テクシード Product Lineup

We will perform the following tasks using the RD200: 1. Mount BGA on a prototype board that has SMDs placed by hand (alignment mounting function). Soldering will be done using a nitrogen reflow oven. For mass production, a mounter will be used. 2. Remove the BGA mounted on the board (reflow function). A measurement board and BGA may be needed to measure the temperature profile. Custom nozzles may be required. 3. Reball the removed BGA (BGA rework). We provide the solder balls necessary for reballing. For reballing, two types of metal masks (for solder printing and ball alignment) are required. We have masks available for 1.27mm pitch: suitable for most BGAs, 1.0mm pitch: suitable for most BGAs, and 0.8mm pitch: suitable for most BGAs. 4. Mount and solder BGA/CSP/LGA on a board that has other components installed (alignment mounting function / reflow function).

• others

In our company, for high production volumes and components compatible with the mounter, we use the JUKI KE740 mounter, which can handle a maximum board size of 360×410 (510) and chip sizes up to 1005 type, as well as QFP/TSOP with a 0.4mm pitch. For low production volumes and components that are not compatible with the mounter, we print solder using a metal mask and perform hand placement assembly. If there is no metal mask, we carry out hand soldering using a soldering iron.

• Other assembly machines