Texeed Foundation Renovation and Repair

We also accept requests for pattern cutting of substrates, BGA replacement, and reballing only. Please feel free to consult with us.

We will perform the following tasks using the RD200: 1. Mount BGA on a prototype board that has SMDs placed by hand (alignment mounting function). Soldering will be done using a nitrogen reflow oven. For mass production, a mounter will be used. 2. Remove the BGA mounted on the board (reflow function). A measurement board and BGA may be needed to measure the temperature profile. Custom nozzles may be required. 3. Reball the removed BGA (BGA rework). We provide the solder balls necessary for reballing. For reballing, two types of metal masks (for solder printing and ball alignment) are required. We have masks available for 1.27mm pitch: suitable for most BGAs, 1.0mm pitch: suitable for most BGAs, and 0.8mm pitch: suitable for most BGAs. 4. Mount and solder BGA/CSP/LGA on a board that has other components installed (alignment mounting function / reflow function).

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