Continuously monitor brain waves through embedded electrodes! Provide stimulation at precise timings.
The CANDO project in the UK is advancing the development of brain implants to actively avoid life-threatening seizures for epilepsy patients. The implant, measuring just a few micrometers, is assembled using the FINEPLACER high-precision die bonder. This case introduces "How brain implants offer new hope for epilepsy patients." *For detailed information about the case, please refer to the PDF document. Feel free to contact us for more details.*
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*You can view the detailed information about the case from the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed information of the case from the PDF document. For more information, please feel free to contact us.*
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.