プレシテック・ジャパン List of Products and Services

The PreciTech 2IT series is a non-contact thickness measurement sensor that utilizes spectral interference methods. It excels in high-speed and high-precision thickness measurements and is used for measuring and inspecting the thickness of wafers, films, coatings, and air gaps. It is also capable of measuring impurity/doped wafers. Other features include a wide measurement range, large allowable angles, and compatibility with various materials. There is also an area scanner that allows for surface measurements without scanning via a moving stage. There are numerous instances of its incorporation into semiconductor manufacturing equipment, and it is also used in LCD manufacturing equipment, film thickness monitoring, in-situ, and inline inspections. Additionally, it is utilized as a sensor for desktop machines such as standalone units. **Applications**: Thickness measurement before and after wafer processing (such as polishing), thickness measurement during processing, film/coating thickness measurement, glass wafer thickness inspection, TTV, thickness distribution, PCB coating thickness, battery foil thickness, glass thickness, air gaps, and more.

The "CHRocodile 2DW Series" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It is capable of measuring doped wafers and can be applied in-line, with a proven track record among many customers. In addition to measuring the thickness of semiconductor wafers like sapphire, Si, and SiC, it can also measure the thickness of films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide range of thickness measurement, compatible with various materials 　　　With a rich lineup of probes, it covers thickness from thin films (a few micrometers) to thick films (780 micrometers). It supports doped wafers. 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with our customers on their needs and objectives. This allows us to provide appropriate solutions for our customers' applications. 【Business Activities】 ■ Laser Material Processing ■ Optical Measurement Technology *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the 'CHRocodile 2IT DW1000' handled by PreciTech Japan Co., Ltd. The light source is NIR SLD. The measurement range is 80um to 8200um (n=1) and 20um to 2000um (n=3.7). Additionally, it comes with a 5-axis encoder. 【Product Specifications】 ■ Light Source: NIR SLD ■ Measurement Range: 80um to 8200um (n=1), 20um to 2000um (n=3.7) ■ External Trigger, Synchronous IO ■ 5-axis Encoder Included ■ Ethernet, RS422 ■ Analog I Output Included *For more details, please refer to the PDF document or feel free to contact us.

This document provides information about wafer thickness measurement sensors. We introduce the "CHRocodile 2 Series," which is suitable for replacement with contact gauges, as well as the design of optical measurement heads for in-process semiconductor applications. Please take a moment to read it. 【Contents】 ■ CHRocodile 2 Series ■ Design of optical measurement heads for in-process semiconductor applications ■ Advantage: Use of chromatic aberration confocal principle ■ Advantage: Use of spectral interference principle ■ Si thickness measurement data during wafer in-process *For more details, please refer to the PDF document or feel free to contact us.

This document provides information about non-contact thickness and shape measurement sensors. It introduces topics such as "The Principle of the CHROMATIC VISION CAMERA," "Measurement Examples," and "Features and Advantages of CHRocodile." Please take a moment to read it. 【Contents (Excerpt)】 ■ White Light Sensor ■ CHRocodile C ■ Interference Sensor ■ CHROMATIC VISION CAMERA ■ FLYING SPOT SCANNER *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the CHRocodile series. It includes information on "the measurement principle of CHRocodile," as well as "interference sensors" and "CHROMATIC VISION CAMERA." Please take a moment to read it. 【Contents (excerpt)】 ■ About the measurement principle of CHRocodile ■ Principle 1: Confocal position measurement mode (surface shape and roughness measurement) ■ CLS appearance ■ Probe for CLS ■ CLS controller *For more details, please refer to the PDF document or feel free to contact us.

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

This document contains application examples and proposals for products related to the manufacturing process of consumer electronics. It introduces sub-micron precision displacement, shape, and thickness measurements using optical point sensors, as well as measurements of flatness, thickness, shape, and the arrangement of vertical and horizontal layers and components using FSS. We encourage you to read it. 【Contents (excerpt)】 ■ Applications and Products (designed for inline inspection) - Displacement and thickness measurements using optical single-point sensors and probes - Scanning the desired area for thickness, flatness, and shape - Shape and thickness inspection using color aberration line sensors - Scratch and defect dimension inspection using color aberration line scan cameras - Quality control of welding *For more details, please refer to the PDF document or feel free to contact us.

Presitech is a non-contact sensor manufacturer based in Germany. It specializes in high-speed and high-precision thickness measurement and shape measurement, and is used for measuring and inspecting wafer thickness, edge shape, height, and flatness. It offers a wide measurement range, tolerance angles, and can accommodate various materials, with line sensors and area scanners suitable for full surface measurement. There are many proven applications in semiconductor manufacturing equipment, and it is also used in LCD manufacturing equipment and inline inspection of films. Additionally, it is utilized as a sensor for desktop machines such as standalone units. **Applications** Thickness measurement before and after wafer processing (such as polishing), during processing, film and coating thickness measurement, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensors mounted on CMM, battery foil thickness, glass thickness, air gaps, etc. *For more details, please refer to the PDF document or feel free to contact us.*

Presitech is a German manufacturer of non-contact sensors. They develop and manufacture optical sensors using chromatic aberration confocal method and spectral interference method. They specialize in high-speed and high-precision thickness measurement and shape measurement, which are used for wafer thickness, edge shape, height measurement, and flatness measurement and inspection. They offer a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. They have numerous achievements in being integrated into semiconductor manufacturing equipment and are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. **Applications** Thickness measurement before and after wafer processing (such as polishing), thickness measurement of films/l coatings, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensors mounted on CMM, thickness of foil for batteries, glass thickness, air gaps, etc. *For more details, please refer to the PDF materials or feel free to contact us.*

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.