日本メカケミカル Company Overview

**[Issue]** Company S manufactures "lead frames" used for packaging semiconductor chips. However, with the conventional processing oil used, there were several issues: 1. Burrs of 0.028 occurred every 5 to 10 lots against the burr standard Max 0.03 (requiring repairs approximately every 39,000 shots). 2. Repairs were often needed about a day after production started, leading to a decrease in mold operating rates. 3. Frequent polishing increased the cost of mold components. **[Solution]** The solution adopted was the chlorine-free, high-performance press processing oil "Meca Eco Press U-500." **[Implementation Effects]** 1. Mold lifespan improved from 39,000 shots to 155,000 shots. 2. Mold component costs were reduced by 40%. 3. Quality stabilized due to burr suppression and improved precision. **[Customer Feedback]** "We have seen a reduction in repair frequency and an improvement in production efficiency. We have also been able to reduce mold component costs, and it has become an indispensable processing oil for us." **[Processing Details]** Material: SPCD material Number of Processes: 13 processes Processing Content: Punching and bending Plate Thickness: 0.4t *This is a case based on interviews with users who have implemented the solution. Results may vary depending on usage conditions.*