テックインサイツジャパン株式会社（TechInsights） List of Products and Services

"TechInsights" is one of the world's largest semiconductor-related information platforms, providing technology trends, market research reports, and cost analysis reports in the semiconductor and electronic components field. By integrating detailed analysis results and market insights accumulated independently, we offer reports that cover everything from the current short-term market conditions of the semiconductor market to long-term forecasts and technology trends. We strongly support important management decisions such as business planning and development strategies. 【Features】 ■ Provides technology analysis, market research, and cost analysis for the semiconductor and electronic components field ■ Offers a wide range of analyses from structural analysis of major semiconductor devices such as advanced logic, advanced packaging, DRAM memory, 3D NAND memory, image sensors, and power semiconductors to process flow analysis and circuit analysis ■ Supports analysis of a wide range of devices including smartphones, automotive equipment, home appliances, IoT devices, base stations, and nodes ■ Capable of specialized analysis tailored to the fields of equipment, materials, and devices ■ Covers a wide range from short-term market conditions to long-term forecasts *For more details, please refer to the materials available for download in the <Catalog>. We have free viewing content available. Feel free to contact us with any inquiries.

• Other semiconductors

Essential data for evaluating current market research, forecasts, and building dashboards: - Forecast Databases - Driving Forces Databases - CSUBS Graphics For knowledge experts in the semiconductor and flat panel display solar power markets: Online databases and graphics.

• Other semiconductors

This service shares a database of market size and share data, future forecasts, and sales performance data by region and application.

• Wafer

TechInsights' Forecast Pro is a research platform equipped with essential datasets related to semiconductors, silicon, packaging, design, and reticles, as well as analysis of semiconductor inventory, production capacity, and supply and demand. TCI Graphics provides a unique perspective on the health of the semiconductor manufacturing ecosystem. - Key performance indicators across the electronics, semiconductor, and equipment supply chains - Simple charts that can be used to leverage TechInsights' insights and analyses within internal management, marketing, and business units - Data that promotes quick actions to manage the supply chain through weekly and monthly views and analyses.

• Other semiconductors

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the related supply chain. Tear-down reports for major market products such as mobile devices, medical equipment, and digital home products are available individually or through licensing agreements. Various manufacturers utilize our tear-downs to obtain information such as the following: 【Examples of Use by Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Examples of Use by Semiconductor/Component Suppliers】 - Potential for sockets - Trends in component integration - Trends in packaging - Competitive threats 【Examples of Use by Intellectual Property Stakeholders】 - Verification of design wins - Tracking of target claims - Market sizing for relevant products and technologies (Custom tear-downs tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

• others

This is a report on waveform analysis of Samsung's 64 Gbit 21 nm TLC NAND flash from Semiconductor Insights Japan, a leading company in integrated circuit and electronic system technology and patent analysis. This waveform analysis describes the signal behavior of key signals when the device operates in several different standard operating modes. The analyzed component is Samsung's 21nm NAND Flash, where a microprobe was placed on the metal signal line part to operate the device and record the vibration behavior. 【Samsung 21nm NAND Flash】 ○ Used in Samsung's latest solid-state drives 【Observed Signals】 ○ Global word line ○ Bit line ○ P-well isolation ○ Global string select ○ Global ground select, etc. For more details, please download the catalog or contact us.

• Analysis Services

In many technology companies, a large portion of corporate value consists of intangible assets. For example, patents serve as an important source of revenue for many companies and are a key indicator of corporate valuation, while IP analysis forms the basis for competitive analysis and strategic planning. The aggressive development cycles, high operational burdens, and the trend of frequent litigation in today's business environment mean that intellectual property (IP) professionals often do not have the time they wish to dedicate to patent portfolios. When such issues arise, TechInsights can assist you. 【IP Life Cycle】 ○ Revenue ○ Defense ○ Formation ○ Strategy ○ Analysis For more details, please contact us or download the catalog.

• Management consultant/Small business consultant

Amid the ongoing pressure on companies worldwide to reduce costs and discover new sources of revenue, many organizations are focusing on opportunities to monetize their patent portfolios, with attractive revenue sources being disrupted through patent litigation or licensing. [Challenges Regarding Patent Claims] - What are the strengths of our own portfolio? - Who is the optimal party to assert patent rights against or the best candidate for licensing? - How can we demonstrate the strengths of our own portfolio? For more details, please contact us or download the catalog.

• Patents

In the era of excessive competition, it is essential to include competitive analysis in all business plans. It is important to understand what competitors are doing, their strengths and weaknesses, the products they are selling, their prices and sales channels, and how to differentiate the products your company offers. [Insights for the Future] [Providing detailed extraction and analysis of patents in the global technology market] ○ List of current and future competitors ○ Insights into the strategic direction of competitors and the products they will offer in the future ○ Indicating the direction of your future R&D and patent activities "White space" gaps and opportunities ○ Relative strengths and weaknesses of your patent ownership and associated risks and opportunities ○ Patents or organizations for acquisition or strategic partnerships For more details, please contact us or download the catalog.

• Patents

Most companies understand the value of protecting intellectual property (IP) and are eager to apply the necessary patent protection. However, in most cases, the full potential of patent protection is never realized. The main reasons for this are a lack of time, resources, and portfolio structure, or a misalignment between business objectives and strategy. [Overall Value and Understanding of Patent Portfolio] [Helping clients understand the overall value of patent ownership] ○ Aligning the patent portfolio with the client's business needs ○ Reducing the costs of maintaining unnecessary patents by identifying surplus patents for licensing or sale ○ Strengthening patents related to "high-value assets" to protect core technologies from competitors ○ Identifying opportunities for acquisitions or strategic partnerships For more details, please contact us or download the catalog.

• Patents

Similar to the number of patent lawsuits being filed, the number of patent applications is also on the rise. The enormous damages awarded for patent infringement have made headlines and captured the attention of business leaders. The increase in Patent Assertion Entities (PAEs) that enter the market solely for the purpose of purchasing patents and asserting patent rights has created further challenges. 【Challenges Related to Prior Art】 ○ When faced with allegations of patent infringement, utilizing prior art as evidence of invalidity is one of the crucial steps in formulating a response. ○ The completeness, accuracy, and speed of prior art searches can lead to significant differences in the final damages awarded. For more details, please contact us or download the catalog.

• Patents

Intellectual property, such as patents, is an important asset for companies. To succeed in global competition, comprehensive management from patent application to defense against infringement is essential. TechInsights holds a vast library of prior art literature, including technical analysis research, and supports over 200 patent licensing activities and transactions annually, including "investigations of intellectual property infringement" and "development of new technologies and products." Leave everything from strategy formulation regarding intellectual property to patent applications and protection to us! ■ A library of over 18,000 types of integrated circuits and electronic devices ■ Over 200 support achievements annually ◎ For more details, please contact us or download the catalog.

• others

The "Intel(R) 22nm Haswell eDRAM" is a detailed structural analysis report on Intel(R) eDRAM, which is embedded DRAM corresponding to the Haswell G82494 processor equipped with the Intel GT3 graphics unit (GPU). This integrated graphics unit has various features, including low-end GT1, mid-range GT2, and high-end GT3. The version with the best performance among GPU ICs is GT3e. 【Features】 ■ GT3e: Composed of embedded DRAM with 9 metal layers and 22nm TriGate transistor technology ■ Silicon source-drain is used for NMOS transistors, while SiGe is used for PMOS transistors For more details, please contact us or download the catalog.

• Other analyses

The "Intel(R) 22nm ValleyView Atom(TM) Z3740 SoC" is a detailed structural analysis report of the Intel Atom 23740 processor. The 24740 is designed for Windows and Android tablets and is a power-efficient quad-core SoC. This SoC operates at a clock speed of 1.33GHz and is based on the Intel Bay Trail-Silvermont architecture. 【Features】 ■ The 23740 is manufactured using a 9-layer metal, dual-gate dielectric, 22nm SoC process. ■ Device: HKMG FinFET transistors with a minimum pitch of 90nm. ■ Silicon diffusion layer section: Used for NMOS transistors, while SiGe is used for PMOS transistors. For more details, please contact us or download the catalog.

• Other analyses

The "Oracle SPARC T5 Multi-Core Processor" is a structural analysis report created using TSMC's 28nm HP process. The T5 operates at a clock speed of 3.6GHz and is a 16-core SoC. It is built using TSMC's 28nm HP CMOS process with 13 metal layers (12 Cu, 1 Al) and high-K metal gate (HKMG), featuring 16KB of L1 data cache, 16KB of L1 instruction cache, and 128KB of L2 cache for each core, along with an additional 8MB of shared L3 cache. **Features** - Two PCI-Express 3.0 controllers integrated into the die - Four DDR3 memory controllers included - Device: <110> channel-oriented transistors For more details, please download the catalog or contact us.

• Patents

This is a reconstruction of the structural analysis of the "Samsung 20nm class 3GB (6x4Gbit) LPDDR3." The main purpose is to compare the cell configurations of the 20nm class DRAM with its predecessor, the 30nm class 2Gb DDR3 DRAM (the 20nm class is simply designated as "2X nm"). 【Features】 ■ Chip using six 2X nm class 4GB ■ Symmetrical configuration of two sets of three chip stacks within one package ■ Package thickness: 0.8mm with six die configuration For more details, please download the catalog or contact us.

• Analysis Services

This report is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core) application processor. The MT6592 features an ARM Cortex-A7 processor and is marketed as a "true octa-core" SoC, equipped with a 4-core ARM MaliTM GPU, supporting Full HD displays, cameras up to 16 million pixels, multi-mode cellular modems, and dual-band 802.11n Wi-Fi, among other features. The MT6592 is manufactured using TSMC's HPM CMOS process with an 8-layer metal (7 Cu, 1 Al) structure, high-k metal gate (HKMG), and a gate length of 28nm. 【Features】 ○ Crystal orientation of the transistor channel <110> ○ Hafnium oxide (HfO2) material for the gate insulating film ○ Dual work function metal gate ○ nMOS (NiSi) and pMOS (NiSiGe) source/drain regions, and low-k interlayer insulating film For more details, please contact us or download the catalog.

• Analysis Services

TechInsights is a sophisticated leader and service provider that offers technical intelligence and various management and support for intellectual property rights. TechInsights is well-known for proposing extensive technology analysis services in the industrial sector and for conducting analyses on various ICs using excellent reverse engineering techniques. However, it is not limited to this; we can also perform complex system and software analyses that our customers require with outstanding technology. 【Services Offered】 ■ Wired System Analysis ■ Wireless Analysis ■ Software Analysis *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services

TechInsights' teardown services are trusted by client companies in sectors such as mobile, consumer electronics, and medical devices for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns tailored to meet specific customer needs are also available.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

• others

TechInsights' tear-down services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our tear-down services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies (Custom tear-downs are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Socket potential - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Case Studies for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in international markets 【Case Studies for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Case Studies for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies (Custom teardowns are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, accelerating time-to-market, reducing risks, providing competitive intelligence, and maximizing ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Case Studies for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in international markets 【Case Studies for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Case Studies for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies For more details, please download the catalog or contact us. (We also offer custom teardowns to meet unique customer needs.)

• others

TechInsights is a global intellectual property specialist service company that focuses on technological innovation and corporate growth by continuously investing in research and development as well as corporate acquisitions. TechInsights provides the latest information, advice, and IP software to technology companies facing complex technological and intellectual property challenges. TechInsights assists in managing clients' technology and intellectual property portfolios, ensuring risk reduction in investments and maximizing revenue. 【Business Activities】 ○ Intellectual Property Services (Consulting, Analysis, Mediation) → Enables management to maximize the use of intellectual property and gain profits. ○ Technical Information (Detailed analysis of electronic systems, reverse engineering of semiconductor devices and software) → Supports clients in the product commercialization decision-making process. ○ Business Intelligence (Company/Market Analysis and Trends) → Assists clients in grasping market trends. For more details, please contact us or download the catalog.

• Patents

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the associated supply chain. Tear-down reports for major market products are available through individual or bundled purchases, or via licensing agreements through various channels. TechInsights' comprehensive electronic product tear-downs, advanced reverse engineering, and IP consulting enable informed decision-making based on information related to intellectual property, products, and marketing. [Tear-down Report Contents] - Identification and classification of ICs - Block diagram of system architecture - Verification of design win at the die level - Identification and measurement of components - BOM cost For more details, please contact us or download the catalog.

• Other services

Semiconductor Insights (SI), a group company of TechInsights, is a leading global technology consulting firm targeting the global microelectronics industry. Through detailed technical investigations and analyses of VLSI integrated circuits and electronic systems, we support clients in exercising their intellectual property (IP) rights and in the development and commercialization of new technologies and products. **TechInsights Solutions (for Technology Professionals)** - Competitive Analysis (other companies, target products, etc.) - Design Analysis (circuits, systems, functional operations, etc.) - Process Analysis (structure and manufacturing processes of target products) - Cost Analysis (costs of target devices, etc.) - Smart Card Security Analysis For more details, please contact us or download the catalog.

• Patents

TechInsights (SI Corporation) has 15 years of experience and expertise in the investigation of innovative circuit design and process technology through TECHinsights solutions. Technological innovation brings both strategic opportunities and threats in the battle to gain market share, revenue growth, and competitive advantage. The TechInsights brand of SI Corporation provides detailed analyses of product features and the underlying technologies, as well as related market trends, to enable technology companies to establish a competitive position, assess the viability of entering new markets, and solve technical issues. 【TECHinsights(TM)】 - Competitive analysis - Process analysis - Cost analysis - Design analysis including CircuitVision reports - Smart card security analysis For more information, please contact us or download the catalog.

• Patents

TechInsights has expertise in analyzing all types of microelectronics devices, including digital/logic, DRAM, SRAM, non-volatile memory, analog/mixed signal, sensors/MEMS, displays, and discretes. SI Corporation supported companies engaged in networking, wireless, consumer electronics, automotive electronics, and the military sector. SI Corporation TechInsights handles both client-requested projects and published reports. 【Examples of Addressed Issues】 ○ Voltage generation and distribution technology for low power consumption ○ Circuit architecture and layout of analog/mixed signal ICs ○ Integration of RF functions using CMOS technology ○ Clock distribution technology For more details, please contact us or download the catalog.

• Patents

The process helps determine the cost, quality, and performance of devices, and often compensates for design flaws. TechInsights employs 10 process experts and provides the collective expertise accumulated over more than 140 years in device structure analysis. Devices include but are not limited to CMOS, bipolar, BiCMOS, GaAs, SiGe, copper, low-k dielectrics, SOI, strained silicon, MEMS, and TFT. Using data collected through TechInsights' specialized technology, we provide information on the structure, material composition, critical dimensions, and manufacturing processes of your products or competing products in the form of process analysis reports. 【Example Issues Addressed】 - How to embed memory (flash, DRAM, SRAM, FeRAM) into logic devices - How to mitigate risks when transitioning to more advanced process generations - What transistor performance major competing products have - How RF devices are integrated into CMOS For more details, please contact us or download the catalog.

• Patents

This report is a detailed structural analysis (LDSA) of the 20 nm node Qualcomm MDM9235 modem. The MDM9235 is the fourth generation Qualcomm Gobi 9x35 series modem and is the first modem from Qualcomm manufactured using a 20 nm CMOS process. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. The MDM9235 is manufactured by TSMC using 10 layers of metallization (9-Cu, 1-Al), with 20 nm node high-k metal gate (HKMG) transistors fabricated on a bulk silicon substrate using a gate length process. It features a minimum contacted gate pitch of 90 nm. 【Features】 ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

• Analysis Services

This report is a detailed structural analysis (LDSA) of the 20nm node Qualcomm MDM9235 modem. The MDM9235 is Qualcomm's first modem manufactured using a 20nm CMOS process and is part of the 4th generation Qualcomm Gobi 9x35 series modems. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. 【Features】 ○ Understanding key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

• Analysis Services

This report is a Memory Detailed Structural Analysis (MDSA) of the K9HQGY8S5M 3D V-NAND flash memory. The K9HQGY8S5M is the industry’s first implementation of a 32 cell vertical NAND memory and marks the departure from conventional planar flash memories. 【Features】 ○ Understand key design and manufacturing innovations ○ Make informed technical resource investment decisions ○ Find Evidence of Use For more details, please contact us or download the catalog. *This catalog is in English.

• Analysis Services

Tech Insights, a technology consulting company based in Ottawa, Canada, targeting high-tech companies and law firms, will once again hold a seminar and exhibition on strategic intellectual property management and handling at the "Patent Information Fair" this year! In the seminar held at the venue, our intellectual property team will thoroughly explain "Patent Analysis Necessary for Utilizing Patent Assets." Participation is free. Please apply through the "Contact Us" section. 【Exhibition Information】 Date: November 5 (Wed) to November 7 (Fri), 2014, 10:00 AM to 5:00 PM Venue: Science and Technology Museum (Tokyo, Kitanomaru Park) *Booth Number 27 Fee: Free (Please download the visitor registration certificate from the official page) http://www.pifc.jp/ 【Simultaneous Event at the Venue! Seminar Information】 "Best Practices for Patent Analysis Necessary for Effective Patent Asset Utilization" Date: November 7 (Fri), 2014, 12:30 PM to 1:15 PM Instructor: Tetsuya Eitani, Intellectual Property Officer, Tech Insights Japan Co., Ltd. *For inquiries regarding the exhibition and seminar, please feel free to contact us below.

• Patents

This report is a detailed structural analysis of the SK Hynix H2JTDG8UD1BMS (16 GB, 16nm node MLC NAND flash memory) used in the Apple iPhone 6 Plus smartphone. The device is manufactured using a three-layer metal structure process (1st and 2nd metal layers: W, 3rd metal layer: Al), polysilicon control gates, and polysilicon floating gates. The memory array features a bit line pitch of 32nm and a word line pitch of 38nm. An air gap is employed to reduce crosstalk between adjacent cells. [Features] ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

• Other analyses

This report is a process comparison of seven advanced 20nm-class logic devices manufactured by Intel, TSMC, and Samsung. It discusses the structures and materials used in the manufacturing of core logic transistors, I/O transistors, metallization, and SRAM layout. [Features] - Understanding key design and manufacturing innovations - Informed decision-making for technology resource investments - Support for IP activities through valuable "Evidence of Use (EoU)" information For more details, please contact us or download the catalog.

• others

At TechInsights, we collaborate with client companies to address their intellectual property rights and technology requirements. We assist you in monetizing your patent portfolio, protecting your patent positioning, safeguarding market share, and acquiring information on competing products. **Features** - Understanding key design and manufacturing innovations - Data-driven decision-making for technology resource investments - Valuable Evidence of Use (EoU) - Support for IP activities through information For more details, please contact us or download the catalog.

• others

Information on which electronic components are used in which products can be viewed from the block diagram level down to the individual semiconductor package size and die size. At the system level and in semiconductors, all packages are opened for cost asset analysis, resulting in very high accuracy in the information provided. By using this tear-down service, it becomes possible to understand the manufacturing costs of competitors and to negotiate costs favorably when procuring finished products through ODM, as it allows for an understanding of the product's cost. If we can reduce the procurement cost in ODM by 200 yen, with an annual production volume of 100,000 units, it would result in a cost reduction of 20 million yen. We also offer a customized tear-down service to analyze specified products individually. Individual meetings can be arranged, so please contact us separately.

• others

The GoPro, widely used outdoors, introduces a new world with the HERO4, adding next-generation image quality and new features. We provide a product report listing all components and costs, both external and internal, for the HERO4 Black, which is capable of high-resolution 4K level video recording, 2.7K at 50fps, and high frame rate 1080p at 120fps.

• Color camera

The thickness has been reduced by 18% from the conventional product, achieving a thickness of 6.1mm. It is also very lightweight at 437 grams. It features a Retina display with a resolution of 2048x1536, which exceeds the resolution of FHD TVs. Additionally, it has a 40% increase in CPU performance and a battery that can last for 10 hours of use. Information that reveals how these products are configured in terms of their system.

• Other electronic parts

In China, as Xiaomi and Oppo are rising, how Apple is conquering the market with its products will be clarified by breaking down those products. The communication technology has shifted from WCDMA to TDSCDMA, following a unique path in China. This is very similar to the Japanese market. The iPhone 6 has already been released, and there are bad news reports about issues like the phone bending, but still, the thinness of this phone is very attractive. This time, we will introduce a simplified survey report from both the DeepDive and Survey analysis reports held by Tech Insights. Despite being priced at $999, which is very competitive, the cost of the mainboard's semiconductors has been calculated. Furthermore, the analysis includes photos of everything from the phone case to accessories.

• Patents

Adesto provides a technology that serves as an alternative to power-efficient, cost-effective flash memory, achieving long battery life for connected home devices such as home appliances, sensors, and monitors. CBRAM is seen as a promising successor to flash memory, offering cost and power savings. Adesto's CBRAM excels in energy efficiency, is CMOS compatible, and is designed for discrete and embedded memory applications. TechInsights' structural analysis report includes detailed layer-by-layer (LbL) analysis of the device structure, manufacturing processes, and compositions, as well as critical dimension measurements of general features, gate lengths and pitches, channel lengths, diffusion layer depths, well depths, field oxide thicknesses, and gate oxide thicknesses.

• Other electronic parts

This product is equipped with a pedometer, calorie counter, sleep tracker, and 24-hour heart rate monitor, and even has GPS built-in. It works in conjunction with a smartphone and has various features. Although the product is small, it might be assumed that not many ICs are used, but the total number is 25. While there are few semiconductors from Japanese manufacturers, they are uniquely used in the battery protection part. The ICs are cleverly placed within the small circuit board, but the arrangement does not give a sense of complexity in appearance.

• Other electronic parts

The MN101LR05D is a low-power 8-bit single-chip microcontroller developed for portable healthcare, security devices, and sensor processing. The MN101LR05D features a CPU core with a 10MHz 8-bit AM13L, 64KB of ReRAM capacity, and 4KB of SRAM capacity. The MR101LR05D is the world's first mass-produced practical example of ReRAM (Resistive RAM), and it is expected to be widely utilized as a successor technology to existing non-volatile memory. The MN101LR05D is manufactured using a 180nm CMOS process with four layers of AI metallization. The ReRAM cell of this metal oxide is formed between stack W vias connecting metal 3 to metal 4. The results of the report are based on data from scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy-dispersive X-ray analysis (TEM-EDS), electron energy loss spectroscopy (TEM-EEKS), and spreading resistance measurement (SRP).

• Other electronic parts

The mechanism that responds and flushes when you bring your hand close while flushing the toilet is called a flush sensor. This time, we conducted a disassembly investigation of that product. The structure is quite simple. It is equipped with an 8-bit microcontroller and a capacitive controller, which detects the response and is controlled by the microcontroller. The size of the circuit board is also very small, and the components are of course mounted on one side. If you are interested, please feel free to contact us. The price starts at $999.

• Sensors