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In the implementation of optical devices such as VCSELs and PDs, the alignment target is an aperture with a diameter of only 7 micrometers. Achieving high-precision alignment of this within a millimeter-scale field of view is extremely challenging.

Fine Tech specializes in the manufacturing of high-precision die bonding equipment and is constantly pursuing cutting-edge technology. With its innovative know-how, it supports the mounting of fine components. The "FINEPLACER series" allows for flexible addition of bonding processes to manual, semi-automatic, and fully automatic machines, thanks to its modular structure, which is the basic concept of the equipment. The multi-purpose die bonding equipment offers configurations ranging from small-scale production at the prototype research and development level to fully automatic models that cater to production phases with high yield. 【Features】 ■ Mounting accuracy of 0.5μm ■ Based on the technology of the "FINEPLACER series" ■ Easy process transfer ■ Verification of rare processes ■ High-precision mounting facilitates rapid process establishment *For more details, please refer to the PDF document or feel free to contact us.

The package of optical components consists of the implementation of optical systems (lenses, prisms, apertures, filters, etc.) and electronic components (LD, PD, amplifiers, controllers, etc.). These are widely used in communication technologies where optical signals are converted to electrical signals, or vice versa. High-precision positioning of the optical systems and electronic components during implementation is essential for the normal operation of the package.

In the development of electronic devices, there is a constant demand for increased speed, higher density, and optimization of device size and functional integration. Recent technological trends have made it a critical issue to incorporate three-dimensional stacked structures into the implementation of microprocessors, memory, image sensors, and IR sensors. In response to various demands such as the reduction of pitch size, the need for miniaturization of devices, and the pursuit of thermal and electrical mechanical stability, optimization of internal wiring is required. To accommodate the increasing number of bumps, miniaturization of pitch size, and demands for reduced device height, high-precision die bonders and flip chip bonders that guarantee large bonding loads and extensive flatness are needed.

In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.

Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.

The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.

The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.

This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.