テクノアルファ Product Lineup

This product is applied as a paste somewhere inside a sealed package (including MEMS), and after drying and activation, it does not adsorb and re-release moisture. In addition to the HiCap2000 series, which adsorbs moisture and carbon dioxide, we also offer high-end products that capture not only moisture but also fine particles and hydrogen. STAYDRY getters capture harmful substances released as gases and those present within sealed packages. For over 20 years in the aerospace, medical, and telecommunications fields, we have a proven track record as a reliable solution for removing harmful contaminants. Depending on concerns regarding gas-releasing substances, manufacturing processes, and the requirements of end-use devices, we provide getter products that meet lifespan requirements while maximizing total cost.

We offer a variety of thick film pastes for ceramic substrates (RoHS compliant). Conductive pastes (gold, silver, silver-palladium, and others), thermistor pastes, resistor pastes, dielectric pastes, and various types of glass pastes are available. We can accommodate small quantities as well. Please feel free to contact us.

This is a compatible heater chip and heater tool for pulse heat power supplies such as those from Japan Avionics, contributing to the reduction of consumable costs.

Thermoplastic resins have the property of softening when heated to a specified temperature and then hardening when the temperature decreases. STAYSTIK adhesive is an adhesive that utilizes this characteristic of thermoplastic resins. Since no curing accelerators are added like in thermosetting adhesives, it is physically stable and allows for long-term storage at room temperature. Additionally, it softens upon heating, making rework after adhesion easy. 【Features】 - Extremely low outgassing levels - Reworkable (can be peeled off with solvents or heat) - Can be stored at room temperature for one year - Available in two types: paste type and film type - Three types: conductive, thermal conductive (electrically insulating), and insulating - The paste has minimal "bleeding" during curing (heating) - The film type and paste can be bonded with short-term (seconds to minutes) heat pressing after B-stage - High reliability conforming to military standard MIL-STD-883, 5011/2 - Stress relief achieved with low elastic modulus - Compliant with RoHS directive - PFAS-free

This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.