Educational and Research Institutions

Tohoku Techno Arch Co., Ltd.

addressMiyagi/Aoba-ku, Sendai-shi/Aobayama 6-6-10, 2nd floor, Tohoku University Center for Advanced Future Science and Technology Research
phone022-222-3049
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Tohoku Techno Arch Co., Ltd. List of Catalogs

271～315 item / All 397 items

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Tohoku University Technology: The Water Containing Hollow Nanoshell and its Manufactuaring Method: T20-647

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Tohoku Univ. Technology : Method for Producing Nanobubble Water (Permanganate Ion Water) : T20-643

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Tohoku Univ. Technology :Cathode material for rechargeable magnesium batteries: T22-266

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Tohoku Univ. Technology : CNS editing for controlling the crop phenotypes in a multistage manner : T22-344

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Tohoku Univ. Technology : Inducer with slit : T21-050

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Tohoku Univ. Technology : Squeezed Light Generator : T22-338

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Tohoku Univ. Technology : Biological image processing program: T21-091

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Tohoku Univ. Technology : Swelling followed by ball-milling for waste wire-harness recycling : T19-082_T19-440

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Tohoku Univ. Technology :Hierarchically structured titanium nanosurface : T23-076

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Tohoku Univ. Technology : Method for Determining Sleep Apnea Syndrome (SAS) : T23-008

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Tohoku Univ. Technology : Simple method to siliconize Mo/W : T21-214

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Hirosaki Univ. Technology : New catalyst for inducing same oxidation reaction under illumination even in the dark : K23-025

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Hirosaki Univ. Technology : New catalyst for inducing same oxidation reaction under illumination even in the dark: K23-026

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Hirosaki Univ. Technology : New catalyst for inducing same oxidation reaction under illumination even in the dark : K23-027

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Tohoku Univ. Technology : Flexible & Robust Liquid Crystal Displays : T23-063

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Hokkaido Univ. Technology : New Adsorbent containing Copolymer : HK24-008

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Tohoku Univ. Technology: Investigation method of breast disease: T11-183

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Tohoku Univ. Technology : Electrically moisturized contact lenses : T18-478

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Hokkaido Univ.Technology : Embolizing agent and kit for blood vessel Embolization : HK24-005

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Hirosaki Univ. Technology : Method for improving thermoelectric power of thermoelectric semiconductor : K23-013

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Hirosaki Univ. Technology : Reliability evaluation method of Multilayer wiring : K23-014

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Hirosaki Univ. Technology : Thin and flexible force sensor Related patents (1/4): K23-011_K23-022_K23-030_K24-002

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Tohoku Univ. Technology :Carbon recovery from dry smelting flue gases : T21-205

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Tohoku Univ. Technology : Method for producing tertiary alcohol : T22-005

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Tohoku Univ. Technology : ADVANCED TACTILE SENSOR SYSTEM : T19-890

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Tohoku Univ. Technology : New Pearlescent Pearl pigment : T24-003

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Tohoku Univ. Technology : Titanium ion redox flow battery : T21-163

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Tohoku Univ. Technology: Intestinal bacteria that reduce uremic substances : T22-046

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Tohoku Univ. Technology : Dinitrogen pentoxide generator: T20-332_T21-149

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Tohoku Univ/Tohoku Institute of Technology : Transducer, Force Sensor and Sensor Unit : T21-171

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Hokkaido Univ. Technology : Molded body and method for producing Polymer Crosslinked body : HK24-012

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Hokkaido Univ. Technology : Light-driven actuator : HK24-010_HK24-015

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Tohoku Univ. Technology : Batch fabrication method by laminating method : T24-029

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Hokkaido Univ. Technology : Bio-Catalytic Approach to Mesoscopic Particle Synthesis : HK24-007

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Tohoku Univ. Technology : Method for producing spherical zinc oxide : T19-905

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Tohoku Univ. Technology : Multilayer structure and its manufacturing method : T24-027

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Tohoku Univ. Technology : Device to measure nanoparticle distribution : T24-030

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Tohoku Univ. Technology : Room temperature wafer bonding : T24-033

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Hokkaido Univ. Technology : High-sensitivity single-sided pressure sensor with depth detection：HK24-002

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Tohoku Univ. Technology : Estimation method of grain size of crushed stone : T24-032

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Hokkaido Univ. Technology : Electrode and control method of Overvoltage : HK24-016

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Hokkaido Univ. Technology : The most Advanced Analog RoF technology of Beyond 5G (6G) : HK24-009

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Tohoku Univ. Technology :Aluminum recycling technology : T21-372

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Tohoku Univ. Technology:Diaper sensors:T24-065

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Tohoku Univ. Technology : The Process of Copper Electrorefining : T23-082

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