A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
It is ideal for workpieces with high thermal conductivity and thermoplastic materials that require rapid cooling, ensuring stable temperature control. It achieves stable temperature conditions with flexible settings. Additionally, it features a durable ceramic heater, making it a device you can use with confidence over the long term. 【Features】 - Ideal for workpieces with high thermal conductivity and thermoplastic materials that require rapid cooling - Achieves stable temperature conditions with flexible settings - Equipped with a durable ceramic heater *For more details, please request documentation or view the PDF data available for download.
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basic information
This is a device for thermocompression bonding at one location on a workpiece. The workpiece is vacuum-fixed to the stage, advances to the bonding position, and the bonding head descends to thermocompress the workpiece. The pulse heat method allows for rapid heating and cooling, making it possible to stably heat workpieces with high thermal conductivity. [Specifications excerpt] - Stage size: 180(W) x 100(D) mm - Head size: Max. 20(W) x 20(D) mm - Heating method: Pulse heat - Cushioning material: Automatic winding Teflon sheet
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Applications/Examples of results
Corresponding to the following processes: FOB/FOG/FOF/COB/COG/COF
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Company information
Since our founding, we have been comprehensively developing the design, manufacturing, and sales of microelectronics assembly equipment using precision sheet metal processing and ACF bonding technology. Since we began to commercialize the know-how cultivated in sheet metal processing as a tool for improving quality and productivity, we have consistently pursued business diversification and management independence through differentiated technologies. In the field of sheet metal processing, we are capable of vertical integration from product design and development to the assembly of finished products, not just contract processing, providing OEM and ODM (Original Design Manufacturing) products to our client companies. In the area of ACF bonding assembly machines, supported by the rapid development of the FPD industry, our products are adopted by many customers both domestically and internationally. In 1999, our tabletop COG assembly machine, which overturned industry norms, received the annual excellence award from the Nikkei newspaper. We take pride in the fact that the emergence of this tabletop machine has broadened the industry from being the domain of a few large companies to include many small and medium-sized enterprises. We have successfully developed the world's first "full-auto FOB line," and along with our manual tabletop machines and standalone semi-auto machines, we have evolved into a full-line manufacturer of ACF bonding assembly machines.