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  2. Electronic Components and Semiconductors
  3. 株式会社積層金型
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Electronic Components and Semiconductors
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株式会社積層金型

addressHiroshima/Kure-shi/Aga South 2-10-1
phone0823-73-4565
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last updated:Dec 26, 2011
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Manufacturing of laminated molds using diffusion bonding.

Achieving ideal temperature control piping tailored to product shapes! We also accept orders for joining various parts and molds.

The "Diffusion Bonding Laminated Mold" is a product with high strength at the bonding interface. It can be sliced at split surfaces of arbitrary heights and water channels can be arranged, achieving ideal temperature control piping that follows the product shape. Since it is processed and bonded using commercially available steel materials with conventional machine tools, it is advantageous in terms of material costs, processing costs, and delivery times compared to metal 3D printers and similar technologies. Our company also has a track record in producing precision case molds for semiconductor components and hotspot countermeasures. Please feel free to contact us. 【Features】 ■ High degree of freedom in water channel design ■ Achieves ideal temperature control piping that follows the product shape ■ Can use standard mold steel ■ Advantageous in terms of material costs, processing costs, and delivery times compared to metal 3D printers and similar technologies ■ High strength at the bonding interface allows for conventional machining *For more details, please refer to the PDF document or feel free to contact us.

  • Other molds

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Mitsui Layered Mold Co., Ltd. - Contract Machining Services

Molds are the rice of industry: Mold innovation - How layered molds make the impossible possible.

3D NC machining Wire electrical discharge machining Heat & cool forming (300 tons)

  • Electric discharge machine

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Stacked Mold Co., Ltd. Heat & Cool Molding

It will be possible to improve weldless high-cycle processing, component accuracy, and transferability.

The combination of diffusion bonding laminated molds and heat & cool molding enables weldless production, high cycle rates, improved part accuracy, and enhanced transferability. By heating the mold with steam, the resin flows more easily, improving transferability. As a result, part accuracy is also enhanced. Additionally, this method can be applied to resins with high strength. Furthermore, rapid heating and cooling are achieved through the water channels in the laminated mold, allowing for high cycle rates.

  • Mold Design

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Stacked Mold Co., Ltd. General Press Mold

Press mold manufacturing and machining contract services.

We also accept orders for the production of casting and steel press molds, as well as machining services. Please feel free to consult with us.

  • Mold Design

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Diffusion bonding contract - bonding experiment

Molds are the rice of industry: Mold innovation - How layered molds make the impossible possible.

Diffusion bonding is a method of joining materials by bringing them into close contact and applying pressure at a temperature below the melting point of the base materials, to the extent that plastic deformation is minimized, utilizing the diffusion of atoms that occurs between the bonding surfaces. In diffusion bonding, it is sometimes the case that metal is interposed between the bonding surfaces to facilitate the joining process.

  • Mold Design

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Mitsui Layered Mold Co., Ltd. High-Cycle Resin Molding Mold

Diffusion bonding laminated molds and diffusion bonding laminated blocks (can be selected from channel design to finishing)

The features of laminated molds include the following: 1. High design flexibility for cooling water channels. 2. Thickness and materials can be freely combined. 3. The production of laminated raw materials from commercially available sheet materials can be completed in a shorter time. In particular, the ability to create highly flexible water channels allows for a reduction in cooling time, enabling high cycle rates. Therefore, it becomes possible to speed up manufacturing.

  • Mold Design

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