テックインサイツジャパン株式会社（TechInsights） List of Products and Services

Our company regularly holds free webinars related to semiconductors. The seminars are packed with practical insights, forecasts, and competitive analysis for strategists, designers, foundry managers, and executives. Each session is designed to support strategic planning and decision-making, providing teams with the necessary information to stay informed and maintain competitiveness. [Upcoming Webinars (Excerpt)] Theme: Five Expectations for the Manufacturing Market in 2026 Overview: Expansion of TSMC's 2nm production scale, challenges of China's export controls and emissions, etc. Theme: Five Expectations for the Mobile Market in 2026 Overview: Integration of mobile AI, innovations in SoC and DRAM, etc. Theme: Five Expectations for the AI Market Overview: The future of AI and the semiconductor industry, from data center accelerators to 2nm process technology. *For more details, please download the PDF or feel free to contact us.

• Seminar
• Other semiconductors

We will hold a free webinar related to semiconductors titled "Five Expectations for the Mobile Market in 2026." We will explore the mobile market in 2026, including the integration of mobile AI, innovations in SoC and DRAM, disruptions in tariffs and trade, new device form factors, and the increasing demand from BRIC and emerging markets. We sincerely look forward to your participation. 【Event Overview】 ■ Date and Time: January 22, 2026, at 10:00 AM (Japan Time) ■ Duration: 1 hour *For more details, please download the PDF or feel free to contact us.

• Seminar
• Other semiconductors

We will hold a free webinar related to semiconductors titled "Five Expectations for the Manufacturing Market in 2026." Utilizing insights on TSMC's expansion of 2nm production scale, challenges of China's export controls and emissions, AI-driven inventory strategies, glass substrates for high-performance chips, and the growth of wafer manufacturing equipment across Asia, we will understand the semiconductor manufacturing market in 2026. We sincerely look forward to your participation. 【Event Overview】 ■ Date and Time: January 15, 2026, at 10:00 AM (Japan Time) ■ Duration: 1 hour *For more details, please download the PDF or feel free to contact us.

• Seminar
• Other semiconductors

We will hold a free webinar on "Five Expectations for the Consumer Electronics Market in 2026" related to semiconductors. Utilizing insights on AI-enabled devices, the convergence of smart homes, changes in wearable demand, upgrades in content-driven displays, and the reorganization of the global supply chain due to sustainability, we will explore the consumer electronics market for 2026. We sincerely look forward to your participation. [Event Overview] ■ Date and Time: December 17, 2025, at 10:00 AM (Japan Time) ■ Duration: 1 hour *For more details, please download the PDF or feel free to contact us.

• Seminar
• Other semiconductors

We will hold a free webinar on "Five Expectations for the PC/Laptop/Tablet Market in 2026" related to semiconductors. This webinar will explore the 2026 PC, laptop, and tablet market, providing insights into the expansion of AI on devices, the impact of tariffs on pricing, growth opportunities in the mid-sized market, alternatives to new processors (HiSilicon Kirin, RISC-V), and changes in trends between x86 and Arm. We sincerely look forward to your participation. 【Event Overview】 ■ Date and Time: December 10, 2025, at 10:00 AM (Japan Time) ■ Duration: 1 hour *For more details, please download the PDF or feel free to contact us.

• Seminar
• Other semiconductors

Our company held a free webinar on semiconductor-related topics titled "Five Expectations for the Advanced Packaging Market in 2026." We analyzed the advanced packaging market for 2026, covering topics such as the adoption of co-packaged optics, HBM demand from AI, the transition to panel and glass substrates, thermal challenges in 3D stacking, and chiplet integration in mobile devices. 【Event Overview】 ■ Date and Time: December 3, 2025, at 10:00 AM (Japan Time) ■ Duration: 1 hour *For more details, please download the PDF or feel free to contact us.

• Seminar
• Other semiconductors

We would like to introduce the webinar we held titled "Understanding the Semiconductor Price War." In this webinar, we unravel the supply-side and demand-side factors that shape semiconductor prices, focusing particularly on the dynamic price pressures in the power market and the memory (DRAM and NAND) market. This session, utilizing TechInsights' unique perspectives and data-driven analysis, will help deepen your understanding of price fluctuation predictions, market opportunity identification, and supplier responses. [Content] ■ What factors are driving the current price trends in power semiconductors, and how long will they last? ■ How is the NAND market evolving beyond the dominance of DRAM? ■ What strategies are suppliers adopting to manage and respond to price fluctuations? ■ How do macroeconomic and industry-specific forces intersect in pricing behavior? *For more details, please download the PDF or feel free to contact us.

• Technical Seminar
• Management Seminar
• Memory

We would like to introduce our webinar titled "Not Just Nodes: How Special Semiconductors are Shaping the Future of Electronics." We will explore how innovations, from the evolution of 5G to 6G, and advanced optical sensing to wide bandgap power devices, are enabling the acceleration, smartening, and efficiency of electronics. For expert insights, please watch the TechInsights webinar. 【Overview】 ■ How special technologies such as power, RF, and sensors are transforming the semiconductor industry ■ How innovations like the evolution from 5G to 6G are achieving the acceleration, smartening, and efficiency of electronics *For more details, please download the PDF or feel free to contact us.

• Technical Seminar
• Sensors
• Other semiconductors

We would like to introduce our webinar titled "The Evolving World of Wearables: Device Innovation, Market Trends, and Sensor-Driven Growth." From wristbands to smart rings and AR smart glasses, wearable devices have become more intelligent, personal, and impactful than ever before. In this exclusive webinar, TechInsights experts will explain the trends, technologies, and sensor innovations that support these devices. [Content] ■ Market overview and device trends ■ Detailed analysis of smartwatches, smart bands, smart rings, and AR smart glasses ■ Sensor-driven revolution ■ Emerging leaders and growth areas *For more details, please download the PDF or feel free to contact us.

• Technical Seminar
• Sensors

We would like to introduce our webinar titled "President Trump's Tariff Tensions: What Does the Future Hold for the Semiconductor Industry?" Countries such as the United States, the EU, and Southeast Asia are redefining the boundaries of technological competition and economic security. What does this mean for the design, manufacturing, and supply chain of semiconductors? In this special webinar, some of the world's leading authorities on semiconductor tariffs and trade policy will come together to provide insights that cannot be found elsewhere. [Content] ■ How current and proposed semiconductor tariffs are changing the global industry ■ The impact of export restrictions, foreign investment regulations, and shifts in regional policies ■ Which players in the value chain, from foundries to fabless companies, are most affected *For more details, please download the PDF or feel free to contact us.

• Other semiconductors
• Management Seminar

We would like to introduce our webinar titled "Chokepoints and Dependencies: Examining the Progress of AI Superiority and Self-Sufficiency in the Semiconductor Supply Chain between China and the United States." Industry experts with extensive experience in the semiconductor sector discussed the challenges redefining the semiconductor industry. In this 60-minute virtual event, we covered the following topics: **Content** - Explaining global changes: A detailed discussion on the geopolitical and policy factors reshaping the semiconductor supply chain. - Examining strategic roadmaps: Insights into national and regional strategies to reduce dependence on external sources. - Evaluating AI development: Hearing how AI continues to advance the world and learning how hardware and infrastructure serve as the backbone of this progress. - Assessing critical components: An overview of how countries are sourcing essential minerals and magnets for future production. *For more details, please download the PDF or feel free to contact us.*

• Other semiconductors
• Technical Seminar
• Management Seminar

We would like to introduce our webinar titled "Can Intel Regain Its Throne in the Semiconductor Industry?" Amid intensified competition from AMD and TSMC, Intel is facing significant challenges in reclaiming its leadership. In this webinar, we will present expert insights on the market forces shaping Intel's resurgence, its manufacturing roadmap, and the implications for the future of computing. [Content] ■ Lip-Bu Tan's Vision: How Intel's new CEO will rewrite the strategy ■ Intel Foundry vs. TSMC: Can Intel disrupt the foundry market? ■ Re-entering the AI Game: Is there a possibility for Intel to re-enter the AI accelerator market? ■ The Hidden Edge: Intel's secret innovations that could change the game *For more details, please download the PDF or feel free to contact us.

• Management Seminar

We would like to introduce our webinar titled "Who Will Lead Semiconductor Manufacturing in the AI Era?" Learn about the leaders in wafer manufacturing and advanced packaging, discover how AI is driving growth in the industry, and gain valuable insights from a 10-year market forecast. Please feel free to contact us if you have any inquiries. 【Content (partial)】 ■ How is AI driving the business of major equipment suppliers such as Applied Materials and ASML? ■ Which emerging companies are benefiting from AI and related advanced packaging? ■ What role do Chinese equipment suppliers play in AI-related chip manufacturing? *For more details, please download the PDF or feel free to contact us.

• Other semiconductors
• Technical Seminar

On TechInsights' semiconductor market site, you can grasp the latest market trends and technology trends in real-time. It analyzes information from rapidly expanding fields such as AI and high-performance memory, and you can also check future market forecasts and competitive situations. Companies and researchers involved in the industry can utilize this site to quickly understand the latest trends and support strategic decision-making. To understand the trends in the semiconductor market and not miss future business opportunities, you can register on the TechInsights site and check the information. ■ Information available on the site (excerpt) - Semiconductor Market Dynamics - Special Content for Chip Makers - The Future Logic Technology Roadmap - The Future DRAM Technology Roadmap - The Future NAND Technology Roadmap - TechInsights Webinars *For more details, please download the PDF or access the site through the "Register here" link.

• Other semiconductors

"TechInsights" is one of the world's largest semiconductor-related information platforms, providing technology trends, market research reports, and cost analysis reports in the semiconductor and electronic components field. By integrating detailed analysis results and market insights accumulated independently, we offer reports that cover everything from the current short-term market conditions of the semiconductor market to long-term forecasts and technology trends. We strongly support important management decisions such as business planning and development strategies. 【Features】 ■ Provides technology analysis, market research, and cost analysis for the semiconductor and electronic components field ■ Offers a wide range of analyses from structural analysis of major semiconductor devices such as advanced logic, advanced packaging, DRAM memory, 3D NAND memory, image sensors, and power semiconductors to process flow analysis and circuit analysis ■ Supports analysis of a wide range of devices including smartphones, automotive equipment, home appliances, IoT devices, base stations, and nodes ■ Capable of specialized analysis tailored to the fields of equipment, materials, and devices ■ Covers a wide range from short-term market conditions to long-term forecasts *For more details, please refer to the materials available for download in the <Catalog>. We have free viewing content available. Feel free to contact us with any inquiries.

• Other semiconductors

Essential data for evaluating current market research, forecasts, and building dashboards: - Forecast Databases - Driving Forces Databases - CSUBS Graphics For knowledge experts in the semiconductor and flat panel display solar power markets: Online databases and graphics.

• Other semiconductors

This service shares a database of market size and share data, future forecasts, and sales performance data by region and application.

• Wafer

TechInsights' Forecast Pro is a research platform equipped with essential datasets related to semiconductors, silicon, packaging, design, and reticles, as well as analysis of semiconductor inventory, production capacity, and supply and demand. TCI Graphics provides a unique perspective on the health of the semiconductor manufacturing ecosystem. - Key performance indicators across the electronics, semiconductor, and equipment supply chains - Simple charts that can be used to leverage TechInsights' insights and analyses within internal management, marketing, and business units - Data that promotes quick actions to manage the supply chain through weekly and monthly views and analyses.

• Other semiconductors

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the related supply chain. Tear-down reports for major market products such as mobile devices, medical equipment, and digital home products are available individually or through licensing agreements. Various manufacturers utilize our tear-downs to obtain information such as the following: 【Examples of Use by Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Examples of Use by Semiconductor/Component Suppliers】 - Potential for sockets - Trends in component integration - Trends in packaging - Competitive threats 【Examples of Use by Intellectual Property Stakeholders】 - Verification of design wins - Tracking of target claims - Market sizing for relevant products and technologies (Custom tear-downs tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

• others

This is a report on waveform analysis of Samsung's 64 Gbit 21 nm TLC NAND flash from Semiconductor Insights Japan, a leading company in integrated circuit and electronic system technology and patent analysis. This waveform analysis describes the signal behavior of key signals when the device operates in several different standard operating modes. The analyzed component is Samsung's 21nm NAND Flash, where a microprobe was placed on the metal signal line part to operate the device and record the vibration behavior. 【Samsung 21nm NAND Flash】 ○ Used in Samsung's latest solid-state drives 【Observed Signals】 ○ Global word line ○ Bit line ○ P-well isolation ○ Global string select ○ Global ground select, etc. For more details, please download the catalog or contact us.

• Analysis Services

The "Intel(R) 22nm Haswell eDRAM" is a detailed structural analysis report on Intel(R) eDRAM, which is embedded DRAM corresponding to the Haswell G82494 processor equipped with the Intel GT3 graphics unit (GPU). This integrated graphics unit has various features, including low-end GT1, mid-range GT2, and high-end GT3. The version with the best performance among GPU ICs is GT3e. 【Features】 ■ GT3e: Composed of embedded DRAM with 9 metal layers and 22nm TriGate transistor technology ■ Silicon source-drain is used for NMOS transistors, while SiGe is used for PMOS transistors For more details, please contact us or download the catalog.

• Other analyses

The "Intel(R) 22nm ValleyView Atom(TM) Z3740 SoC" is a detailed structural analysis report of the Intel Atom 23740 processor. The 24740 is designed for Windows and Android tablets and is a power-efficient quad-core SoC. This SoC operates at a clock speed of 1.33GHz and is based on the Intel Bay Trail-Silvermont architecture. 【Features】 ■ The 23740 is manufactured using a 9-layer metal, dual-gate dielectric, 22nm SoC process. ■ Device: HKMG FinFET transistors with a minimum pitch of 90nm. ■ Silicon diffusion layer section: Used for NMOS transistors, while SiGe is used for PMOS transistors. For more details, please contact us or download the catalog.

• Other analyses

The "Oracle SPARC T5 Multi-Core Processor" is a structural analysis report created using TSMC's 28nm HP process. The T5 operates at a clock speed of 3.6GHz and is a 16-core SoC. It is built using TSMC's 28nm HP CMOS process with 13 metal layers (12 Cu, 1 Al) and high-K metal gate (HKMG), featuring 16KB of L1 data cache, 16KB of L1 instruction cache, and 128KB of L2 cache for each core, along with an additional 8MB of shared L3 cache. **Features** - Two PCI-Express 3.0 controllers integrated into the die - Four DDR3 memory controllers included - Device: <110> channel-oriented transistors For more details, please download the catalog or contact us.

• Patents

This is a reconstruction of the structural analysis of the "Samsung 20nm class 3GB (6x4Gbit) LPDDR3." The main purpose is to compare the cell configurations of the 20nm class DRAM with its predecessor, the 30nm class 2Gb DDR3 DRAM (the 20nm class is simply designated as "2X nm"). 【Features】 ■ Chip using six 2X nm class 4GB ■ Symmetrical configuration of two sets of three chip stacks within one package ■ Package thickness: 0.8mm with six die configuration For more details, please download the catalog or contact us.

• Analysis Services

This report is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core) application processor. The MT6592 features an ARM Cortex-A7 processor and is marketed as a "true octa-core" SoC, equipped with a 4-core ARM MaliTM GPU, supporting Full HD displays, cameras up to 16 million pixels, multi-mode cellular modems, and dual-band 802.11n Wi-Fi, among other features. The MT6592 is manufactured using TSMC's HPM CMOS process with an 8-layer metal (7 Cu, 1 Al) structure, high-k metal gate (HKMG), and a gate length of 28nm. 【Features】 ○ Crystal orientation of the transistor channel <110> ○ Hafnium oxide (HfO2) material for the gate insulating film ○ Dual work function metal gate ○ nMOS (NiSi) and pMOS (NiSiGe) source/drain regions, and low-k interlayer insulating film For more details, please contact us or download the catalog.

• Analysis Services

TechInsights is a sophisticated leader and service provider that offers technical intelligence and various management and support for intellectual property rights. TechInsights is well-known for proposing extensive technology analysis services in the industrial sector and for conducting analyses on various ICs using excellent reverse engineering techniques. However, it is not limited to this; we can also perform complex system and software analyses that our customers require with outstanding technology. 【Services Offered】 ■ Wired System Analysis ■ Wireless Analysis ■ Software Analysis *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services

TechInsights' teardown services are trusted by client companies in sectors such as mobile, consumer electronics, and medical devices for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns tailored to meet specific customer needs are also available.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

• others

TechInsights' tear-down services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our tear-down services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies (Custom tear-downs are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Socket potential - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Case Studies for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in international markets 【Case Studies for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Case Studies for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies (Custom teardowns are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

• others

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, accelerating time-to-market, reducing risks, providing competitive intelligence, and maximizing ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Case Studies for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in international markets 【Case Studies for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Case Studies for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies For more details, please download the catalog or contact us. (We also offer custom teardowns to meet unique customer needs.)

• others

TechInsights is a global intellectual property specialist service company that focuses on technological innovation and corporate growth by continuously investing in research and development as well as corporate acquisitions. TechInsights provides the latest information, advice, and IP software to technology companies facing complex technological and intellectual property challenges. TechInsights assists in managing clients' technology and intellectual property portfolios, ensuring risk reduction in investments and maximizing revenue. 【Business Activities】 ○ Intellectual Property Services (Consulting, Analysis, Mediation) → Enables management to maximize the use of intellectual property and gain profits. ○ Technical Information (Detailed analysis of electronic systems, reverse engineering of semiconductor devices and software) → Supports clients in the product commercialization decision-making process. ○ Business Intelligence (Company/Market Analysis and Trends) → Assists clients in grasping market trends. For more details, please contact us or download the catalog.

• Patents

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the associated supply chain. Tear-down reports for major market products are available through individual or bundled purchases, or via licensing agreements through various channels. TechInsights' comprehensive electronic product tear-downs, advanced reverse engineering, and IP consulting enable informed decision-making based on information related to intellectual property, products, and marketing. [Tear-down Report Contents] - Identification and classification of ICs - Block diagram of system architecture - Verification of design win at the die level - Identification and measurement of components - BOM cost For more details, please contact us or download the catalog.

• Other services

Semiconductor Insights (SI), a group company of TechInsights, is a leading global technology consulting firm targeting the global microelectronics industry. Through detailed technical investigations and analyses of VLSI integrated circuits and electronic systems, we support clients in exercising their intellectual property (IP) rights and in the development and commercialization of new technologies and products. **TechInsights Solutions (for Technology Professionals)** - Competitive Analysis (other companies, target products, etc.) - Design Analysis (circuits, systems, functional operations, etc.) - Process Analysis (structure and manufacturing processes of target products) - Cost Analysis (costs of target devices, etc.) - Smart Card Security Analysis For more details, please contact us or download the catalog.

• Patents

TechInsights has expertise in analyzing all types of microelectronics devices, including digital/logic, DRAM, SRAM, non-volatile memory, analog/mixed signal, sensors/MEMS, displays, and discretes. SI Corporation supported companies engaged in networking, wireless, consumer electronics, automotive electronics, and the military sector. SI Corporation TechInsights handles both client-requested projects and published reports. 【Examples of Addressed Issues】 ○ Voltage generation and distribution technology for low power consumption ○ Circuit architecture and layout of analog/mixed signal ICs ○ Integration of RF functions using CMOS technology ○ Clock distribution technology For more details, please contact us or download the catalog.

• Patents

The process helps determine the cost, quality, and performance of devices, and often compensates for design flaws. TechInsights employs 10 process experts and provides the collective expertise accumulated over more than 140 years in device structure analysis. Devices include but are not limited to CMOS, bipolar, BiCMOS, GaAs, SiGe, copper, low-k dielectrics, SOI, strained silicon, MEMS, and TFT. Using data collected through TechInsights' specialized technology, we provide information on the structure, material composition, critical dimensions, and manufacturing processes of your products or competing products in the form of process analysis reports. 【Example Issues Addressed】 - How to embed memory (flash, DRAM, SRAM, FeRAM) into logic devices - How to mitigate risks when transitioning to more advanced process generations - What transistor performance major competing products have - How RF devices are integrated into CMOS For more details, please contact us or download the catalog.

• Patents

This report is a detailed structural analysis (LDSA) of the 20 nm node Qualcomm MDM9235 modem. The MDM9235 is the fourth generation Qualcomm Gobi 9x35 series modem and is the first modem from Qualcomm manufactured using a 20 nm CMOS process. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. The MDM9235 is manufactured by TSMC using 10 layers of metallization (9-Cu, 1-Al), with 20 nm node high-k metal gate (HKMG) transistors fabricated on a bulk silicon substrate using a gate length process. It features a minimum contacted gate pitch of 90 nm. 【Features】 ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

• Analysis Services

This report is a detailed structural analysis (LDSA) of the 20nm node Qualcomm MDM9235 modem. The MDM9235 is Qualcomm's first modem manufactured using a 20nm CMOS process and is part of the 4th generation Qualcomm Gobi 9x35 series modems. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. 【Features】 ○ Understanding key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

• Analysis Services

This report is a Memory Detailed Structural Analysis (MDSA) of the K9HQGY8S5M 3D V-NAND flash memory. The K9HQGY8S5M is the industry’s first implementation of a 32 cell vertical NAND memory and marks the departure from conventional planar flash memories. 【Features】 ○ Understand key design and manufacturing innovations ○ Make informed technical resource investment decisions ○ Find Evidence of Use For more details, please contact us or download the catalog. *This catalog is in English.

• Analysis Services

This report is a detailed structural analysis of the SK Hynix H2JTDG8UD1BMS (16 GB, 16nm node MLC NAND flash memory) used in the Apple iPhone 6 Plus smartphone. The device is manufactured using a three-layer metal structure process (1st and 2nd metal layers: W, 3rd metal layer: Al), polysilicon control gates, and polysilicon floating gates. The memory array features a bit line pitch of 32nm and a word line pitch of 38nm. An air gap is employed to reduce crosstalk between adjacent cells. [Features] ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

• Other analyses

This report is a process comparison of seven advanced 20nm-class logic devices manufactured by Intel, TSMC, and Samsung. It discusses the structures and materials used in the manufacturing of core logic transistors, I/O transistors, metallization, and SRAM layout. [Features] - Understanding key design and manufacturing innovations - Informed decision-making for technology resource investments - Support for IP activities through valuable "Evidence of Use (EoU)" information For more details, please contact us or download the catalog.

• others

At TechInsights, we collaborate with client companies to address their intellectual property rights and technology requirements. We assist you in monetizing your patent portfolio, protecting your patent positioning, safeguarding market share, and acquiring information on competing products. **Features** - Understanding key design and manufacturing innovations - Data-driven decision-making for technology resource investments - Valuable Evidence of Use (EoU) - Support for IP activities through information For more details, please contact us or download the catalog.

• others

Information on which electronic components are used in which products can be viewed from the block diagram level down to the individual semiconductor package size and die size. At the system level and in semiconductors, all packages are opened for cost asset analysis, resulting in very high accuracy in the information provided. By using this tear-down service, it becomes possible to understand the manufacturing costs of competitors and to negotiate costs favorably when procuring finished products through ODM, as it allows for an understanding of the product's cost. If we can reduce the procurement cost in ODM by 200 yen, with an annual production volume of 100,000 units, it would result in a cost reduction of 20 million yen. We also offer a customized tear-down service to analyze specified products individually. Individual meetings can be arranged, so please contact us separately.

• others

The GoPro, widely used outdoors, introduces a new world with the HERO4, adding next-generation image quality and new features. We provide a product report listing all components and costs, both external and internal, for the HERO4 Black, which is capable of high-resolution 4K level video recording, 2.7K at 50fps, and high frame rate 1080p at 120fps.

• Color camera