シチズンファインデバイス List of Products and Services

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

Customers in the telecommunications industry have limited experience and knowledge regarding sub-mounts, which has led to an inability to engage in equal discussions. As a result, most specifications were determined based on proposals from manufacturers, leading to issues such as defects arising later. Our company provides detailed technical explanations and considerations for each of the customer's concerns and requests, allowing us to make proposals on the spot. As a result, we created a specification document and held follow-up meetings to ensure the customer fully understood it before finalizing and delivering the document, which led to very appreciative feedback from them. [Case Summary (Excerpt)] ■ Concerns about sub-mounts - Limited experience and knowledge regarding sub-mounts - Inability to engage in equal discussions with the sub-mount manufacturer found - Most specifications were determined based on proposals from the manufacturer, resulting in defects later on *For more details, please refer to the related links or feel free to contact us.

Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.