ファインテック日本 List of Products and Services

The CANDO project in the UK is advancing the development of brain implants to actively avoid life-threatening seizures for epilepsy patients. The implant, measuring just a few micrometers, is assembled using the FINEPLACER high-precision die bonder. This case introduces "How brain implants offer new hope for epilepsy patients." *For detailed information about the case, please refer to the PDF document. Feel free to contact us for more details.*

The new LCD displays for transportation and industrial use from Aditec are manufactured using the FINEPLACER system. In other words, Finetech contributes to maintaining a timely flow of information. They can be easily read from a distance, list departure times and platform numbers, bring order to the noise, and provide direction and important information at a glance. This case study introduces the concept of "everything at a glance." *For detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*

Since 2012, as part of NASA's MSL mission, the "Curiosity" rover, equipped with scientific instruments including high-power lasers, has been investigating the geology and climate of Mars. The importance of QCW laser diodes cannot be underestimated, from the Chemistry and Camera complex to the wavelength-tunable laser spectrometer. These semiconductor laser arrays, specifically designed for space applications, are manufactured by Quantel, a French company that is one of the leading manufacturers of high-power solid-state lasers and a long-term partner of Finetech. This case study introduces the "High-Power Semiconductor Laser Assembly for Mars Rovers" from Quantel. *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.

The University of Southampton (UK), known for its prominent research activities, influences science and human life across various fields and provides a foundation for critical thinking and scientific advancement for scholars and professionals. Finetech's versatile flip chip die bonder, FINEPLACER, contributes to optoelectronics research at one of the UK's polytechnic universities. This case study introduces "top-notch equipment for top-notch research." *For more details about the case study, please refer to the PDF document. Feel free to contact us for more information.*

The Microelectronics Research Institute in Stuttgart conducts business-oriented research in fields such as silicon technology, application-specific integrated circuits (ASICs), nanostructures, and image sensor technology, and provides specialized training. In new applications, it has become a critical requirement to stack membrane chips of a few centimeters in size with very high precision. After all steps of placement and stacking are completed, the post-bonding accuracy for the entire process must be less than 1μm. This case study introduces a "die bonder compatible with stacking implementation of membrane chips with a post-bonding accuracy of 1μm." *For more detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*

We will introduce how the University of South-Eastern Norway is utilizing assembly equipment from Finetech to promote innovation at one of Norway's leading microtechnology hubs. The University of South-Eastern Norway (USN), which has 20,000 students across eight campuses, is one of the educational institutions in Norway. This university, which was formed by the merger of three regional colleges, currently offers a variety of bachelor's, master's, and doctoral programs in many scientific fields. In addition, USN not only plays an important role in domestic and international research and education but is also closely linked to one of the dynamic economic regions. This case study introduces the use of high-precision die bonders in the "Electronic Coast." *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.

Collaboration is one of the important driving forces for continuous growth in any business. Kromek, a manufacturer of radiation detection products, has been able to meet the conditions necessary for growth through 20 years of effective collaboration with Finetech and their assembly equipment. This case study introduces "the assembly of innovative radiation detection device prototypes to mass production." *For more details about the case study, please refer to the PDF document. Feel free to contact us for more information.*

Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.

The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.

The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.

This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.