ヘッセ･メカトロニクス･ジャパン List of Products and Services

The "BJ985" is a new generation fully automatic fine wire bonder, developed for various automotive components such as substrates, chips, batteries, and other products. Switching from aluminum wire to copper wire can be done in just a few minutes with a bond head replacement. In addition to the standard configuration, we propose the most suitable automatic transport system for your application. 【Features (partial)】 ■ Bond head: 50pm - 600pm, compatible with aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized pattern recognition: Adoption of a new digital camera and flash lighting ■ Wedge calibration without the need for a wedge gauge ■ High-precision programmable bond force actuator *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The "BJ980" has been newly developed for the wide area where demand is increasing, particularly for solar and battery products. The highly versatile bonding area features a wedge bonder with dimensions of X700mm and Y1132mm, allowing for the construction of fully automatic or manual operation systems. We have developed a bonding head for thick wires equipped with a unique transducer that includes sensors for non-destructive testing of bond head pull tests and real-time bond quality inspection. 【Features】 ■ Flexible, one of the largest work areas in the industry: 1700mm × 1132mm ■ Bond head: 150μm - 600μm, compatible with aluminum, copper, and aluminum-copper clad ■ Ribbon maximum 2000um × 400um (80mil × 16mil) ■ High-precision programmable bond force actuator ■ Components using wear-free piezo technology *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The "BJ855" is a next-generation fully automatic fine wire bonder that expands the portfolio of existing production processes. It meets the growing demands for wire bonding and offers simplified operations through smart features such as bond head memory and chip libraries. In addition to standard equipment configurations, it is possible to provide automated transport systems optimized for individual devices. 【Features (partial)】 ■ High-performance touchdown detection with no detection delay, suitable for bonding thin substrates ■ Optimized image recognition: imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Detailed loop programming configurable for each individual loop ■ Use of wear-free components with piezo technology *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The BJ653 applies highly reliable Hesse quality and is suitable for product samples, prototype production, and small-scale manufacturing. The bond head of this product is interchangeable and supports wedge bonding, ball bonding, fine wires, thick wires, and ribbons. It accommodates both manual and automatic bonding, making it particularly suitable for quality verification in research and development, as well as in the prototype stage of products. 【Features (partial)】 ■ Bond head options compatible with commonly available wire materials ■ Use of friction-free components with piezo technology ■ Maintenance-free fresher hinge ■ Work area: X100mm, Y90mm, Z50mm ■ Optimized pattern recognition *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.

• Bonding Equipment