アドウェルズ List of Products and Services

We would like to introduce our ultrasonic process optimization system, 'UMOS.' With this system, even those with limited experience can easily optimize bonding and cutting conditions. By combining the output of bonding results and cutting results with input conditions, we can improve the accuracy of optimal conditions. For example, if a challenge arises in the bonding process where oxidation or deformation needs to be minimized, UMOS Navi will suggest adjustments to process conditions (load, amplitude, time) by selecting the direction of optimization towards the suppression of oxidation or deformation. [For these concerns] ■ Struggling to set bonding and cutting conditions tailored to various materials ■ Optimization methods change when the person in charge changes ■ Bonding and cutting conditions become personalized *For more details, please refer to the related links or feel free to contact us.

• Other processing machines

We would like to introduce our "Ultrasonic Direct Bonding Technology for Substrates." In comparison with our TEG substrates, the connection resistance achieved through ultrasonic bonding is 14mΩ, which is a 70% reduction compared to ACF connections at 52mΩ. This contributes to the high performance of electronic devices, such as high-speed data transfer. Additionally, the bonding time with ultrasonic bonding is approximately 0.2 to 1 second, allowing for a significant reduction in time compared to ACF connections that require resin melting and curing. 【Features】 ■ Low resistance bonding: 70% reduction compared to ACF ■ Short bonding time: bonding in under 1 second ■ Room temperature bonding: no bonding misalignment due to thermal expansion of the substrate *For more details, please download the PDF or feel free to contact us.

• Other processing machines

We would like to introduce our technology, "DMB Joining Application using Ultrasonic Welding." With Adwells' ultrasonic welding devices "UB2000/3000/5000LS," we achieve the joining of DMB sheets made from copper (Cu) and aluminum (Al) for power devices and areas requiring low thermal conductivity. The fine protrusions on the DMB sheets serve as the joining points, making it easier for materials to bond together and allowing for adaptation to various applications. 【Features】 ■ Can join materials that can only withstand low loads and low power ■ Does not scratch the surface of materials ■ Can join materials with a large surface area ■ Can join thicker materials ■ Can join devices that are molded *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The "UC1000SA" is a standalone ultrasonic cutter that can cut multilayer materials, such as all-solid batteries with a multilayer structure, without dragging. Thanks to the various sensor information built into the device, the process operation can be understood in detail, making it effective for process startup and mass production management. Additionally, by applying high-frequency vibrations from ultrasonic waves to the blade, it cuts while suppressing material deformation, resulting in high-quality cross-sections without burrs or warping. 【Features】 ■ Cuts metal foils with high-quality cross-sections ■ Cuts multilayer materials without dragging ■ Easy integration into automated systems ■ Comprehensive process monitoring capabilities *For more details, please download the PDF or feel free to contact us.

• Other processing machines

We would like to introduce our "Flexible Substrate Ultrasonic Joining Applications." The advantages of ultrasonic joining include low resistance due to direct bonding, the ability to join in less than one second, and no thermal expansion of the substrate. Additionally, the joining variations can be done with bumped leads and flying leads. 【Features】 ■ Low resistance joining ■ Short joining time ■ Room temperature joining *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The Adwells ultrasonic pin bonding device PB2000MS and ribbon bonder RB0300SS can directly form heat dissipation pins and substrate mounting pins on ceramic substrates and organic substrates. With ultrasonic bonding, it is possible to form heat sinks without using TIM or solder, achieving a thermal conductivity approximately 34 times that of TIM and about 7 times that of solder. (Figure 1) The formation of heat sinks through ultrasonic bonding comes in two types: pin bonding and ribbon bonding. In pin bonding, simultaneous bonding of up to 4 pins can be achieved at once, allowing for programmable heat sink formation. (Photo 1) In ribbon bonding, Cu ribbons or Al ribbons are continuously bonded to form heat sinks. The device is equipped with a multi-feeder, allowing for automatic switching of ribbon materials and thicknesses. (Photo 2) ~ For more details, please download the PDF document and check it out ~ *) We also accept evaluation tests using demo machines, so if you are interested, please contact us using the form below.

• Welding Machine

Ultrasonic bonding devices used in various fields, such as power module terminal bonding and dissimilar metal bonding. At Adwells, we offer a lineup of "ultrasonic bonding devices" for a wide range of applications from R&D to mass production. Each device is compatible with terminal bonding, heat sink formation, DMB bonding, and more. We also conduct evaluation tests with demo units, so if you are interested, please contact us using the form below. 【Features of the device】 Terminal Bonding - Covers optimal bonding conditions for various terminals with a single device - Starts bonding by pressing down on the float with grounding load Heat Sink Formation - Directly forms fins (pins/ribbons) on the back surface of the substrate - High thermal conductivity (37 times that of TIM) due to direct bonding DMB Bonding - Can bond materials that can only handle low load and low output - No surface damage to materials during bonding: patternless horn - High thermal conductivity: about 7 times that of solder - Large area bonding *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Oscillator

In the manufacturing of "next-generation secondary batteries," including all-solid-state batteries, various forms of joining and material cutting are required to meet high quality standards. Additionally, when performing joining or cutting processes, measures must be taken in the manufacturing equipment to prevent the generation of hydrogen sulfide due to reactions with moisture in the air. Our company offers "ultrasonic bonding devices and ultrasonic cutters" designed for next-generation secondary battery specifications, aimed at the joining/cutting of electrode foils, joining between battery terminals, and cutting of green sheets. Each device utilizes our unique technology based on ultrasonic waves, enabling high-quality direct bonding at room temperature and cutting without dragging the material. We also provide a dry environment where the evaluation conditions and equipment specifications can be verified with actual machines, allowing for consideration of implementation. 【Features of the Equipment】 <Joining> ■ Ultrasonic bonding device capable of wide-ranging foil bonding and compatible with dry environments <Cutting> ■ Ultrasonic cutter capable of straight/shape cutting and suitable for dry environments ■ Can cut negative electrode foils, positive electrode foils, Li foils, etc. <Fusing> ■ Can continuously and freely fuse separator materials through programming For more details about the products, please refer to the materials. Feel free to contact us with any inquiries.

• Plastic processing machines (cutting and rolling)

Our company manufactures and sells "ultrasonic cutters" and also provides contract processing services. By applying ultrasonic waves to the cutting tool, we significantly reduce cutting load. This prevents dragging of composite materials and multilayer structures, achieving clean cross-sections without material deformation, burrs, or warping. We can achieve high-quality cutting even for materials that are difficult to cut precisely, such as resins, rubber, metal foils, and pre-fired ceramic materials. We accommodate not only straight blades but also shaped blades, offering a lineup from standalone models to those for mass production. 【Application Examples】 - Li batteries (cutting multilayer and single-layer foils) - Cutting of active material-coated electrodes - Thick copper cutting - TIM slice cutting - Green sheet cutting - Laminated film cutting - Soft material cutting - All-solid-state battery cutting *For more details on our products and services, please refer to the catalog.

• Processing Contract

Our company manufactures and sells "ultrasonic welding equipment" and also provides contract processing services. With our rigid clamp technology that holds the horn with high rigidity, we achieve stable ultrasonic welding across a wide range of applications, from low to high loads. Ultrasonic welding can be applied in various fields such as next-generation secondary batteries, semiconductor packaging, heat sink formation, and flexible substrate bonding. We offer a lineup of equipment ranging from standalone models to those for mass production. 【Application Examples】 - Next-generation secondary batteries (Li foil bonding, Li-copper foil bonding) - Semiconductor packaging - Heat sink formation (pin fin/ribbon fin) - Flexible substrate bonding - IGBT modules (terminal bonding) - Wire harness and electrical wire bonding - DMB (Dot Matrix Bonding) bonding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

The ultrasonic metal joining device 'UB2000/3000/5000LS' is an ultrasonic metal joining device suitable for power devices. The ultrasonic horn is directly clamped by a rigid clamp. This results in the ultrasonic head being highly rigid and compact. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining. The joining capability is enhanced by linear pressurization that increases the load as the joining progresses. 【Features】 ■ High rigidity horn clamp mechanism ■ High precision position control ■ High functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

• Welding Machine

The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.

• Welding Machine

The standalone ultrasonic metal joining device 'UB050/300/500SA' is a compact standalone ultrasonic metal joining device that is easy to place in production and development sites. With a built-in linear encoder and rigid clamp in the joining head, it accurately controls the position of the joint using a high-rigidity ultrasonic horn unit. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining, and improves joinability by increasing the load with linear pressurization as the joining progresses. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

• Welding Machine

The "PB2000MS" is an ultrasonic bonding machine for forming heat sinks compatible with Cu pins, Al pins, and hollow pins. With a dedicated horn for pin bonding, it allows for simultaneous bonding of up to 4 pins. It forms heat sinks at a rate of 4800 UPH. It efficiently bonds metal pins onto the substrate while picking up metal pins from a tray that holds the pins. 【Features】 ■ Simultaneous bonding of multiple pins ■ Programmable pin formation ■ Tray pin supply ■ Parts feeder pin supply (optional) *For more details, please download the PDF or feel free to contact us.

• Other assembly machines

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

• Other mounting machines

The ultrasonic seam welding machine 'SB200/400CE' is ideal for the lamination of power device materials and the butt connection of materials. By rotating the joint point, it enables large area welding and allows for continuous welding of roll-shaped materials and other continuous materials. 【Features】 - Achieves large area welding - Enables continuous welding - Equipped with joint quality management functions For more details, please contact us or download the catalog.

• Other processing machines

The "TB1000MS" is a mass production ultrasonic metal joining device suitable for inverter production. ■ It is suitable for electrode connections in high-temperature inverters and other applications. 【Features】 - Flexible production ⇒ Covers joining conditions suitable for various terminals with a single device - Strong against terminal float ⇒ Starts joining by pressing down on the float with an air servo - Color image processing ⇒ Stable alignment of terminals and horns through color image recognition *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The "UP-Lite1500" is a metal joining device suitable for transitioning from power device development to mass production. This machine is designed as a standalone unit with the premise of being integrated into a mass production system. Development recipes can be directly transitioned to mass production. By adopting a unique rigid clamp method for holding the horn, it achieves high rigidity while maintaining a highly flexible cantilever structure. 【Features】 ■ Suitable for standalone and device integration ■ High rigidity with a highly flexible cantilever structure ■ Integrated joining system with monitoring capabilities ■ Compatible with a wide range of applications *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

The "UC1000LS" is an ultrasonic cutter that assists in the precision cutting of industrial products using ultrasonic technology. By applying high-frequency vibrations to the blade, it suppresses material deformation during cutting, allowing for high-quality cross-sections. Additionally, by controlling the position with a high-precision actuator, it achieves half-cutting of thin materials. 【Features】 ■ Assists in the precision cutting of industrial products with ultrasound ■ Cuts metal and plastic materials with high-quality cross-sections ■ Achieves high-precision half-cutting even for thin materials ■ Allows for shape cutting with shaped blades ■ Cuts out small parts while feeding the material stage *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "GC1000MS" is a green sheet cutter capable of handling everything from fine cuts to vertical cuts of thick materials. By reducing cutting load, it achieves vertical cuts. The optional ultrasonic assist function reduces the cutting load on the blade, enabling vertical cuts of thick materials. Additionally, it is equipped with a process monitoring function that allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. 【Features】 ■ Capable of handling fine cuts to vertical cuts of thick materials ■ Achieves vertical cuts by suppressing elastic deformation ■ Precise positioning for component patterns using image recognition function ■ Equipped with process monitoring function *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)

The "UD1000MS" is an ultrasonic opening and impregnation device that has achieved complete impregnation UD tape manufacturing in a groundbreaking device size. ■ CFRTP UD Tape Opening and Impregnation By using ultrasound for the opening and impregnation of carbon fibers, which was traditionally done with air opening and heater heating, we achieve homogeneous opening and impregnation. 【Features】 - Effective application of ultrasound for opening and impregnation Carbon fibers are opened uniformly without damage, and high-viscosity thermoplastic resins are impregnated while suppressing voids. - Smooth surface and uniform cross-section In ultrasonic impregnation, the surface of the impregnated area is smooth, and the cross-section of the impregnated area shows uniform dispersion of carbon fibers. - Impregnation resin supply in film form Compared to traditional impregnation resin supply forms (powder, liquid phase), it can be supplied in film form, which has many advantages. - Compact device Ultrasonic technology has dramatically miniaturized the opening and impregnation device. It is small enough to be installed in press sites. *For more details, please download the PDF or feel free to contact us.

• Other processing machines