ファインテック日本 List of Products and Services

Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.

The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.

The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.

This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

With the advancement of laser technology, its range of applications is also expanding. From infrared to ultraviolet, lasers are utilized in various fields such as measurement, spectroscopy, optical communication, optical data processing and storage, fiber optic communication, and medical devices. Moreover, with the increasing demand, the manufacturing of high-power laser diodes, for example, has become one of the main mass production processes. To produce high-power lasers in large quantities, die bonding equipment is required, which must maintain high precision and reproducibility while accommodating variations in the size and type of many different components, and achieving high production efficiency in the assembly of finished products. This technical paper provides an explanation of the fully automated assembly process for high-power laser diodes, including general process parameters, bonding conditions, and process steps, and introduces solutions to typical challenges faced during laser diode manufacturing, such as the bonding quality of Au80Sn20, the bonding process, and various factors arising from materials and components themselves. *For more details, please refer to the PDF document or feel free to contact us.*

This document describes the characteristic evaluation of micro-assembly technologies utilized in manufacturing techniques such as anisotropic adhesive bonding, ultrasonic mounting, thermal combined ultrasonic mounting, and solder mounting. It includes an overview of flip chip bonding technology, as well as experimental results and discussions. A custom flip chip bonding technology inspired by solder bump technology was also experimentally validated. 【Contents】 ■ Introduction ■ Overview of Flip Chip Bonding Technology ■ Experimental Results and Discussion ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

This document introduces various bonding methods used in 3D packaging. As a result of extensive prototype research, various chips with a high number of bumps (up to 143,000), narrow pitch widths (minimum 25μm), and small bump diameters (minimum 13μm) were mounted on substrates using the high-precision die bonder "FINEPLACER sigma." It presents experimental methods related to 3D packaging technology, the process parameters used, and the results obtained. [Contents (excerpt)] ■ Metal diffusion (MD) bonding, transient liquid phase bonding (TLPB) ■ Thermal compression bonding using pre-underfill ■ Liquid-solid diffusion bonding (SLID) ■ Thermal compression bonding ■ Eutectic bonding ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

The semiconductor laser diode bar is used as an excitation light source for optical resonators in solid-state lasers and gas lasers, as well as in other fields such as medical devices and material processing. In the assembly process, alignment and bonding to the sub-carrier, as well as bonding to special heat sinks for sub-assemblies, are performed. This document describes the challenges related to the assembly of laser diode bars, common error cases, and Fine Tech's approach as a solution to ensure the success of the process. *For more details, please refer to the PDF document or feel free to contact us.*

It is now unimaginable to have a world without technologies like Flex-on-Glass, which electrically connects flexible printed circuit boards to glass substrates, or Chip-on-Glass, which directly bonds chips to glass. These technologies utilize anisotropic conductive films and pastes that have different functional principles compared to conventional adhesives and solder materials, requiring appropriate processing. This technical paper introduces these technologies and discusses typical challenges and proven solutions. *For more details, please refer to the PDF document or feel free to contact us.*

In the assembly (mounting and bonding) of optical package products, it is necessary to align optical components and electronic components with the highest precision. Furthermore, in cases such as products that incorporate thermoelectric coolers (TECs), the assembly process becomes even more complex. This technical paper describes the assembly of general printed circuit board (PCB) based optical transceiver modules (40 Gbit/s to 400 Gbit/s) for data communication applications, specifically QSFP (Quad Small Form-factor Pluggable). *For more details, please refer to the PDF document or feel free to contact us.*

In applications such as cutting, welding, and marking, fiber laser solutions are increasingly replacing traditional methods. In recent years, the manufacturing costs of semiconductor laser chips have been continuously reduced, but the current single largest cost factor is in assembly and packaging, primarily due to the manual processes involved in second-level packaging where the CoS is attached to the heat sink. To address this issue, Finetech has developed, evaluated, and provided an automated solution for packaging CoS to heat sinks using new bonding technologies. This technical paper will explain this. *For more details, please refer to the PDF document or feel free to contact us.*

Fine Tech's laser-assisted die bonding technology is suitable for chip-to-substrate (C2S) and chip-to-wafer (C2W) applications that require precise control of process speed, accuracy, and localized heating. In particular, rapid temperature cycling minimizes the risk of surface oxidation and enables the shortening of process cycles in production environments where temporal optimization is required. In continuous bonding processes at the substrate or wafer level, each chip is heated only once. Additionally, unlike area heating, localized laser heating does not require extensive equipment to prevent thermal expansion. Laser-assisted die bonding with such features is an effective technology newly added to Fine Tech's assembly and packaging technology. *For more details, please refer to the PDF document or feel free to contact us.*

The packaging of optoelectronics (photoelectronic components) units is one of the important applications in microassembly. In the recent field of photonics, multiplex transmitters and receivers with high-density packaging targeting high bandwidth, as well as assemblies that combine them, have become crucial elements. Consequently, high placement accuracy is required for the bonding of these components, and various assembly technologies are utilized. This technical paper discusses the challenges associated with these components and Fine Tech's solutions for the assembly of VCSELs and photodiodes, as well as relative high-precision bonding for single components and array components, handling of small components, safe transfer of adhesives, and advanced tool design for components with contact prohibition areas. *For more details, please refer to the PDF document or feel free to contact us.*

Thermal compression bonding is a quick and easy method for reliably joining flip chips. Many bonding processes, such as eutectic soldering implemented with load in laser bar soldering, are fundamentally classified in this category. This technical paper focuses on specific thermal compression processes used in combination with gold stud bumps or indium bumps. Flip chip bonding using this bonding method has many advantages and excellent bonding characteristics. Nevertheless, as this document indicates, it is still a niche technology and not widely adopted. Here, we provide a general overview of the process and its parameters. We also address common challenges when adopting this technology and introduce ways to solve them using the FINEPLACER die bonding equipment. *For more details, please refer to the PDF document or feel free to contact us.*