二宮システム List of Products and Services

The compactly designed ultra-high precision series SPseries SPE40 is a small etching machine that meets the needs for fine processing of printed circuit boards as their density increases. Utilizing the know-how of the Ninomiya system in nozzles, nozzle arrangement, and oscillation, this small machine is the definitive model. It features user-friendly functions and a sleek design with touch panel operation. Equipped with numerous safety features as standard, it allows for design modifications to meet customer needs. For more details, please contact us or refer to the catalog.

• Etching Equipment

The compact design ultra-high precision series SPseries SPD40 is a small developer that meets the needs for finer printed circuit boards as density increases. It is the definitive compact machine completed by utilizing the know-how of the Ninomiya system, including nozzle, nozzle arrangement, and oscillation. It features user-friendly functions and a sleek design with touch panel operation. Equipped with numerous safety features as standard, it allows for design modifications to meet customer needs. For more details, please contact us or refer to the catalog.

• Other semiconductor manufacturing equipment

The compactly designed ultra-high precision series SPseries SPS40 is a space-saving type of small peeling machine that supports fine patterns through horizontal oscillation. It features an easy-to-use touch panel operation and a sleek design. It comes standard with numerous safety features and allows for design modifications to meet customer needs. For more details, please contact us or refer to the catalog.

• Other semiconductor manufacturing equipment

The high-precision etching line is a high-precision etching device capable of transporting thin sheets, achieving uniform surface accuracy with an optimal nozzle arrangement and oscillation system. It is ideal for PCB etching (using ferric chloride, cupric chloride, sulfuric-peroxide solutions, and alkaline etching) as well as chemical milling (etching various metals such as iron, aluminum, copper, titanium, etc.). For more details, please contact us or refer to the catalog.

• Etching Equipment

The developing, etching, and stripping line is a printed circuit board manufacturing equipment that achieves uniform surface accuracy through a fine nozzle arrangement and oscillation system. The upper etching is independently pressure-controlled for even higher precision. It can stably process workpieces with a thickness of 50μm. The effective width is 600mm, and the transport speed ranges from 1.0 to 7.0m/min (commonly 3.5m/min), with the developing, etching, and stripping pumps controlled by an inverter. For more details, please contact us or refer to the catalog.

• Etching Equipment
• Other semiconductor manufacturing equipment

The soft etching and small-diameter hole cleaning line is an etching device that achieves surface accuracy through an ideal nozzle arrangement. It cleans small-diameter holes with a highly straight slit and also dries the inside of the holes using a high-precision air knife. It can transport workpieces with a thickness of 50μm. For more details, please contact us or refer to the catalog.

• Etching Equipment
• Other semiconductor manufacturing equipment
• Other cleaning machines

The stripping and alkaline etching line is a stripping device that enables high-precision alkaline etching. It achieves uniform surface accuracy through a fine nozzle arrangement and an oscillation system. The upper etching is even more precise with individual pressure control. It is equipped with a debris removal mechanism to handle fine particles of resist generated during the spray removal process. For more details, please contact us or refer to the catalog.

• Etching Equipment
• Other semiconductor manufacturing equipment

The copper surface roughening treatment device, micro-etching device, is a surface treatment device capable of stably transporting workpieces with a thickness of 50 μm. The fine specification nozzle pattern and oscillation mechanism enable uniform surface accuracy. The upper etching is individually pressure-controlled for even higher precision. For more details, please contact us or refer to the catalog.

• Other surface treatment equipment
• Etching Equipment

High-precision processing type

• Other semiconductor manufacturing equipment

Fine processing specifications, thin plate transport compatibility

• Etching Equipment

Achieves uniform surface accuracy with no irregularities in processing, compatible with thin plate transport (t50μm).

• Etching Equipment

With outstanding surface precision, even small diameter holes are reliably cleaned.

• Etching Equipment

We contribute to enhancing our customers' added value by utilizing advanced fine processing technologies for developing and etching, as well as sophisticated thin plate transport technologies.

• Etching Equipment

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as sophisticated thin plate transport technology.

• Other semiconductor manufacturing equipment

We contribute to enhancing our customers' added value by utilizing advanced fine processing technologies for development and etching, as well as advanced thin plate transport technologies.

• Substrate transport device (loader/unloader)

Achieving excellent surface accuracy with an ideal nozzle arrangement.

• Etching Equipment

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as sophisticated thin plate transportation technology.

• Etching Equipment

Exhibits high cleaning effectiveness without contact.

• Other semiconductor manufacturing equipment

Achieving high-precision development through optimal nozzle arrangement.

• Other semiconductor manufacturing equipment

Establish stable transportation of large substrates.

• Substrate transport device (loader/unloader)

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as advanced thin plate transportation technology.

• Other semiconductor manufacturing equipment

Remarkable surface accuracy despite being a small machine.

• Etching Equipment

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for developing and etching, as well as advanced thin plate transport technology.

• Other mounting machines

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as advanced thin plate transport technology.

• High pressure cleaner

Ultra-small size in the corner of the laboratory.

• Other semiconductor manufacturing equipment

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as advanced thin plate transport technology.

• Etching Equipment

Minimum size of our horizontal conveyor model.

• Other semiconductor manufacturing equipment

【Process】Input → Stripping → Liquid Cutting → Circulating Water Wash → Direct Water Wash → Squeezing → Extraction 【Board Size】Max. W400×L500mm Thickness 0.4-2.0mm 【Nozzle Swing】None 【Equipment Size】W1300×L1590×H1215mm

• Other surface treatment equipment
• Circuit board processing machine
• Other laboratory equipment and containers

【Process】 Input → Development → Liquid Drain → Rinse → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Board Size】 Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】 Neck Swing 【Device Size】 W1530 × L2830 × H1860 mm - Space-saving for research - Ideal for material development and testing - Capable of developing PCBs and LCDs

• Other surface treatment equipment
• Circuit board processing machine
• Other laboratory equipment and containers

【Process】 Input → Etching → Liquid Drain → Acid Wash → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Board Size】 Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】 Neck Swing 【Device Size】 W1530 × L2830 × H1860 mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs

• Other surface treatment equipment
• Etching Equipment
• Other laboratory equipment and containers

【Process】Input → Air knife → Stripping → Air knife → Circulation water wash → Direct water wash → Air knife → Extraction 【Board size】Min. W50×L50mm Thickness 0.03〜2.0mm 【Nozzle oscillation】None 【Equipment size】W1445×L2010×H1230mm

• Other surface treatment equipment
• Circuit board processing machine
• Other laboratory equipment and containers

【Process】Input → Air knife → Development → Air knife → Circulating water wash → Direct water wash → Air knife → Extraction 【Board Size】Min. W50×L50mm Thickness 0.03〜2.0mm 【Nozzle Swing】Horizontal swing 【Device Size】W1445×L2010×H1230mm - Space-saving for research - Ideal for material development and testing - Capable of developing PCBs and LCDs

• Other surface treatment equipment
• Circuit board processing machine
• Other laboratory equipment and containers

【Process】Input → Development → Liquid Cutting → Water Wash 1 → Water Wash 2 → Squeezing → Extraction 【Substrate Size】Max. W400×L500mm Thickness 0.4〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1420×L1950×H1645mm - Space-saving for research - Ideal for material development and testing - Capable of developing PCBs and LCDs

• Other surface treatment equipment
• Circuit board processing machine
• Other laboratory equipment and containers

【Process】Input → Etching → Liquid Drain → Rinse 1 → Rinse 2 → Squeeze → Extraction 【Board Size】Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1420 × L1950 × H1645 mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCB and LCD

• Other surface treatment equipment
• Etching Equipment
• Other laboratory equipment and containers

【Process】Input → Development → Liquid Cutting → Circulating Water Wash → Direct Water Wash → Squeezing → Extraction 【Substrate Size】Max. W400×L500mm Thickness 0.4-2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1300×L1590×H1215mm - Space-saving for research use - Ideal for material development and testing - Capable of developing PCBs and LCDs

• Other surface treatment equipment
• Circuit board processing machine
• Other laboratory equipment and containers

【Process】Input → Etching → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Substrate Size】Max. W400×L500mm Thickness 0.4〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1300×L1590×H1215mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCBs and LCDs

• Other surface treatment equipment
• Etching Equipment
• Other laboratory equipment and containers

[Process] Input - Liquid Drain - Chemical Wash Brush - Liquid Drain - Pure Water Shower ×2 - Direct Pure Water - Air Knife - Extraction The adoption of a high-precision clean air knife system achieves an optimal liquid drainage state without any remaining water droplets or stains.

• Other cleaning machines
• Other semiconductor manufacturing equipment

The adoption of a high-precision clean air knife system has achieved an optimal liquid drainage state without any remaining water droplets or stains. A variety of combinations of cleaning tools are possible.

• Other cleaning machines
• Other processing machines
• Other semiconductor manufacturing equipment

【Process】Input → Air Knife → Etching → Air Knife → Recirculating Water Wash → Direct Water Wash → Air Knife → Extraction 【Board Size】Min. W50×L50mm Thickness 0.03〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1445×L2010×H1230mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs

• Other surface treatment equipment
• Etching Equipment
• Other laboratory equipment and containers