ライズワン List of Products and Services

- Continuous execution of various inspections using conveyor transport - Pre-process mark and work confirmation using a camera - ROM writing and inspection for the mounted microcontroller - Inkjet stamping on approved products - ECU package inspection - Communication inspection via LIN/CAN communication

• LED Module
• Other Auto Parts
• Circuit Board Inspection Equipment

The "Fully Automatic Collation System for Press Machine Installation" is a device that collates card materials, SUS plates, and films in a specified orientation and with a specified number of layers and steps. After pressing, it separates the SUS plates from the card materials and re-supplies them to the collation area after cleaning the SUS plates. To address the issues caused by static electricity during the separation of SUS plates and products after the collation process, the operation has been fully automated. This ensures a stable production quantity through continuous operation and improves the tact time. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement proposals after delivery. 【Simple Specifications】 ■ Dust is shut out by a cover that encloses the entire device ■ Films and intermediate cores are automatically supplied *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "Integrated Circuit Height Measurement Inspection Device Type 1" is a product that can accommodate both automatic measurement control from automatic loading and manual measurement with a single workpiece set manually. It is an inspection device that loads lead frames stored in a slot magazine one by one onto the measurement stage and performs 3D height measurement. The device shown is a reference model. We can accommodate the creation of similar products or entirely new devices, so please feel free to contact us. 【Simple Specifications】 ■ Measurement possible within a viewing angle of 10mm and a height of 0.7mm ■ Maximum 99 registered recipes ■ Minimum movement resolution of 1μ for X and Y axes ■ Maximum X-axis stroke of 300mm and maximum Y-axis stroke of 100mm *For more details, please refer to the PDF materials or feel free to contact us.

• Transistor
• Other measurement, recording and measuring instruments

The "Integrated Circuit Height Measurement Inspection Device Type 2" is a product capable of measuring heights within 0.7mm in a field of view of 10mm. It loads lead frames (maximum size 30×50) stored in a slot magazine one by one onto the measurement stage to perform height measurements. It ejects defective items based on inspection results and automatically fills good products into empty pockets. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement proposals after delivery! The devices shown are examples of our production achievements. Please feel free to contact us as we can accommodate similar devices or new productions based on this reference.

• Other semiconductor manufacturing equipment

The separation work of SUS plates and film sheets after the collating press involves challenges related to static electricity. Therefore, Rise One has achieved fully automated equipment for the separation of SUS plates after pressing and for cleaning the SUS plates to re-supply them to the collating section. This ensures full automation of the collating process and stable production numbers through continuous operation, while also improving the takt time. ◇ The collating configuration can be arbitrarily set according to the front and back of the product, orientation, position, presence or absence of film, thickness of the SUS plate, and can also accommodate changes in the order of product supply. ◇ Completion of collating and supply to the press machine in 10 stages/40 minutes. One stage consists of 10 layers (one layer made up of SUS plate, film, product, film, and SUS plate). 200 products/40 minutes. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustment, installation, and maintenance and improvement proposals after delivery.

• Other assembly machines

We supply ceramic wafers through a magazine, measure and manage the resistance values. After measurement, we discharge the packaged products. ◇ Measurement result management function: CSV files are created and saved for each lot on the PC side, with a center value calculation function included. ◇ Four products with a center value of ±0.25% are taken out and packaged one by one. ◇ Label printing function: After outputting the specified variety code with a label printer, it is affixed. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustment, installation, and maintenance or improvement and modification proposals after delivery!

• Other assembly machines

◇ECU inspection device ◇Lighting function inspection device ◇LED inspection jig ◇Handle ECU inspection device ◇Actuator controller ◇Appearance inspection device ◇Fully automatic sorting and peeling device ◇Card cleaning and appearance inspection device ◇Magnetic tape transfer device ◇Four-layer sorting machine ◇Semiconductor wafer automatic transport mechanism ◇Ultrasonic inspection machine automatic supply device ◇Imprint device ◇Mask aligner ◇Fully automatic double-sided exposure device ◇Roller pressure type imprint device ◇Integrated circuit height measurement inspection device ◇Automatic calibration device ◇Soldering appearance inspection device ◇Coating inspection device (The above is just an example) Please feel free to contact us, as we can accommodate similar devices or new productions based on this reference. Our company responds to various customer requests, including the development of devices not available in the market, compact equipment with carefully selected minimal functions, and modifications to currently used equipment, utilizing Rise One's technology and experience. We provide a consistent service from development and design to assembly and maintenance after delivery, adding value to your important equipment and supporting your energy-saving and labor-saving initiatives. Please entrust your requests to our Rise One engineers, who have accumulated knowledge and experience from various FA industries.

• Other assembly machines

Align the set product sheet, apply hot melt, then conduct image inspection and discharge for transport. ◇Alignment: Fix the product with vacuum suction. After detecting the target mark with a camera, correct it using the XYθ axes of the table. We provide a consistent service from development and design to assembly and maintenance after delivery. We add value to important equipment and support our customers in energy saving and labor reduction.

• Other image-related equipment

Remove the wafer from the carrier, perform positional correction with pre-alignment, and supply the wafer to the inspection unit. After inspection, automatically eject the wafer and store it back in the original position of the carrier. ◇ Pre-alignment mechanism: XY axis stroke: ±2mm or more, θ axis stroke angle: ±15 degrees or more, suction table We provide a consistent service from development and design to assembly and maintenance after delivery. We add value to important equipment and support our customers in energy saving and labor reduction.

• Semiconductor inspection/test equipment

Automatically loads the workpiece placed on the measurement stage, performs automatic calibration, outputs the measurement values, and automatically discharges each measurement stage after calibration is complete. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement proposals after delivery! The equipment listed is a record of our manufacturing achievements. Please feel free to contact us as we can accommodate similar equipment or new manufacturing based on this reference.

• Other measurement, recording and measuring instruments

◇The case loaded with products will be automatically transported. ◇Lot information will be read using a QR code, and it will be input into the ultrasonic flaw detection inspection device to output image analysis data. ◇After inspection, air blow will be used to remove moisture and discharge it. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement proposals after delivery! The listed equipment is a record of our manufacturing achievements. Please feel free to contact us as we can accommodate similar equipment or new manufacturing based on this reference.

• Other conveying machines

◇This is an automatic high-speed yarn bundle forming machine that shapes yarn into cocoon-like forms and wraps them with non-woven fabric. ◇The automatic high-speed yarn bundle forming machine winds the yarn, forms it into cocoon-shaped bundles, discharges them via a conveyor, and wraps and fuses non-woven fabric around the yarn bundles to shape them. Our company offers a comprehensive service from the development and design of FA equipment to assembly and adjustment, installation, and maintenance or improvement and modification proposals after delivery!

• fiber

The inspection results, text data, and image files will be output to external devices. ◇ Takt time: 4,000 sheets/hour (0.9 sec/sheet) ◇ Front and back appearance inspection: using a suction conveyor and line camera ◇ Defective card ejection function Our company provides a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement and modification proposals after delivery!

• Other assembly machines

We conduct image and quality inspections of processed sheets, punch the NG areas, and handle them accordingly. ◇ Takt time: 36 seconds/sheet (100 sheets/hour) *18 processes completed per sheet ◇ NG punch position and size can be set ◇ Collation with ultrasonic welding machine. Welding time is 0.8 seconds per cycle. Collation accuracy is ±0.2 mm ◇ Anti-vibration measures for cameras and lenses Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement and modification proposals after delivery!

• Other assembly machines

While leveraging the strengths of our customers' valuable existing equipment, we will fully commit to upgrading and upcycling the equipment by integrating our employees' skills and knowledge to enhance work efficiency and productivity. Additionally, we will focus on maximizing the effective use of our customers' assets by pursuing high quality based on simplicity and ease of use. From design to manufacturing, including system design, we will propose a forward-looking, multifaceted approach to realize our customers' requests and deliver satisfaction and peace of mind.

• Assembly Machine
• Assembly robot

Our company manufactures products to meet our customers' needs for automation, labor saving, and upgrading existing equipment. ◆ Roll pressure type imprinting device: A device for UV imprinting from large area molds to glass substrates (transfer method - pressure method using a transfer roller, transfer speed - 0.1mm/second to 50.0mm/second) ◆ Imprinting device: A device for transferring from a mold to a wafer (supervised by Tsukuba Research Institute and Minimal Fab Technology Research Association) ◆ Minimal imprinting device: A device for transferring from a mold to a workpiece (supervised by Tsukuba Research Institute and Minimal Fab Technology Research Association) ◆ Imprint stepper: A device that performs high-precision positioning at the nanometer level and conducts UV imprinting from a mold to a wafer in multiple stages (supervised by Tsukuba Research Institute and Minimal Fab Technology Research Association)

• Other semiconductor manufacturing equipment

The device dimensions are 2200x2200x1900(H)mm, and we have compactly manufactured a four-layer collator. ◇ Tact time: 30 seconds/set (for 4 sheets) ◇ Alignment specifications: Two cameras capture the reference position of the film and the alignment marks, correcting them on the XYθ axes ◇ Synchronized operation function with two scalar robots Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement and modification proposals after delivery!

• Other processing machines

To address the situation where customers are struggling with static electricity issues during the separation of SUS plates and products after the collating process, we have fully automated the operation. This ensures a stable production quantity through continuous operation and also improves the takt time. ◇ After separation, the film and SUS plates are cleaned and resupplied to the collating area. ◇ The collating configuration can be set arbitrarily according to the front and back of the product, orientation, position, presence or absence of film, thickness of the SUS plate, and changes in the order of product supply. ◇ The collating and supply to the press machine is completed in 10 stages/40 minutes. One stage consists of 10 layers (one layer consists of SUS plate, film, product, film, and SUS plate). 200 products in 40 minutes. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement and modification proposals after delivery!

• Other conveying machines

Achieves stable magnetic tape transfer through the combination of independently driven hot rollers and an advanced tape guide system. The EPC control of the oversheet improves sheet running performance and maintains stable tape transfer position accuracy. Additionally, it is equipped with a tape position deviation monitoring function using a CCD camera.

• Other processing machines
• Other industrial robots

A device that applies UV-curable resin onto a glass substrate, places a mold on top, and uses a high-precision, pressure-controlled roller to apply pressure and bonding, followed by curing and patterning through UV irradiation. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement proposals after delivery! The listed device is a record of our manufacturing achievements. Please feel free to contact us as we can accommodate similar devices or new manufacturing requests based on this reference.

• Other semiconductor manufacturing equipment

If it is related to internal crack inspection, it can be applied to work where X-rays can be used. Our company offers a comprehensive service from the development and design of FA equipment to assembly and adjustment, installation, and maintenance or improvement and modification proposals after delivery! The listed equipment is a record of our manufacturing achievements. Please feel free to contact us as we can accommodate similar equipment or new manufacturing based on this reference.

• X-ray inspection equipment

Substrate soldering appearance inspection device

• Visual Inspection Equipment

It can be applied as a position deviation inspection device for workpieces that require front-and-back correspondence.

• Other inspection equipment and devices

Not only for plastic cards, but it can also be applied as an edge cutting machine for cuttable work.

• Plastic processing machines (cutting and rolling)

In addition to completed devices and assembled products, we can also create custom add-on items tailored to your needs. From small items to large ones, you can trust us with your requests.

• others

It has a built-in 60-pin connector (I/O, measurement pins) and a 6-pin connector (power supply), which can be assigned according to the inspection requirements. High-speed LED lighting inspection using a camera is also possible, with sequential lighting inspection in as short as 3ms.

• Other process controls

From simple jigs with only OK/NG lamps to jigs using touch panels, they can be used anywhere as long as there is power and air.

• Other process controls

Standard inspection device for using inspection jigs.

• Other process controls

Perform ROM writing and function testing on multiple boards (up to 8) before splitting. Convey the boards on a conveyor and conduct inspections at each stage. Capable of accommodating boards of various sizes.

• Other process controls

It is possible to build a fully automated line.

• Other process controls

Conduct characteristic testing in the state of the substrate.

• Other process controls

A mechanism that uses weights for measurement and applies the same load in the forward and depth directions.

• Other process controls

Rotation inspection for swivel function.

• Other process controls

Conducted axis expansion and contraction inspection, and noise inspection.

• Other process controls

The inspection software was developed using LabView, which is primarily used in the inspection equipment. For customers who do not have a license, it can also be provided in exe format.

• Other process controls

It is possible to send commands to the onboard ECU board using LIN-CAN communication.

• Other process controls

Inspection device for operation checks of white goods.

• Other process controls