上田鍍金 Product Lineup

It is possible to coat entangled precision springs with high accuracy. We have successfully scaled up the processing of products that are prone to entanglement and can only be processed in small quantities.

• Spring

This catalog introduces the analytical equipment owned by Ueda Plating Co., Ltd. In advancing research and development, various testing and analytical devices are essential for accurately verifying the results. Our company manufactures all the equipment for every process from prototype to mass production line installation in-house. Additionally, we also introduce various factories and facilities. 【Contents】 ■ List of Analytical Equipment *For more details, please refer to the catalog or feel free to contact us.*

• Electron microscope
• UV/visible spectrophotometer
• Fluorescence spectrophotometer

Ueda Plating Co., Ltd. is a company that primarily conducts surface treatment of various metals and other materials, including electronic components. We own multiple plating-related facilities, such as the "Reel-to-Reel Connector Plating Line" and the "Barrel Plating Line," which utilize our uniquely designed and manufactured partial plating equipment. For high-precision plating processing, please leave it to us. [Business Description] ■ Surface treatment of various metals and other materials, including electronic components. *For more details, please refer to our catalog or feel free to contact us.

• Other factory equipment

This is a nickel plating with a needle-like roughened surface aimed at improving adhesion to molded resins. 【Features】 ■ Improved adhesion to molded resins ■ No special additives used ■ Retains the inherent properties of nickel, such as preventing diffusion of the base metal Recently, it has also gained attention as a plating that not only improves adhesion but also possesses many functional properties such as airtightness, waterproofness, and heat dissipation.

• Plating Equipment
• power supply
• Other Connectors

Our uniquely developed special partial plating mask method allows for mass production using "standard plating solution" and "without a stripping process." By combining two independently developed mechanisms, the area of partial Au plating has become clear. This clarification of the area has also led to cost reduction. 【Features】 ■ Achieves cost reduction ■ Elimination of offline laser stripping processes ■ High area precision with dimensional tolerance of ±0.125mm or less *For more details, please contact us or download the catalog.

• Plating Equipment

Introduced early in Japan as a lead-free measure, with over 10 years of proven results!

• Plating Equipment

Whisker countermeasures! Partial reflow

• Plating Equipment

Proposal case for the introduction of Ueda plating.

• Plating Equipment

Proposal case for single-sided Au plating for IC/SIM card FPC.

• Plating Equipment

A unique plating method for products prone to power supply contact failure.

• Plating Equipment

This is a special high corrosion-resistant nickel plating that can withstand conditions where significant corrosion occurs, according to conventional plating specifications. As a result of significantly improved corrosion resistance in the mixed gas corrosion test, we have achieved cost reduction by lowering the thickness of the nickel and metal layers. Its application for power supply contacts has been decided and is currently in progress. 【Features】 ■ Low cost! ■ Significantly improved corrosion resistance compared to conventional products ■ Successful in reducing Ni layer thickness *For more details, please inquire or download the catalog.

• Plating Equipment