シグナス Product Lineup

We provide high-frequency and high-speed transmission boards for 5G communication devices, optical transceivers (SFP/SFP+/QSFP28/QSFP-DD), Wi-Fi modules, and more. We handle a wide range of high-frequency compatible materials, from PTFE-based (such as Rogers) to non-PTFE-based (TUC, Shengyi, ISOLA), and cost-reduction designs are possible by using high-frequency materials only in specific layers through a material hybrid structure with FR-4. We support low-loss materials such as Synamic6/6G/6N and TU872 SLK/LK, and we have manufacturing achievements for 100G/400G optical transceiver boards using composite technologies such as R-5775G material, build-up, back drilling, and copper coin embedding. We also accommodate a 9-layer build-up full stack structure (using Megtron6, L/S=75/75μm).

• Circuit board design and manufacturing

This is a service for restoring physical circuit boards for which repeat production is not possible and manufacturing data cannot be found. We restore manufacturing data from the physical circuit board, enabling reproduction. We also support analysis of multilayer boards and assembled boards. We can create schematics and BOM (Bill of Materials) from the assembled boards. We also partially support restoration from plot PDFs. Additionally, we can procure compatible products such as harnesses and cases, and extract microcontroller programs.

• Circuit board design and manufacturing

We handle the artwork (layout) design of printed circuit boards in-house. Our skilled designers, who leverage the manufacturing process know-how accumulated through strong collaboration with PCB manufacturers, consider the capabilities and productivity in accordance with the design rules of each supplier. We also support the conversion from laid-out DXF data to Gerber data. Supported CAD: CR-5000 BD, CR-8000 DF, PADS, Altium, Allegro, CADLUS, Quadcept. We also provide various simulation analyses for SI/PI/EMI (HyperLynx, Siwave, PIStream, DEMITASNX). Data checks and corrections by in-house CAM editors are also performed free of charge.

• Circuit board design and manufacturing

We provide rigid-flexible substrates with a rigid part and a flexible part in an integrated structure. The rigid part can support up to 10 layers, and the flexible part can support up to 6 layers. In addition to the standard configuration, we can also accommodate special structures such as a configuration with two FPCs, a reinforced plate for the FPC part, two types of materials for the rigid part, and different thicknesses for the rigid part. We also have a track record of manufacturing high-multilayer rigid-flex (5-16-5 structure, flexible part 2 layers × 8, Isola 370HR + Dupont AP8525R materials). We have experience in applications for camera modules, wearable devices, and sensor components.

• Circuit board design and manufacturing

We provide ceramic substrates for power devices and IGBT applications that require high heat dissipation and high insulation. We offer two types: alumina (Al2O3, thermal conductivity ≧ 24W/m·K) and aluminum nitride (AlN, thermal conductivity ≧ 170W/m·K). Our products support DPC (operating temperature -55 to 350℃) and DBC (-55 to 800℃), with high-precision processing capabilities for maximum dimensions of 128×178mm, minimum pattern width of 0.100mm/pattern spacing of 0.075mm, and minimum hole diameter of 0.1mm.

• Circuit board design and manufacturing

We provide thick copper substrates for applications requiring high current and high heat dissipation, such as EV (electric vehicle) chargers, power semiconductors, and power supply equipment. We support outer layer copper foil thicknesses up to 762μm and inner layers up to 381μm. We also accommodate copper inlays (embedded metal from 1.0 to 3.0mm) and copper core substrates, achieving high current and high voltage resistance. We have a track record of manufacturing substrates for electric vehicle chargers, including 12-layer t=5.0mm boards with 3.0mm copper inlays. It is also possible to combine T-type copper coin embedding with high-frequency compatible materials and create composite structures with rigid FPCs.

• Circuit board design and manufacturing

This is a printed circuit board assembly service that supports SMT (Surface Mount Technology), flow soldering, and manual assembly. For small-scale prototypes, manual assembly incurs no initial costs, and we can handle 0603 size (mm) chips and 0.4mm pitch connectors through manual assembly. For medium-volume products, we use a simple mask and manual placement with reflow (can accommodate loose parts), while mass production is handled by machine assembly (can support nitrogen and vacuum reflow). We also accommodate insertion assembly (discrete assembly) using self-insertion machines. X-ray inspection during BGA assembly and BGA rework are also available. By offering a one-stop service from PCB procurement to component procurement, assembly, and inspection, we reduce intermediate margins and achieve cost benefits. We have approximately 3,000 types of in-house stock (with many chip CRs on reels), allowing you to leave the troublesome collection of small quantities of various parts to us. We will select and propose the optimal assembly partner from five domestic companies and one in China.

• EMS

We manufacture ATE boards at a top-tier overseas manufacturer. We have numerous achievements in probe cards, performance boards, burn-in boards, and more. AW design support (domestic) is also available.

• Printed Circuit Board

At Cygnus, we can handle various printed circuit board services including "pattern design," "board manufacturing (prototype/mass production)," and "board assembly." 【I want to reduce costs anyway!】 ○ I want to create prototypes for development at a low cost! We offer an initial low-cost plan with no repeats for prototype manufacturers. Contributing to development cost reduction, we provide double-sided boards starting at ¥20,000. ○ I want to purchase small lot products with mass production quality at a low price! We manufacture and inspect even small lots of 5 or 10 pieces with mass production quality. We offer low prices not only for initial costs but also for the unit price of the boards. ○ I want to purchase multilayer boards and specially processed boards at a low price! We have many achievements with high multilayer boards and non-through-hole boards. We promise high quality while leveraging the price advantages of overseas manufacturing. ○ The cost of product purchases has increased due to a decrease in production volume or cessation! The medium-volume manufacturers in China that Cygnus deals with show the most cost advantages for areas ranging from a few square meters to several dozen square meters. It is not uncommon for the quantity to decrease from the estimated lot during development, causing the unit price to unexpectedly spike. In such cases, please feel free to consult with Cygnus.

• Circuit board processing machine

Single-sided boards start from ¥50,000, and double-sided boards start from ¥70,000 for FPC prototyping. In Japan, the cost for a single prototype of FPC easily exceeds ¥100,000. The high costs of laser processing and molds have made it difficult to conduct FPC prototyping. At Cygnus, we have set our prices to make FPC prototyping more accessible.

• Other electronic parts

This is an announcement from Cygnus Corporation regarding "aluminum base substrates."

• Other electronic parts