product Lineup

At Techno Alpha, we offer a "Wedge Bonding Tool Cleaning Service." We provide services including the removal of aluminum foil adhered to tools using NaOH solution, submission of cleaning reports with condition photos of all tools after cleaning, and management of tool cleaning history. Additionally, we also offer optional management of imaging data for the condition of all tool tips before cleaning. 【Benefits of Introducing Tool Cleaning Services】 ■ Outsourcing tool cleaning operations in the production area reduces daily routine tasks, improving operational efficiency. ■ Standardization of tool history management through cleaning records after cleaning. ■ Elimination of the need to store cleaning solutions in the production area, reducing costs related to storage facilities and handling training. ■ Improvement of safety in the production area and the factory environment, along with simplification of management items. ■ Achieving "small space/high productivity" in line layout by removing cleaning space. *For more details, please refer to the PDF materials or feel free to contact us.

Features of V-SEP - Capable of using various flat membranes including reverse osmosis (RO), nanofiltration (NF), ultrafiltration (UF), microfiltration (MF), and mesh membranes. - Enables filtration/concentration separation of high-concentration and high-viscosity liquids that traditional filtration devices cannot handle. - Allows for the separation of target substances from high-concentration liquids using membranes tailored to the molecular weight of the desired separation substance. - Achieves low running costs for concentration without using thermal energy. - The device is lightweight and requires a small installation area, and it can operate independently, making it relatively easy to implement. - Significantly reduces annual running costs compared to traditional membrane filtration, concentration, and separation equipment. - Complies with food-grade standards. Effect of Membrane Vibration By applying vibration to the membrane, shear vibrations are generated from the membrane surface. In typical cross-flow filtration, this creates a concentration diffusion effect that prevents particle adhesion and accumulation on the outermost layer of the membrane, enhancing shear force at the membrane surface. This results in increased permeation rates, enables the processing of high-concentration liquids, and allows for long-duration operation.

We sell the "Low Pressure and Atmospheric Pressure Plasma Equipment" manufactured by Diener Electronic, which has a wealth of implementation experience in various fields, including semiconductors. Our lineup ranges from easy-to-handle, low-cost small experimental products to large machines with powerful processing capabilities. We offer a wide variety of models for both low pressure and atmospheric pressure types, allowing customers to choose according to their needs for research and development or small-scale production. 【Features】 ◎ Low Pressure Plasma Equipment 　■ Capable of plasma treatment for glass, metal, plastic, textiles, powders, and more 　■ Numerous implementations in research and development, as well as in mass production lines 　■ Various sizes of plasma chambers available to meet customer requirements ◎ Atmospheric Pressure Plasma Equipment 　■ Can be installed inline or mounted on robots 　■ Contributes to the removal of organic substances from work surfaces and improves adhesion through enhanced hydrophilicity 　■ Plasma can be generated using a 100V power supply and high-pressure air of 0.5MPa to 0.8MPa *For more details, please refer to the materials. Feel free to contact us with any inquiries.

In the semiconductor industry, the removal of fine foreign substances and organic materials in the manufacturing process is a critical issue that affects product quality and yield. In particular, the cleaning of wafers and substrates is essential for maximizing device performance. Plasma cleaning offers high cleaning power and compatibility with materials to address these challenges. Our low-pressure and atmospheric plasma equipment contributes to the optimization of cleaning processes in semiconductor manufacturing. 【Application Scenarios】 - Cleaning of wafers and substrates - Removal of organic materials and foreign substances - Improved adhesion through surface modification 【Effects of Implementation】 - Enhanced cleaning quality - Improved yield - Increased product reliability