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With the spread of EVs (electric vehicles) and the increase in power consumption due to network connections between electronic devices, there is a growing demand for semiconductors that can handle higher output and higher current. "Power semiconductors" using next-generation semiconductor materials such as SiC are gaining attention. However, the processing of hard and brittle SiC requires advanced technology. Traditional mechanical and laser cutting methods face many issues, such as slow processing speeds, chipping, a wide cutting width leading to reduced production volume, and the inability to cut electrode surfaces. Our laser micro-processing technology, "TLS-Dicing," utilizes thermal stress from temperature differences between heating and cooling, enabling high-speed cutting even for difficult-to-process materials like SiC and glass. It can be utilized in various industries that handle hard-to-cut semiconductor materials. *Actual processing photos and data for difficult-to-cut materials and hard brittle materials can be downloaded and viewed from the link below.

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Introducing four machining examples related to precision shape cutting! You can also view processing photos from the left. ■ Y-shaped hole machining Holes can be drilled into stainless steel plates thicker than 500 µm while controlling the taper. This is from the laser entry side. The processing time was 100 seconds. 3D-Micromac excels at machining irregular holes while controlling the taper. ■ C-shaped hole machining The hole shape is completely customizable. This shows the laser exit side. We respond to strict dimensional tolerance requirements with precise laser processing. It is gaining attention as an alternative to wire electrical discharge machining (EDM). ■ Y-shaped hole machining Y-shaped holes are being machined into a 500 µm thick stainless steel plate. This is a SEM photo from the laser entry side. The groove width is 50 µm. The edges are sharp. ■ Grooved round hole machining We are machining round holes with grooves. It is possible to cut out freely shaped designs like this. It has received high praise as a highly productive device. For more details on various other examples, please download and view "Laser Microprocessing Machine Introduction & Problem-Solving Case Collection Vol. 1" from the link below.

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Introducing two machining examples related to high-speed fine multi-hole processing! You can also view processing photos from the left. ■ Mesh Processing of Stainless Steel We created a mesh structure by machining through holes with a diameter of Φ30µm at a pitch of 50µm in stainless steel SUS430 with a thickness of 100 µm. The number of holes exceeds 80,000. The processing speed is 0.25 seconds per hole. It is possible to arrange the holes in a staggered pattern, as well as in a grid layout as shown in the photo. Additionally, larger area mesh processing is also possible. Since we are scanning the laser spot to create holes, we can achieve various shapes of holes, including round, elongated, square, and triangular holes. ■ Dimple Processing on Brass This processing involves arranging stop holes with a diameter of Φ30µm and a depth of 15µm at a pitch of 40µm. The laser can process not only through holes but also stop holes. We can produce more than 30 dimples per second. The pitch and depth can be freely set. While some lasers cannot process brass, 3D-Micromac has the know-how to process it based on years of experience. *For more details on various other examples, please download and view "Laser Fine Processing Machine Introduction & Problem-Solving Case Study Collection Vol. 1" from the link below.

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Introducing two machining examples related to high-speed fine multi-hole processing! You can also view processing photos from the left. ■ Multi-hole processing on polyimide Holes with a diameter of 20 µm were processed into polyimide (125 µm thick). The processing time was less than 0.1 seconds per hole. There was no distortion or warping due to heat, and the film remained flat after processing. By applying on-the-fly technology, high-speed processing of thousands of holes per second is also possible. ■ Hole processing on stainless steel Many holes with a diameter of 20 µm were laser processed into 35 µm thick stainless steel SUS430. The shape of each hole is good, resulting in clean hole processing. Processing with a narrower pitch is also possible. For more details on various laser processing examples, please download and view "Case Studies on the Introduction of Laser Fine Processing Machines & Problem Solving Vol. 1" from the link below.

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Here are three examples of micro hole processing! You can also view processing photos from the left. ■ Hole processing of polyimide This is the laser emission side in the left photo. The reverse taper (the hole diameter on the emission side is larger than that on the incident side) is controlled at 13°. Positioning accuracy of ±250 nm and repeatability of ±250 nm have been achieved. ■ Ultra-fine hole processing A hole of approximately Φ10 µm was processed using a laser on a metal plate with a thickness of 100 µm. There is no thermal impact, resulting in a very clean round hole. Such high aspect ratio laser microprocessing is also possible. ■ Hole processing on stainless steel This is hole processing on 100 µm thick stainless steel SUS430. A fine hole with a diameter of Φ35 µm can be processed using a laser. It is also possible to create a mesh structure with multi-hole processing without distortion due to heat. For more details on various examples of laser processing, please download and view "Laser Microprocessing Machine Introduction & Problem Solving Case Collection Vol. 1" from the link below.

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Introducing three examples of micro-hole processing! You can also view processing photos from the left. ■ Hole processing of Φ1 mm in ceramic It can be seen that a vertical hole without taper has been made in a 1 mm thick ceramic (AlN). Additionally, there is no thermal impact, resulting in very clean edges. ■ Inverted taper hole processing This is a cross-section view of the hole processing results. Holes were processed in a 1 mm thick stainless steel plate. The photo shows the results of laser processing from left to right. The taper is controlled, resulting in an inverted taper on the laser emission side of the hole. ■ Hole processing of polyimide This is the laser entry side. Holes with a diameter of 25 µm have been processed. The edges are very clean, and there is almost no thermal impact. The material is 25 µm thick polyimide. This is applied to inkjet nozzles, processing over 1,000 holes per head. For more details on various examples of laser processing, please download and view "Case Studies on the Introduction and Problem Solving of Laser Microprocessing Machines Vol. 1" from the link below.

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Hikari Co., Ltd. is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser micro-processing equipment, and acts as the general agent in Japan. We have introduced their picosecond laser micro-processing equipment, which enables high-quality processing, including drilling, cutting, and marking, regardless of the material being processed, using this cutting-edge laser micro-processing technology. We are currently offering a free booklet titled "Laser Micro-Processing Machine Introduction & Case Studies Vol. 1" produced by Hikari Co., Ltd.! 【Here’s a brief introduction to the contents of the case studies!】 ◆ Laser Drilling Machine: Case study from a major electrical equipment manufacturer 　⇒ Achieved an 8% increase in gross profit through improvements in the production process (including other equipment)! ◆ Roll-to-Roll Trimming Processing: Case study from a major packaging manufacturer 　⇒ Achieved a 90% reduction in production costs through improvements in the production process, including the introduction of laser processes! ◆ We have a track record of equipment introduction and processing in various industries, including medical and life sciences, precision machinery, and automotive fields. * The "Laser Micro-Processing Machine Introduction & Case Studies Vol. 1" can be downloaded from the link below.

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The laser microprocessing system microSTRUCT vario(TM) can be equipped with three beam lines. You can choose from various laser light sources optimal for applications, including ps lasers, femtosecond lasers, and fiber lasers. Whether the processing materials are diverse such as resins, ceramics, or metals, and regardless of whether multiple processes like cutting, drilling, or patterning are required, this device, microSTRUCT vario, can handle the job with just one unit. If the processing sequence is consistent, you can also use the microSTRUCT compact with a single beam line. 【Features】 ○ Fine hole processing → Capable of forward taper and reverse taper processing ○ Fine cutting ○ Fine engraving and internal marking ○ 2D and 3D patterning For more details, please contact us or refer to the catalog.

• Other processing machines

Hikari Corporation is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the general agent in Japan. We have introduced 3D-Micromac's picosecond laser microprocessing equipment within Hikari Corporation. With this cutting-edge laser microprocessing equipment, we will respond to your prototype requests. We achieve high-quality processing for hole drilling, cutting, and marking, regardless of the material being processed. 【Application Examples】 ■ Metals: Micro hole processing, fine groove processing, thin film removal, marking, fine engraving, fine cutting ■ Ceramics, Glass, etc.: Fine engraving, fine cutting, marking, micro hole processing, laser lift-off ■ Resins: Micro hole processing, fine cutting, fine groove processing, coating removal For more details, please contact us or refer to our catalog.

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The microFLEX(TM) series laser processing system has been developed for processing flexible materials such as resin and paper in a roll-to-roll manner. The standout feature of the microFLEX is its modular concept, allowing for free modification and scaling of the processing steps for flexible substrates, making it a truly "Flexible" device. It can encompass all necessary processing steps for roll-to-roll applications, including cleaning, coating, printing, laser scribing, lamination, and cutting. The processes before and after laser micromachining can also be integrated into the device. This product supports applications from research and development to production for organic solar cells, OLEDs, RFID antennas, printed batteries, and more. 【Features】 ○ High-speed, continuous, large-area processing with lasers ○ Modularization of each process in roll-to-roll technology ○ Easy process changes with module replacement ○ Reduction of production costs ○ Support from R&D to mass production For more details, please contact us or refer to the catalog.

• Other processing machines

The laser microfabrication solution system from RESONETICS in the United States enables the microfabrication of three-dimensional structures with minimal thermal impact. It has a strong track record in the fields of life sciences, medical applications, and biotechnology research. It offers a wide range of applications including stents, balloons, catheters, filters, flow paths, μTAS, lab-on-chip devices, and sensors. From research to application, it covers areas such as in vivo, in vitro, implants, ophthalmology, minimally invasive treatment devices, and next-generation sequencers. For laser microfabrication of resins, trust RESONETICS. 【Features】 ■ Microfabrication of three-dimensional structures ■ Processing with minimal thermal impact ■ Precise control of material removal rate (0.1μm) ■ Fine structures of approximately 1μm For more details, please contact us or refer to our catalog.

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3D-Micromac, a world-class manufacturer of laser microfabrication equipment based in Germany. Microfabrication devices using picosecond and femtosecond lasers are widely applied in the production of thin-film solar cells, organic EL for lighting, automotive parts, precision machine components, cutting and drilling of transparent materials with internal marking, and medical instruments. We have introduced the "picosecond laser microfabrication equipment" from 3D-Micromac, and we will respond to your prototype requests with this cutting-edge laser microfabrication equipment. Please feel free to consult with us. 【Application Examples】 ■ Thin-film solar cells ■ Organic EL for lighting ■ Automotive parts ■ Precision machine components ■ Cutting and drilling of transparent materials with internal marking ■ Medical instruments, etc. *You can view processing examples for free from the "Download" section below.

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