The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.
The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.
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basic information
【Main Specifications】 ○ Mounting Accuracy: ±0.5μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Magnified Field of View: 103.8mm x 2.7mm ○ Compatible Chip Size (Minimum): 0.03mm x 0.03mm to 100mm x 100mm ○ θ Fine Adjustment: ±9°/ 3.5μrad ○ Z Movement / Accuracy: 10mm / 0.2μm ○ Y Movement / Accuracy: 150mm / 0.1μm ○ X Movement / Accuracy: 450mm / 0.1μm ○ Substrate Heating Temperature: 500℃ ○ Bonding Load Range: 0.05N to 1000N *For more details, please contact us or download the catalog.
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Delivery Time
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Applications/Examples of results
【Features】 ○ Implementation accuracy of 0.5μm @ 3 sigma ○ Complete automation of various implementation processes ○ Manual operation routines available ○ Process environment managed with cleanroom quality ○ Operator safety protection (laser, UV sources, gases, etc.) ○ Access to all processes with immediate setup capability ○ Equipped with FPXvisionTM, achieving maximum optical resolution with a wide field of view ○ Intuitive operation using a touch screen panel ○ Modular system design allows for diverse configurations ● For more details, please contact us or download the catalog.
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.