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  6. Manufacturing of laminated molds using diffusion bonding.

Manufacturing of laminated molds using diffusion bonding.

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last updated:Nov 16, 2020

株式会社積層金型
株式会社積層金型
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Achieving ideal temperature control piping tailored to product shapes! We also accept orders for joining various parts and molds.

The "Diffusion Bonding Laminated Mold" is a product with high strength at the bonding interface. It can be sliced at split surfaces of arbitrary heights and water channels can be arranged, achieving ideal temperature control piping that follows the product shape. Since it is processed and bonded using commercially available steel materials with conventional machine tools, it is advantageous in terms of material costs, processing costs, and delivery times compared to metal 3D printers and similar technologies. Our company also has a track record in producing precision case molds for semiconductor components and hotspot countermeasures. Please feel free to contact us. 【Features】 ■ High degree of freedom in water channel design ■ Achieves ideal temperature control piping that follows the product shape ■ Can use standard mold steel ■ Advantageous in terms of material costs, processing costs, and delivery times compared to metal 3D printers and similar technologies ■ High strength at the bonding interface allows for conventional machining *For more details, please refer to the PDF document or feel free to contact us.

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2020-11-16_15h59_46.png

Manufacturing of laminated molds using diffusion bonding.

2020-11-16_15h59_46.png
2020-11-16_15h59_46.png
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【Other Features】 ■ After joining, it is possible to perform hardening, cutting, grinding, and mirror finishing. ■ Since the linear expansion coefficient and surface finish are equivalent to the base material, it is easy to handle as a nested component. ■ Clearances during mold assembly can be designed in the same way as before. *For more details, please refer to the PDF document or feel free to contact us.

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Manufacturing of laminated molds by diffusion bonding

Manufacturing of laminated molds by diffusion bonding

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株式会社積層金型

株式会社積層金型

Electronic Components and Semiconductors

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Mitsumori Co., Ltd. is a company established to commercialize the laminated mold proposed by former University of Tokyo Institute of Industrial Science Professor Takeo Nakagawa. Founded in April 2001, it is a relatively new company, but its representative, Hisao Yamazaki, has 30 years of experience in mold design for automotive parts at Mazda Corporation. Our company was the first in the world to commercialize metal sheet laminated molds in the field of press molds. Subsequently, we applied diffusion bonding technology to the joining of laminated plates, successfully realizing the practical application of diffusion-bonded laminated molds. Moving forward, we will continue to advance research, development, and manufacturing of laminated molds, striving to develop products that can contribute to everyone.

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