大橋製作所 List of Products and Services

By equipping the automatic thermal pressing machine with a self-balancing adjustment (tilt adjustment) unit, stable thermal pressing can be achieved that is not dependent on the dimensional accuracy of the target workpiece. This will improve the yield in production.

• Other mounting machines

By compacting the high-precision Zθ2 axis actuator mounted on the automatic machine, we ensure positioning accuracy while achieving space-saving and increased speed for the entire device.

• Other mounting machines

A 6-axis control unit that enables parallelism adjustment on the order of 10nm, thanks to high-precision sensing capabilities and a precise alignment mechanism. Previously, the mechanism achieved an accuracy on the order of 0.1μm, but by utilizing a special sensing mechanism and a precise alignment mechanism, alignment on the order of 10nm has been realized. Improving the quality of production products allows for an approach in a more high-definition process.

• Other mounting machines

The nanoimprint line is a device used to apply special coatings to the surfaces of thin sheet materials using nanoimprint technology. 【Features】 - Each step of the nanoimprint process can be performed in a continuous manner. - Each step is composed of modular single-function units that are connected, and the workpieces are transported between them by a multi-joint robot, allowing for a continuous line configuration. - By modularizing each process, it is possible to flexibly respond to process changes and specification modifications. - By adopting unique special mechanisms and algorithms, high-precision positioning for the nanoimprint process is achieved.

• Other mounting machines

- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.

• Other mounting machines

This is a device that laminates panels such as touch panels, OGS, and LCDs using optical resin and performs UV pre-curing. By adding gap control, DAM formation, and panel thickness measurement functions, it achieves stable quality.

• Other mounting machines

The "CMS-1500" is a fully automatic FOB device that performs ACF attachment, alignment, and final pressing in a single process. The alignment through image processing improves the accuracy of ACF attachment positions. Additionally, our unique carrier transport method realizes stress-free handling of the workpieces. Furthermore, this product adopts a detachable crimping tool, making model switching easy. 【Features】 ■ Suitable for FPC bonding on camera modules ■ Achieves high productivity ■ Guarantees high stable quality ■ Easy model switching *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

This is a fully automated ACF mounting device that performs ACF attachment, FPC supply and alignment, and thermal compression bonding. It handles workpieces using a dedicated carrier and is ideal for FOB mounting on camera modules and similar applications.

• Bonding Equipment
• Mounter
• Other assembly machines

Traceability management is performed by printing barcodes, 2D matrix codes, or serial numbers on ceramic substrates, metal plates, etc. This device can be automatically or manually supplied using magazines, trays, and SMEMA standard conveyors. It enables real-time data communication and connects to line controllers and factory systems.

• Laser marker

Ohashi Manufacturing started as a company that developed equipment for displays (LCD, PDP, OLED). - Through various experiences, we have acquired expertise in image recognition, robotics, high-speed and high-precision handling, data management, and man-machine interfaces. - We applied the knowledge gained in the display industry regarding cleanliness, high precision, high productivity, and cost performance to the world of mobile phone module assembly. The demands for system integration business are increasing, and Ohashi is working on the development of automation equipment by leveraging the experience and knowledge we have cultivated so far to meet those demands. If you have any requests regarding automation that you wish to pursue, please feel free to consult with us.

• Other mounting machines

This is an ideal device for mass production, allowing multiple workpieces to be continuously pasted with ACF. Additionally, it can handle workpieces with a common carrier for subsequent processes (mounting, thermal pressing), enabling an efficient line configuration from pasting to thermal pressing.

• Other semiconductor manufacturing equipment
• Other mounting machines
• Other assembly machines

A mass production device that automatically performs FPC pickup, alignment, mounting, and temporary pressing. By using a common carrier for the ACF attachment and thermal pressing processes, an efficient line configuration that allows for smooth work handling is possible.

• Mounter

This is a mass production ACF thermal bonding device that performs continuous thermal bonding with up to 4 heads. It achieves stable heating conditions even for workpieces that easily lose heat, thanks to a flexible temperature profile using pulse heat.

• Bonding Equipment

This is a mass production ACF hot press machine that performs continuous thermal bonding with up to 4 heads. It uses a common carrier with the previous process to establish an efficient production line.

• Bonding Equipment

It is a compact and simple tabletop ACF bonding device that allows for easy setup changes. It accommodates a wide range of work, including LCDs, FPCs, camera modules, and touch panels.

• Other mounting machines
• Other assembly machines
• Bonding Equipment

It is a compact and simple tabletop ACF bonding device that allows for easy setup changes. It is compatible with a wide range of workpieces, including LCDs, FPCs, camera modules, and touch panels.

• Other mounting machines
• Other assembly machines
• Bonding Equipment

It is ideal for workpieces with high thermal conductivity and thermoplastic materials that require rapid cooling, ensuring stable temperature control. It achieves stable temperature conditions with flexible settings. Additionally, it features a durable ceramic heater, making it a device you can use with confidence over the long term. 【Features】 - Ideal for workpieces with high thermal conductivity and thermoplastic materials that require rapid cooling - Achieves stable temperature conditions with flexible settings - Equipped with a durable ceramic heater *For more details, please request documentation or view the PDF data available for download.

• Bonding Equipment

It is a highly versatile device that combines FPC alignment and thermal bonding in one unit. Additionally, it allows for configurations tailored to the process, such as expanding the stage and head, and selecting the installation position for the alignment camera.

• Bonding Equipment
• Mounter
• Other assembly machines

Despite being a space-saving manual machine, it has a proven track record from research and development to mass production applications. It supports a wide range of work including FPC, IC, LCD, and PWB.

• Bonding Equipment

The image processing system recognizes the alignment marks and automatically aligns the chips. It is a simple yet highly precise tabletop machine.

• Mounter