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  1. Home
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  3. エム・シー・ケー 東京 電子事業本部
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エム・シー・ケー 東京 電子事業本部

addressTokyo/Chuo-ku/7-1 Nihonbashi Kabutocho, KABUTO ONE 9F, inside Wework
phone03-6810-9720
last updated:Jul 19, 2023
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エム・シー・ケー List of Products and Services

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"Large Screen Compatible Touch Panel Sensor Film" *Free catalog available now

Supports up to 85 inches! Low resistance with good touch sensitivity. Simple wiring makes it easy to integrate.

The "Large Screen Compatible Touch Panel Sensor Film" is a high-sensitivity functional film that employs capacitive technology. It supports screens up to 85 inches (aspect ratio 16:9). It offers high design flexibility and has excellent touch sensitivity with less than half the resistance compared to conventional products. The sensor section and peripheral wiring are formed together, resulting in simple wiring. It can be applied to touch panel sensors for electronic blackboards and large flat-screen TVs. 【Features】 ■ Capacitive technology ■ The sensor section and peripheral wiring are formed together, providing high reliability and ease of handling ■ Supports up to 85 inches (standard lineup supports up to 65 inches) *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Touch Panel
  • Other FPD related

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Nanoimprint device

Various customizations and special specifications are available!

Nanoimprint is a fine patterning technology that forms micro-patterns by applying thermosetting or photocurable resin and pressing a master plate. Resin is applied to the substrate and pressed with a mold. Fine patterns are shaped by UV irradiation. 【Model Specifications Example】 Size: 620(W) × 500(D) × 1670(H) mm Weight: 150 kg Power Supply: AC100V Substrate Size: 4-inch wafer Press Method: Servo-driven Press Pressure: 0.1 kN to 10 kN (1000 kgf) Light Source: UV-LED type Release: Automatic operation ◎ For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • others

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UV-Ozone Cleaning and Modification Device

It is a device that removes organic contamination from the workpiece using UV light and improves wettability.

The UV-Ozone cleaning and modification device generates ozone through UV light and removes organic substances by breaking them down into CO2 and other compounds. By modifying the surface of the film, wettability is improved, making it suitable for various applications such as pre-treatment for lamination. Additionally, it operates in a non-contact manner, preventing scratches on the workpiece. 【Comparison with Plasma Cleaning】 ● Low initial cost ● The film surface is less likely to become rough ● Stable quality control through UV intensity ● Reduced running costs (depending on conditions) ◎ For more details, please contact us or download the catalog.

  • Other cleaning machines

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[Free Distribution] Touch Panel Manufacturing Comprehensive Catalog

A comprehensive catalog covering the equipment for attaching touch sensors from the manufacturing device to the panel, including FPCB pressing!

This is a comprehensive catalog covering the equipment for attaching touch sensors from the touch sensor manufacturing device used for touch panel production to the panel, as well as the equipment for FPCB crimping. For more details, please contact us or download the catalog.

  • Touch Panel
  • Other assembly machines
  • Other processing machines

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MCK Laminator Comprehensive Catalog

Introducing the comprehensive catalog of the pioneer of laminators, the MCK Laminator!

We would like to introduce the comprehensive catalog of MCK laminators. It features a wide range of laminators primarily for the electronics industry (related to printed circuit boards and IC packaging) and the FPD industry (related to flat panel devices). For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment
  • Other packaging machines

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Touch panel related manufacturing equipment

This is the comprehensive catalog for touch panel manufacturing by "MCK," the pioneer of laminators.

This is a comprehensive catalog covering the equipment used for attaching touch sensors from the touch sensor manufacturing device to the panel, up to FPCB crimping. For more details, please contact us or download the catalog.

  • Touch Panel
  • Other assembly machines
  • Other processing machines

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Multi-axis laminator

A laminator customized for touch panel manufacturing.

Roll-to-roll lamination is possible, which will enhance your production efficiency.

  • Touch Panel
  • Other semiconductor manufacturing equipment
  • Other processing machines

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Vacuum laminator

Air-free, hassle-free laminator

Laminating in a vacuum makes it difficult for bubbles to form in the workpiece. It is ideal for attaching film to workpieces, such as fine patterns, where bubbles are prone to occur.

  • Other semiconductor manufacturing equipment
  • Circuit board processing machine
  • Vacuum Packaging Machine

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PP laminator

On-demand printing paper, compact machine that is small and space-saving.

This device is ideal for on-demand production of various types and small lots. It supports workpieces ranging from half a chrysanthemum to A3 size. Low price.

  • Paper Converting Machinery
  • Other processing machines
  • Printing Machinery

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Magnetic buzzer

A small electronic buzzer that serves two functions; it can be used as a speaker.

Magnetic buzzers are used in portable electronic devices and medical equipment, which have limited implementation space, compared to piezo-type buzzers.

  • Sound Parts
  • Oscillator
  • Other electronic parts

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Wet laminator

It can be laminated.

It is a device that laminates printed materials while applying adhesive to the film.

  • Paper Converting Machinery
  • Other processing machines
  • Other packaging machines

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Semi-automatic PP laminating machine

Device for laminating printed materials with OPP film - Easy operation

A device for laminating printed materials with OPP film.

  • Paper Converting Machinery
  • Other processing machines
  • Other packaging machines

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Fully automatic PP laminating machine

It is a device that automatically laminates OPP film onto printed materials. Compatible with full-size sheets.

It is a device that automatically laminates OPP film onto printed materials.

  • Paper Converting Machinery
  • Other processing machines
  • Other packaging machines

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Dry film laminator

Introducing the dry film laminator.

- Effective: 600mm - Speed: Max 3.0m/min - Roll: Special heat-resistant silicone - Pressurization: Air cylinder - Heating: Far infrared heater Max 150℃ - Power supply: Single-phase 200V/JK type - Heating: Electromagnetic induction heating method

  • Other painting machines

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Wafer / LCD and functional film laminator

Achieving an unprecedented compact size that can be placed on a tabletop, it continuously and precisely applies various functional films that have been pre-cut for wafers and LCDs.

● Effective width: 200-300mm ● Cycle time: 1-4 pieces/min ● Pressing method: Air cylinder pressing ● Adhesion accuracy: ±0.1mm ● Machine dimensions: W860×D690×H494mm ● Air source: 490kpa (5km/cm2) ● Power supply: AC/100V 50/60Hz ● Weight: 100kg

  • Other painting machines

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Opening postcard processing

A new breeze in the mailing industry: Unfolding postcard processing for various applications.

◆For the protection of privacy Usage statements, invoices, loan and discount notifications, maturity notices, renewal notifications, reminders for unpaid amounts, unpaid amount notifications, secret information, survey postcards In addition, it can be developed into a variety of uses depending on your ideas.

  • Catalog and manual creation

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Wafer Level CSP (Laser Cut) Laminator

The AL-300 model performs half-cutting of various functional films into arbitrary shapes using a laser, while leaving the release paper intact, for wafer bonding and wafer applications.

If you have any questions regarding the explanation below, please feel free to contact us.

  • Other painting machines

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Auto-cut laminator

A device that automatically cuts dry film on the substrate and applies it to a frame. Supports sizes up to 610×610mm. Fully automated from substrate supply to retrieval.

● Power Supply: AC200V 3-phase ● Air Source: 0.5Mpa ● Machine Dimensions: W2150×D1440×H1705mm ● Weight: 1800kg ● Board Dimensions: L 250〜610mm W 250〜610mm T 0.05〜3mm ● Dry Film Dimensions: W 250〜610mm T 15〜76μm D 160mm ● Functions ・Tact: 1〜4m/min. ・Processing Capacity: 4pcs/min. ・Accuracy: ±1mm ・Temperature Control Range: Room Temperature to 120℃ ※ Options: Preheat Device, After Lamination Device, Cleaning Roll, Cleanroom Compatible

  • Other painting machines

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Printed Circuit Board Dry Film Laminator

This printed circuit board dry film laminator is a device for bonding photosensitive resist film to printed circuit boards. It features a compact design, and...

●Effective width: 100 to 550 mm ●Speed: 0 to 3.0 m/min ●Pressurization method: Air cylinder pressurization ●Temperature control range: Room temperature to 150°C ●Machine dimensions: W1110 × D1200 × H1220 mm ●Air source: 0.5 MPa or higher ●Power supply: φ3 200V 9.5 kW ●Weight: 280 kg

  • Other painting machines

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Printing-related laminator

High-precision and optimal printing is possible for the work.

● Printing speed: 15 to 150 m/min ● Number of printing colors: 5 colors (1 UV color) * ● Maximum web width: 260 mm ● Maximum printing width: 254 mm ● Printing repeat length: 140 to 610 mm ● Maximum unwind diameter: 1200 mm ● Maximum rewind diameter: 1200 mm ● Machine dimensions: W1450 x L8361 x H1974 mm ● Power supply: 3-phase AC 200V 11 kW * Additional colors can be added as an option.

  • Other painting machines

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COF Dry Film Laminator

Widely used in BGA/CSP printer heads and HDDs, etc.

●Effective width: 60 to 160 mm ●Cleaning method: Adhesive rubber roll transfer method ●Pressurization method: Air cylinder pressurization ●Film slitting: One-touch set, upper and lower ●Machine dimensions: W1100 × D4000 × H1800 mm ●Air source: 0.4 MPa or more ●Power supply: φ3 200V 50/60Hz ●Weight: 3000 kg

  • Other painting machines

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Dicing Tape Mount (Semi-Automatic Type)

A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 12-inch wafers, providing supply of wafer frames and frame mounting.

● Maximum workpiece: 200-300mm ● Cycle time: 13 seconds per cycle ● Pressurization method: Air cylinder pressurization ● Cutting method: Automatic circular blade cutting ● Machine dimensions: W880×D720×H650mm ● Air source: Dry air 0.5Mpa ● Power supply: AC/100V 3A ● Weight: 120kg

  • Other painting machines
  • Mounter

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TAB/BGA Copper Foil Laminator

Preheat the reel-shaped polyimide film and use a laminator to bond copper foil in multiple rows with low tension and high precision to the circuit polyimide film.

●Effective width: 60 to 160 mm ●Speed: 0.3 to 3.0 m/min ●Pressurization method: Air cylinder pressurization ●Drying oven: Panel heater heating type ●Machine dimensions: W1100 × D4500 × H1800 mm ●Air source: 0.5 MPa or more ●Power supply: φ3 200V 50/60Hz ●Weight: 3700 kg

  • Other painting machines

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Dicing tape mount

This laminator supports wafers from 4 inches to 8 inches, has a compact design that can be placed on a tabletop, and is easy to operate even for beginners.

● Maximum workpiece: 150-200mm ● Film width: 270mm ● Table temperature: Room temperature to 60℃ ● Cutting method: Manual round blade cut ● Machine dimensions: W430×D830×H250mm ● Air source: Dry air 0.5Mpa ● Power supply: AC/100V 1A ● Weight: 20kg

  • Other painting machines
  • Mounter

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Dry Film Laminator MLP-600DN

Handled by MCK Corporation,

Introducing the dry film laminator.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Preceding Plate Automatic Peeling Device MGU-500

Handled by M.C.K. Corporation,

This is an introduction to the automatic peeling device for the leading board.

  • Circuit board design and manufacturing
  • Substrate transport device (loader/unloader)
  • Printed Circuit Board

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Fully Automatic DFR Laminator MNA-300R

Handled by M.C.K. Corporation,

Introducing the fully automatic DFR laminator.

  • Printed Circuit Board
  • Other processing machines
  • Lithium-ion battery

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Pre-assembly automatic adhesive application machine MGL-500

Handled by M.C.K. Corporation,

This is an introduction to the automatic alignment and insertion machine for pre-formed boards.

  • Printed Circuit Board
  • Substrate transport device (loader/unloader)

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Preliminary Board Automatic Taping Machine MGT-500

Handled by M.C.K. Corporation,

This is an introduction to the pre-cut automatic taping machine.

  • Printed Circuit Board
  • Taping Machine
  • Substrate transport device (loader/unloader)

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FPC・COF Vacuum Laminator (Roll Type) MVR-250

Handled by MCK Corporation,

Introducing the FPC・COF vacuum laminator (roll type).

  • Printed Circuit Board
  • Other processing machines
  • Other semiconductor manufacturing equipment

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Sheet to Roll DF Laminator MLW-250/400A

Handled by M.C.K. Corporation,

This is an introduction to the sheet-to-roll DF laminator.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other processing machines

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Vacuum Press Laminator MV-302

Handled by MCK Corporation,

Introducing the vacuum press laminator.

  • Printed Circuit Board
  • Other processing machines
  • Other semiconductor manufacturing equipment

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Small/Medium Panel Press Cut & Laminator MPA-150

Handled by M.C.K. Corporation,

Introduction of small/medium-sized panel press cut and laminator.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Touch Panel

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Pre-cut film auto laminator MF-200/300

Handled by M.C.K. Corporation,

Introducing the pre-cut film auto laminator.

  • Printed Circuit Board
  • Touch Panel
  • Lithium-ion battery

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Dry Film Laminator DFW-500-P-RC

Handled by M.C.K. Corporation,

Introducing the dry film laminator.

  • Other semiconductor manufacturing equipment
  • Printed Circuit Board
  • Touch Panel

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Masking Laminate Cutter MK-600

Handled by MCK Corporation,

Introducing the masking lamination cutter.

  • Printed Circuit Board
  • Other processing machines

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Atmospheric pressure plasma device

It is an atmospheric pressure plasma device. It is ideal for adhesion, cleaning, and more.

Nitrogen and air are used as plasma materials. When plasma is irradiated onto surfaces such as liquid crystal panels and printed circuit boards, it cleans the surface and enhances the adhesion strength.

  • Plasma Generator
  • Plasma surface treatment equipment
  • Other surface treatment equipment

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Reinforcement Plate Automatic Temporary Bonding Device SR-250ASB

Automatic bonding

This is a device that extracts reinforcement plates from a roll into individual pieces by incorporating a press, and then bonds them together after alignment. It can replace the current manual process.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other processing machines

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Coverlay Automatic Temporary Bonding Device (Roll to Roll Type)

High-precision automatic temporary bonding device capable of correcting and bonding coverlay film expansion.

It is a device for temporarily attaching difficult-to-handle coverlay films to printed circuit boards and the like.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other processing machines

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Vacuum laminator

This vacuum laminator uses vacuum to bond films without bubbles on build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.

This vacuum laminator is a device that adheres films without bubbles under vacuum to build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.

  • Other painting machines

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