テクノアルファ List of Products and Services

The K&S manufactured wire bonder and ribbon bonder ASTERION adopts the latest beltless direct drive motion system, significantly improving productivity (UPH) compared to conventional models, and is a new type of wire bonder with enhanced newly added features. ASTERION has expanded the bonding area, incorporated advanced pattern recognition, and strengthened tight process control. This has improved high productivity, bond quality, and reliability. The enlarged bonding area accommodates various applications and reduces line integration costs. 【Features】 <Productivity> - The expanded bonding movable range (300mm x 300mm) shortens index/loading time. - Enhanced pattern recognition improves MTBA. - Cycle time reduction through pattern recognition with a new mode and direct drive motion system. <Performance> - Minimal frame movement and increased frame rigidity reduce the vibration of the machine during operation. - Repetitive accuracy of bond positioning. - Improved process stability.

• Other processing machines
• Bonding Equipment
• Other semiconductor manufacturing equipment

This product is applied as a paste somewhere inside a sealed package (including MEMS), and after drying and activation, it does not adsorb and re-release moisture. In addition to the HiCap2000 series, which adsorbs moisture and carbon dioxide, we also offer high-end products that capture not only moisture but also fine particles and hydrogen. STAYDRY getters capture harmful substances released as gases and those present within sealed packages. For over 20 years in the aerospace, medical, and telecommunications fields, we have a proven track record as a reliable solution for removing harmful contaminants. Depending on concerns regarding gas-releasing substances, manufacturing processes, and the requirements of end-use devices, we provide getter products that meet lifespan requirements while maximizing total cost.

• others

Features of V-SEP - Capable of using various flat membranes including reverse osmosis (RO), nanofiltration (NF), ultrafiltration (UF), microfiltration (MF), and mesh membranes. - Enables filtration/concentration separation of high-concentration and high-viscosity liquids that traditional filtration devices cannot handle. - Allows for the separation of target substances from high-concentration liquids using membranes tailored to the molecular weight of the desired separation substance. - Achieves low running costs for concentration without using thermal energy. - The device is lightweight and requires a small installation area, and it can operate independently, making it relatively easy to implement. - Significantly reduces annual running costs compared to traditional membrane filtration, concentration, and separation equipment. - Complies with food-grade standards. Effect of Membrane Vibration By applying vibration to the membrane, shear vibrations are generated from the membrane surface. In typical cross-flow filtration, this creates a concentration diffusion effect that prevents particle adhesion and accumulation on the outermost layer of the membrane, enhancing shear force at the membrane surface. This results in increased permeation rates, enables the processing of high-concentration liquids, and allows for long-duration operation.

• Wastewater/wastewater treatment equipment
• Filtration Equipment
• Other water treatment equipment

Manufacturing is possible with materials such as molybdenum, tungsten, copper tungsten, and alumina dispersion strengthened copper. We accept orders for custom products starting from small quantities. Please consult us for more details.

• Welding Machine
• Other processing machines
• Circuit board processing machine

This is an electrode for resistance welding that can be used with equipment from major domestic manufacturers. The materials can be specified as molybdenum, tungsten, copper tungsten, etc. We also support replacements from Coorstek (Geyser) products. Please consider it.

• Welding Machine
• Other processing machines
• Circuit board processing machine

This is a compatible heater chip and heater tool for pulse heat power supplies such as those from Japan Avionics, contributing to the reduction of consumable costs.

• Other processing machines
• Circuit board processing machine
• Reflow Equipment

German Pfarr Company manufactured Pb-free solder/low melting point solder/molding solder All processes of metal melting, alloying, and molding are conducted in-house. Therefore, we deliver high-quality products through strict quality control. - Supports 176 types of alloys with melting points ranging from 13 to 1770°C, including lead-free and leaded options - Excellent size tolerance - High quality recognized by major semiconductor manufacturers in Europe and the U.S. due to vacuum refining and high purity (standard purity 99.99%) - Flexible response to custom dimension products through unique processing technology - Over 1000 types of molds and pools - Rich lineup of alloys compatible with Pb-free requirements - Also supplies low melting point bismuth (Bi) and tin (Sn) based alloy solder

• Other cutting tools
• others
• Contract manufacturing

We offer a variety of thick film pastes for ceramic substrates (RoHS compliant). Conductive pastes (gold, silver, silver-palladium, and others), thermistor pastes, resistor pastes, dielectric pastes, and various types of glass pastes are available. We can accommodate small quantities as well. Please feel free to contact us.

• Printed Circuit Board
• others

Thermoplastic resins have the property of softening when heated to a specified temperature and then hardening when the temperature decreases. STAYSTIK adhesive is an adhesive that utilizes this characteristic of thermoplastic resins. Since no curing accelerators are added like in thermosetting adhesives, it is physically stable and allows for long-term storage at room temperature. Additionally, it softens upon heating, making rework after adhesion easy. 【Features】 - Extremely low outgassing levels - Reworkable (can be peeled off with solvents or heat) - Can be stored at room temperature for one year - Available in two types: paste type and film type - Three types: conductive, thermal conductive (electrically insulating), and insulating - The paste has minimal "bleeding" during curing (heating) - The film type and paste can be bonded with short-term (seconds to minutes) heat pressing after B-stage - High reliability conforming to military standard MIL-STD-883, 5011/2 - Stress relief achieved with low elastic modulus - Compliant with RoHS directive - PFAS-free

• glue