プレシテック・ジャパン List of Products and Services

The "Flying Spot Scanner" is a scanner that combines spectral interference measurement technology with a high-speed scanning system. It can perform high-speed scans of a diameter of 80mm, suitable for offline, inline, and quality control applications. It allows for easy inspection of target areas with definable scanning shapes and filters. Additionally, it can achieve good results even on reflective surfaces. 【Features】 ■ Ultra-fast optical scanning ■ The measurement object and optical sensor are fixed ■ No XY stage required ■ Thickness and distance (displacement) measurement based on spectral interference principles *For more details, please refer to the PDF document or feel free to contact us.

Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with our customers on their needs and objectives. This allows us to provide appropriate solutions for our customers' applications. 【Business Activities】 ■ Laser Material Processing ■ Optical Measurement Technology *For more details, please refer to the PDF document or feel free to contact us.

The "Flying Spot Scanner" is an optical measuring device that can perform wide-area scans (up to φ80) using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. Thanks to the principle of spectral interference, it can measure thickness, dimensional shapes, and inspect surface defects. Additionally, because the incident and reflected light are in a coaxial optical system, good results can be obtained even on glossy surfaces. 【Features】 ■ Wide-area scanning ~φ80mm ■ High resolution XY 6.5μm~, Z 1nm~ Minimum beam spot diameter 13μm, high Z resolution due to spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit (DLL, etc.) available for device integration ■ Applications Thickness measurement of glass substrates for FPD and LCD, measurement of wafer warp (distortion), lens shape inspection, PCB board shape inspection, height measurement of small precision parts, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

This document provides information about non-contact thickness and shape measurement sensors. It introduces topics such as "The Principle of the CHROMATIC VISION CAMERA," "Measurement Examples," and "Features and Advantages of CHRocodile." Please take a moment to read it. 【Contents (Excerpt)】 ■ White Light Sensor ■ CHRocodile C ■ Interference Sensor ■ CHROMATIC VISION CAMERA ■ FLYING SPOT SCANNER *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the CHRocodile series. It includes information on "the measurement principle of CHRocodile," as well as "interference sensors" and "CHROMATIC VISION CAMERA." Please take a moment to read it. 【Contents (excerpt)】 ■ About the measurement principle of CHRocodile ■ Principle 1: Confocal position measurement mode (surface shape and roughness measurement) ■ CLS appearance ■ Probe for CLS ■ CLS controller *For more details, please refer to the PDF document or feel free to contact us.

This document contains application examples and proposals for products related to the manufacturing process of consumer electronics. It introduces sub-micron precision displacement, shape, and thickness measurements using optical point sensors, as well as measurements of flatness, thickness, shape, and the arrangement of vertical and horizontal layers and components using FSS. We encourage you to read it. 【Contents (excerpt)】 ■ Applications and Products (designed for inline inspection) - Displacement and thickness measurements using optical single-point sensors and probes - Scanning the desired area for thickness, flatness, and shape - Shape and thickness inspection using color aberration line sensors - Scratch and defect dimension inspection using color aberration line scan cameras - Quality control of welding *For more details, please refer to the PDF document or feel free to contact us.

■ A scanner optical system equipped with all functions for tracking, monitoring, and inspection. ■ All functions are consolidated into a single control device, making control from the PLC easy. ■ All settings, editing, and management can be performed through a GUI displayed on a single monitor, making operation easy. ■ Since ScanMaster controls all functions during processing, communication time for control from the PLC is reduced, significantly shortening processing time. ■ Not only XYZ correction but also control of welding trajectories and laser power based on the workpiece's gap, steps, and shape, aiming for zero welding defects. <Representative functions equipped in ScanMaster> - 2D scanner enabling dynamic processing - Motor-driven collimator for high-precision adjustment of laser focus - OCT for accurately measuring the height of the workpiece - LPM sensor for measuring laser power passing through the processing head - LWM for assessing processing quality during laser welding using plasma, temperature, and reflected light - Sensor camera for accurately detecting welding points through images - Light to brightly illuminate the workpiece and cross jet to prevent spatter adhesion

1. Area sensor for internal defect inspection in welding - Field sensor Capable of simultaneous measurement of 110,000 points with image output. Replaces electron microscopes that require X-ray, CT scans, and work cuts. 2. Non-contact thickness measurement sensor for opaque materials - Enovasense Capable of measuring the thickness of resins, coatings, and metal coatings. Measurement range is 10nm to 1mm, with a measurement speed of 1 second or more, and measurement variation is approximately 0.5% to 3%. 3. Line camera for burr inspection after battery foil cutting - CVC A line camera with a maximum of 100kHz, capable of inline burr detection. 4. Insulation layer thickness measurement sensor - FSS Measures the thickness profile of battery insulation layers inline with a resolution of a few nm. 5. Dual point sensor for electrode thickness measurement - DPS Enables high-precision thickness measurement with a distance sensor of a few nm resolution. ■ Others 6. Line sensor for 3D shape measurement of battery can welds - CLS 7. - LWM

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.