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片桐エンジニアリング

addressKanagawa/Tsurumi-ku, Yokohama-shi/Buttocks Hand 3-5-34
phone045-570-6886
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last updated:Mar 14, 2013
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片桐エンジニアリング List of Products and Services

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High-Density Radical Source "HDRS-114"

To realize a better plasma source, we will return to the fundamentals of plasma science!

The HDRS-114 is a high-density radical source designed for ultra-high vacuum applications, achieving both high-speed crystal growth and high-quality crystal growth. It adopts a hybrid plasma source that is not found in conventional radical sources, achieving a radical supply that is 100 times greater than traditional products. Our original hybrid plasma structure generates high-density radicals. 【Features】 - Achieves both high-speed crystal growth and high-quality crystal growth - Designed for ultra-high vacuum applications - Adopts a hybrid plasma source not found in conventional radical sources - Achieves a radical supply that is 100 times greater than traditional products (as measured by us) - Our original hybrid plasma structure generates high-density radicals *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Small VUV Spectrometer "RadiMo-DP, SP"

Compact design! The wavelength range is 115-200nm, suitable for various applications.

The "RadiMo-DP, SP" is a compact vacuum ultraviolet spectrometer developed for RadiMo, which can be used independently for vacuum ultraviolet spectroscopy applications. It is 1/3 more compact in volume compared to conventional vacuum ultraviolet spectrometers with the same level of wavelength resolution. Additionally, the wavelength scanning driver, high-voltage power supply for the photomultiplier tube, and preamplifier for the photomultiplier tube are housed in a control box compatible with 19-inch racks. 【Features】 ■ Compact vacuum ultraviolet spectrometer developed for RadiMo ■ Can be used independently for vacuum ultraviolet spectroscopy applications ■ More compact than conventional vacuum ultraviolet spectrometers of the same level ■ Wavelength scanning driver and other components are stored in the control box *For more details, please refer to the PDF document or feel free to contact us.

  • Spectroscopic Analysis Equipment
  • Analytical Equipment and Devices

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Three-Element Magnetron Sputtering Device 'NS-023'

Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.

The NS-023 is a ternary magnetron sputtering device capable of simultaneously depositing three types of targets. In addition to multi-target simultaneous sputtering, it supports various applications by adopting a platinum heater for high-temperature activation of the substrate (heater temperature: 950°C) and reactive sputtering. Additionally, it can accommodate assist plasma sources (ECR, ICP, etc.). 【Features】 ■ Capable of simultaneously depositing three types of targets ■ Supports various applications beyond multi-target simultaneous sputtering ■ Customizable according to experimental content and budget ■ Compatible with assist plasma sources *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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High Vacuum Deposition Device "KW-030D"

Equipped with a crystal vibration-type film thickness monitor! Compact design enables clean film formation.

The "KW-030D" is a high vacuum deposition device designed for small-scale production and experimental use in research institutions, featuring a compact design that allows beginners to operate it easily. By incorporating a turbo molecular pump, it enables film deposition in high vacuum conditions. Additionally, it is equipped with a substrate tilting mechanism, allowing for angled deposition by adjusting the rotation angles in two axes. 【Features】 ■ Easy operation for beginners ■ Equipped with a turbo molecular pump ■ Substrate tilting mechanism included ■ Three resistance heating evaporation sources, with optional EB heating support ■ Quartz crystal thickness monitor included *For more details, please refer to the PDF document or feel free to contact us.

  • Evaporation Equipment
  • Analytical Equipment and Devices

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F-RadiMo Radical Monitor "SP Type-RadiMo"

Absolute density measurement of fluorine radicals using vacuum ultraviolet absorption spectroscopy! Various applications for measurement as well.

The "SP-type RadiMo" is a device that can measure the absolute density of fluorine radicals in their ground state using absorption spectroscopy. The spectrum of the probe light emitted from the light source is calibrated with high precision. Additionally, it can measure in both emitting and non-emitting plasma. The F-RadiMo can be installed on the port of a process device for measurement. 【Features】 ■ Measurement of the absolute density of fluorine radicals ■ Capable of measuring in both emitting and non-emitting plasma ■ No calibration required for absolute density calculation ■ F-RadiMo can be installed on the port of a process device for measurement ■ Various measurement applications *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Other electronic measuring instruments

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CVD device "Nano Carbon Deposition Device"

Three types of sedimentation devices are available! Please choose according to your needs.

We would like to introduce the "Nano Carbon Deposition Device" handled by Katagiri Engineering Co., Ltd. This product is a CVD device capable of synthesizing nano carbon materials. In addition to the "CND-050LP," we offer a large-area nano carbon deposition device, the "LCND-200," and a PN nano carbon deposition device, the "NCD-050W." You can choose according to your application. 【Features】 ■ Capable of synthesizing nano carbon materials ■ Three types in the lineup ■ Selectable based on application *For more details, please refer to the PDF document or feel free to contact us.

  • CVD Equipment

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Device: Autonomous Nano Manufacturing Device

As part of the intellectual cluster creation project, jointly developed with Nagoya University and Nagoya Institute of Technology.

This project is a research initiative aimed at forming a "nanotechnology manufacturing cluster." The objective of the project is to conduct research and development on measurement smart sensors and nano-patterning technology based on a plasma diagnostic technique developed independently by Nagoya University for measuring atomic and molecular concentrations in a reaction space, ultimately leading to the development of an "autonomous nano-manufacturing device" that can automatically perform nano-order ultra-fine processing under optimal conditions at all times.

  • Other mounting machines

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Atmospheric pressure micro-hollow plasma robot-mounted μ-AP atmospheric pressure plasma

It is a device that creates the fourth state (plasma state) under atmospheric pressure.

Atmospheric Pressure Micro Hollow Plasma - The μ-AP atmospheric pressure plasma mounted on a robot is a device that creates the fourth state (plasma state) under atmospheric pressure. By designing the electrode structure in a hollow shape, the electron density of the plasma increases in the hollow section, generating high-density plasma. By optimally designing the distance between the electrodes, it has become possible to generate plasma under atmospheric pressure. The discharge gas blow forms the plasma jet. It can be applied to underwater plasma generation. For more details, please contact us or refer to the catalog.

  • Plasma Generator

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Radimo Radical Monitor <Opposing Type Radical Monitor DP Type>

This is the world's first ultra-compact radical absolute density measurement device that can be used in processes.

The Radimo Radical Monitor <Opposing Type Radical Monitor DP Type> is a monitoring device that measures atomic radicals in the gas phase generated during etching, surface treatment, and thin film production, enabling feedback into the process. It is the world's first ultra-compact radical absolute density measurement device that can be used in processes. It measures atoms present in the ground state in plasma using absorption spectroscopy, allowing for the selection of the optimal structure based on the measurement target and purpose. The measurement software is equipped with the latest calibration results from research conducted at Nagoya University’s Hori Laboratory. For more details, please contact us or refer to the catalog.

  • Other inspection equipment and devices

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CCP plasma etching device 'CCP-T60M/B2M'

High-precision and high-reliability oxide film microfabrication! Selectively generating radicals from process gases.

The "CCP-T60M/B2M" is a parallel plate etching device that achieves high precision and high reliability in oxide film microfabrication. It selectively generates radicals from process gases and applies 60MHz power to the upper electrode to obtain low electron temperature and high-density plasma. Additionally, it is equipped with a sequence program that constantly maintains appropriate etching process conditions. 【Features】 ■ Parallel plate etching device ■ Achieves high precision and high reliability in oxide film microfabrication ■ Selectively generates radicals from process gases ■ Applies 60MHz power to the upper electrode ■ Equipped with a sequence program *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment

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Vacuum equipment related products EBEP processing device <FAP-EB/2D>

It is optimal for the processes of CVD, etching, and surface modification.

The vacuum equipment-related product, EBEP processing device <FAP-EB/2D>, is a high-speed, high-quality surface treatment device using low-pressure high-density plasma, making it ideal for CVD, etching, and surface modification processes. In the low-pressure region, it can efficiently dissociate and ionize process gases using an energy-variable electron beam, enabling the generation of high-density active species. It creates plasma states that cannot be achieved with CCP plasma or ICP plasma, allowing for precise film formation, etching, and surface modification of various materials. It supports film formation and surface modification of oxides, metals, resins, etc., with a diameter of φ100mm. Stage maturation (Max 500℃) and high-speed, high-precision processing through bias application have become easier. For more details, please contact us or refer to the catalog.

  • Plasma surface treatment equipment

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Katagiri Engineering Co., Ltd. Technical Introduction

We handle everything from development and design to processing, welding, assembly, and inspection consistently.

At Katagiri Engineering Co., Ltd., we create customized equipment that meets our customers' needs in vacuum devices and equipment ranging from ultra-high vacuum to atmospheric pressure. We handle everything from development and design to processing, welding, assembly, and inspection in a consistent manner. We continue to develop equipment based on cutting-edge plasma technology through joint research with universities. We have installed electron beam excited plasma (EBEP) as in-house equipment and are conducting development and prototyping that meets corporate needs, successfully achieving high-speed nitriding treatment and improving the hydrophilic adhesion of organic films using EBEP. For more details, please contact us or refer to our catalog.

  • Vacuum Equipment
  • Semiconductor inspection/test equipment
  • Other inspection equipment and devices

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