シンコー List of Products and Services

We would like to introduce the dicing technology 'Dicing Processing' held by Shinko. Tape dicing achieves a reduction in scratches, dirt, and foreign material attachment, as well as cost reduction. Additionally, we can perform alignment cutting using various software, suppress and remove burrs (plating and metallization), and support high-pressure nozzles and two-fluid spin cleaning machines. We respond to customer needs with reliable quality from small-scale prototypes to mass production. 【Features】 ■ Tape Dicing: Reduction of scratches, dirt, and foreign material attachment, cost reduction ■ Square Chuck Table: Supports large substrates and reduces costs through multi-layer processing ■ Alignment cutting using various software ■ Suppression and removal of burrs (plating and metallization) ■ Capable of cutting and grooving thick materials (up to t10mm) ■ Compatible with high-pressure nozzles and two-fluid spin cleaning machines *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

We would like to introduce our processing technology, "Burr-less Processing." This technology allows us to solve the problem of burr generation in the processing of metal materials and metallized products. Shinko responds to various needs such as new product development with our capability to handle everything from prototypes to mass production and our high-precision processing technology. 【Processing Examples】 ■ Tungsten rod cutting (Application: Electrode) Standard: MAX 0.1mm → Actual value: MAX 0.003mm ■ Resin substrate cutting (Application: Surface mount substrate) Standard: MAX 0.1mm → Actual value: MAX 0.01mm ■ Alumina substrate cutting (Application: Optical communication circuit substrate) Standard: MAX 0.03mm → Actual value: MAX 0.004mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

We would like to introduce our processing technology for "Dress Materials (WA)." Dicing blades, diamond wheels, and various grinding wheels can become clogged with cutting chips during use, leading to a decrease in the cutting performance of the grinding wheel due to wear of the abrasive particles. By dressing the surface of the grinding wheel that has lost its cutting performance with "Dress Materials," we can restore the original cutting ability of the wheel. 【Features】 ■ Grain size: A wide range of products from WA#800 to WA#8000 high mesh ■ Shapes: Available in square sizes, block shapes, and stick shapes ■ Sintered products can also be shipped ■ Binder used is vitrified ■ Product thickness ranges from approximately 1mm to 25mm ■ A consistent system from development to manufacturing *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, it can be processed with high precision. "Dice cutting processing" involves mounting on dicing tape suitable for the product and processing conditions, allowing for high-precision alignment cutting according to dicing cuts or patterns, as well as bevel cuts and groove processing. The main processing materials include alumina, aluminum nitride, and glass materials. 【Work Size】 ■ Maximum φ260mm × t0.5mm (High torque dicer φ300mm × t3.0mm) ■ Minimum cutting dimension: 0.2mm ■ Cutting precision: ±0.01mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

We would like to introduce the strengths of Shinko Co., Ltd. in grinding technology. We accommodate various materials including optical glass, electronic component glass, quartz, lithium niobate, lithium tantalate, magnesium oxide, and more. We can handle not only mass production but also small lot processing tailored to your needs. We also engage in planning and process design for mass production. Please feel free to contact us when you need our services. 【Our Strengths】 ■ Total processing capabilities from cutting, grinding, polishing to deposition ■ Centralized management of quality and delivery times ■ Small lot processing available tailored to your needs ■ Support for planning and process design for mass production ■ Smooth prototyping, verification, and improvement through consistent processing *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

In "flat grinding processing," high-precision grinding is performed using diamond grinding wheels. We can accommodate various grinding processes such as flat grinding, cylindrical grinding, and profile grinding. We can handle everything from thin grinding of 0.1mm to large work sizes of W600×D300×H250mm. Please feel free to consult us. 【Work Size and Specifications】 ■ Maximum Work Size: W600×D300×H250mm ■ Processing Accuracy: ±0.005mm ■ Work Thickness: >t0.1mm ■ Notes - Processing can be done according to customer specifications based on the material and work size. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

"Centerless Outer Diameter Grinding" is a grinding process that shapes the outer diameter of round bar materials through fixed abrasive processing. It specializes in processing glass rods and ceramics, adjusting surface roughness with several types of grinding wheels of different grits. Since the workpiece is supported along its entire length, it minimizes deflection due to its own weight, allowing for stable outer dimensions. 【Features】 ■ Shapes the outer diameter of round bar materials through fixed abrasive processing ■ Specializes in processing glass rods and ceramics ■ Adjusts surface roughness with several types of grinding wheels of different grits ■ Enables grinding adjustments in 1μm increments, achieving high precision with a tolerance of ±1μm ■ Minimizes deflection due to the workpiece's weight, allowing for stable outer dimensions *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

We would like to introduce the strengths of Shinko Co., Ltd. in cutting technology. Our company can perform total processing from cutting, grinding, polishing to deposition, allowing for centralized management of quality and delivery times. Additionally, we can handle small lot processing in quantities tailored to your needs, and we also plan and design processes for mass production. 【Our Strengths】 ■ Total processing from cutting, grinding, polishing to deposition ■ Centralized management of quality and delivery times ■ Small lot processing available in quantities tailored to your needs ■ Planning and process design for mass production ■ Consultation available for processing of new materials under research and development ■ Smooth prototyping, verification, and improvement through consistent processing *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

"Multi-wire saw cutting processing" is a cutting method that minimizes damage to the workpiece due to free abrasive cutting. With a cutting allowance of approximately 0.20mm, it achieves high material yield and excels in the fine, high-precision cutting of expensive crystalline materials such as quartz and lithium. We offer a wide range of models, from small machines to those accommodating up to 12 inches, allowing us to meet diverse needs from small lot production of various types to mass production. [Features] - Minimizes damage to the workpiece due to free abrasive cutting - High material yield due to an extremely small cutting allowance of approximately 0.20mm - Excels in fine, high-precision cutting of expensive crystalline materials such as quartz and lithium - A wide range of models available, from small machines to those accommodating up to 12 inches - Capable of responding to diverse needs from small lot production of various types to mass production *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, high precision processing can be achieved. "Slicer cutting processing" involves bonding with WAX suitable for the product and processing conditions, allowing for strip cutting, individual piece cutting, deep groove processing, and wide groove cutting to match patterns and product edges. The main processing materials include alumina, aluminum nitride, piezoelectric ceramics, and glass materials. 【Work Size】 ■ Maximum: 250×160×15.0mm ■ Minimum cutting dimension: 0.5mm ■ Deep groove specification slicer: t40.0mm, groove depth up to 35.0mm ■ Cutting precision: ±0.01mm～ *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

Polishing processing (CMP) also supports mirror finishing of hard materials such as sapphire. We have a wide variety of polishing carriers and can respond quickly to prototyping and small lot production. We can assist you from vertical startup to mass production. The processing accuracy is ±0.002mm, and the surface roughness is Ra > 0.001μm. Please feel free to contact us when you need our services. [Features] - Supports mirror finishing of hard materials such as sapphire - A wide variety of polishing carriers available - Quick response to prototyping and small lot production - Consultation available from vertical startup to mass production *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

"Wrapping processing (double-sided polishing)" performs high-precision polishing of various ceramics for electronic components, single crystal materials, optical glass, quartz, and other materials. We own models ranging from 4B to 9B and have a rich variety of polishing carriers, allowing us to respond flexibly based on processing quantities. Additionally, we can adjust surface roughness according to the type and grit of the polishing material. You can consult with us regarding processing methods tailored to your specifications and materials. 【Features】 ■ No adhesive or peeling processes involved ■ Leads to reduced lead times and cost savings ■ Models range from 4B to 9B, with a wide selection of polishing carriers available ■ Surface roughness can be adjusted based on the type and grit of the polishing material ■ Processing methods can be discussed to match customer specifications and materials *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

Our company performs processing using "dicing processing technology" and "burr-free processing technology." We respond to customer needs with reliable quality from small-scale prototypes to mass production. Burr removal is unnecessary—our minor burr removal technology improves quality and productivity. In addition to high-precision machining of brittle materials and difficult-to-cut materials, we also accept development and manufacturing of magnetic heads, dressing materials, and other materials. 【Processing Fields】 ■ Components related to optical communication equipment ■ Components for optical devices ■ Automotive-related components ■ Components for medical devices ■ Components for office equipment ■ Electronic components *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing

Shinko Co., Ltd. responds to various needs such as new product development with its capability to handle everything from prototyping to mass production and its high-precision processing technology. In addition to high-precision machining of brittle materials and difficult-to-cut materials, we also accept orders for magnetic heads, WA dress materials, and other material development and manufacturing. We provide processed products in various fields, including components related to optical communication equipment, optical device components, automotive-related components, and medical device-related components. 【Business Overview】 ■ Contract Processing ・High-precision machining of brittle materials and difficult-to-cut materials ■ Material Development and Manufacturing (Our Original Products) ・Single crystal ferrite, single crystal sapphire ・Magnetic heads ・WA dress materials, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Contract manufacturing

We would like to introduce the magnetic head processing technology of Shinko Co., Ltd. We use processing equipment such as a single crystal pulling furnace, inner blade slicer, glass wire drawing furnace, and vertical polishing machine. In the related links below, we introduce the technology map and magnetic heads for VTR before and after embedding, so please take a look. 【Main Processing Equipment (Partial)】 ■ Single Crystal Pulling Furnace ■ Inner Blade Slicer ■ Dicing Saw ■ Vertical Polishing Machine ■ Mounting Machine ■ UV Irradiation Device *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

We would like to introduce Shinco Corporation's "Roller Correction." The material is alumina (99.5%), with an outer diameter of up to 100mm and a length of up to 135mm (roll width: up to 125mm). It can be used for cutting ferrite materials, as well as for cutting quartz, semiconductors, and optical materials. 【General Specifications Example】 ■ Material: Alumina (99.5%) ■ Outer Diameter: Up to 100mm ■ Length: Up to 135mm (Roll Width: Up to 125mm) ■ Pitch: 0.100mm and above ■ Number of Grooves: Up to 900 ■ Depth: Up to 0.5mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

"Alumina substrate" is a substrate made from alumina-based ceramics, which excels in mechanical strength, electrical insulation, corrosion resistance, heat resistance, and thermal conductivity. Its physical and chemical properties remain stable even in high-temperature environments. There is minimal variation in dimensions such as outer shape, thickness, slit pitch, and slit depth, resulting in low warping, bending, and waviness. It can be used for chip resistor substrates, HIC substrates, thin-film circuit substrates, and more. 【Features】 ■ A surface condition with few pores due to fine particles, excellent smoothness and flatness ■ Excellent adhesion to thick-film and thin-film materials ■ Stable physical and chemical properties even in high-temperature environments ■ A thermal expansion coefficient close to silicon, with high thermal conductivity ■ High-strength substrates with increased strength are also available *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

"Microtubes" are used for contact probes in electronic circuit inspection and similar applications. The material is often Ni, and some have gold plating on the inner and outer diameters. Additionally, as fine tubes, there are also medical and industrial types available, made from various materials such as metals and ceramics. 【Features of Our Processed Products】 ■ No "burrs" on the cut surface ■ Outer diameter: 0.26mm ■ Inner diameter: 0.22mm ■ Wall thickness of the tube: 20μm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

"Piezoelectric ceramics" are polycrystalline ceramics made by sintering high-purity powders (such as titanium oxide and barium oxide) at high temperatures. When mechanical energy is applied externally, a voltage is generated (piezoelectric direct effect). Conversely, when a voltage is applied (adding electrical energy), the material expands or contracts depending on the polarity (piezoelectric inverse effect). In this way, it possesses the property of "piezoelectric effect," which converts electrical energy and mechanical energy. 【Features】 ■ Polycrystalline ceramics made by sintering high-purity powders (such as titanium oxide and barium oxide) at high temperatures ■ Voltage is generated when mechanical energy is applied externally ■ When voltage is applied, the material expands or contracts according to the polarity *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Our company offers wafer surface analysis using the KLA-Tencor "Candela CS-10V." The Candela can detect microscopic defects as image data. Both the defect occurrence map and the status of individual defects can be observed. The target materials are sapphire, SiC, GaN, and other compound semiconductors, with applicable sizes ranging from φ2 inches to φ6 inches wafers (thickness less than 1mm). 【Features】 ■ Measurement data can be collected in a short time ■ No pre-treatment is required, and samples can be reused ■ Detection of microscopic defects that cannot be confirmed with an electron microscope ■ Applicable sizes: φ2 inches to φ6 inches wafers (thickness less than 1mm) *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Other analyses

We measure the crystal orientation of single crystals such as sapphire, SiC, and LTGA with respect to the cutting direction of the crystal axis. By changing the sample holder, measurements can be made from φ2.88mm chips to φ6 inch ingots. We also offer contract measurements, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Other measurement, recording and measuring instruments

We would like to introduce Shinco's thin film microfabrication technology for 'electrode deposition.' Using sputtering technology, we form high-purity, high-precision electrode films. Magnetic films can be made from Fe/Ta-based materials and high-purity Fe (permalloy), while electrode formation films can be made from Au, Cr, and Ni/Cr. Please inquire about target purity and composition. 【Types of thin films that can be formed using sputtering technology】 ■ Magnetic films: Fe/Ta-based, high-purity Fe (permalloy) ■ Electrode formation films: Au, Cr, Ni/Cr ■ Insulating films: SiO2, Al2O3 *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

We would like to introduce Shinco's thin film microfabrication "MEMS technology." SiO2 thin films (thickness 0.5 to 5.0 µm) are processed into rectangular shapes. We will assist you with shape design. Please feel free to inquire about line width values and shape aspect ratios. *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract