Testing, Analysis and Measurement

ダイヤ電子応用

capital1000Ten thousand
number of employees35
addressOsaka/Yodogawa-ku, Osaka-shi/3-5-2 Nishinakajima, 2nd Floor, Shinai No. 10 Building
phone06-6101-1013
last updated：
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MFL Array Tank Bottom Plate Scanner "FLOORMAP X"

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[Information] ACFM (Alternating Current Field Measurement) Inspection Technology Introduction

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Phased Array Ultrasonic Testing Device "EMERALD"

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X-ray digital image JIS auxiliary software

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Ultrasonic Testing Device "HYPER SCAN IV"

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ZETEC "XY Manual Scanner NDT Sweepe"

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High-performance eddy current testing device 'MIZ-200' for thin tubes and various surface array inspections.

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CR Phantom

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『LATITUDE』

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Digital Ultrasonic Flaw Detector 'UI-S9/UI-R1'

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ZETEC MIZ-21C

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ZETEC UltraVision

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Phased Array Ultrasonic Testing Overview Presentation Material ZETEC

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ZETEC Handheld Eddy Current Tester 'MIZ-21C'

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ZETEC　DYNARAY & DYNARAY LITE

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Void Automatic Inspection Device "Industrial X-ray Automatic Inspection Device Series"

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Case Studies of Wound Inspections

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Non-Destructive Testing Industry-Specific Inspection Case Studies

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X-ray digital detector, digital X-ray camera, X-ray FPD

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GPS-linked spatial radiation dose rate meter "Hotspot Finder"

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Ultrasonic Testing Equipment 'TOPAZ64'

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Ultrasonic flaw detection machine "TOPAZ32"

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Ultrasonic Testing Equipment 'TOPAZ16'

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Portable X-ray generator 'IXS1212'

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Digital Ultrasonic Flaw Detector 'UI-27'

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Ultrasonic Bolt Tension Meter "UI-27AF"

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Duplex IQI Dual-Channel Image Quality Meter

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GPS-linked spatial dose rate automatic recording system "Hotspot Finder"

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GE industrial endoscope

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Video Probe "XL Vu"

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Video Probe "XL Lv"

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Video probe "Mentor Visual iQ"

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Daiya Electronic Application Co., Ltd. Company Profile (Introduction to Module Component Inspection Equipment)

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Guide to Ultrasonic Testing Equipment for Steel Pipes

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Daiya Electronic Application Co., Ltd. Development and provision of non-destructive testing and non-contact measurement equipment.

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Daiya Electronic Application Co., Ltd. Company Profile

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