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The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

This document introduces various bonding methods used in 3D packaging. As a result of extensive prototype research, various chips with a high number of bumps (up to 143,000), narrow pitch widths (minimum 25μm), and small bump diameters (minimum 13μm) were mounted on substrates using the high-precision die bonder "FINEPLACER sigma." It presents experimental methods related to 3D packaging technology, the process parameters used, and the results obtained. [Contents (excerpt)] ■ Metal diffusion (MD) bonding, transient liquid phase bonding (TLPB) ■ Thermal compression bonding using pre-underfill ■ Liquid-solid diffusion bonding (SLID) ■ Thermal compression bonding ■ Eutectic bonding ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

This document describes the characteristic evaluation of micro-assembly technologies utilized in manufacturing techniques such as anisotropic adhesive bonding, ultrasonic mounting, thermal combined ultrasonic mounting, and solder mounting. It includes an overview of flip chip bonding technology, as well as experimental results and discussions. A custom flip chip bonding technology inspired by solder bump technology was also experimentally validated. 【Contents】 ■ Introduction ■ Overview of Flip Chip Bonding Technology ■ Experimental Results and Discussion ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

The semiconductor laser diode bar is used as an excitation light source for optical resonators in solid-state lasers and gas lasers, as well as in other fields such as medical devices and material processing. In the assembly process, alignment and bonding to the sub-carrier, as well as bonding to special heat sinks for sub-assemblies, are performed. This document describes the challenges related to the assembly of laser diode bars, common error cases, and Fine Tech's approach as a solution to ensure the success of the process. *For more details, please refer to the PDF document or feel free to contact us.*

It is now unimaginable to have a world without technologies like Flex-on-Glass, which electrically connects flexible printed circuit boards to glass substrates, or Chip-on-Glass, which directly bonds chips to glass. These technologies utilize anisotropic conductive films and pastes that have different functional principles compared to conventional adhesives and solder materials, requiring appropriate processing. This technical paper introduces these technologies and discusses typical challenges and proven solutions. *For more details, please refer to the PDF document or feel free to contact us.*

In the assembly (mounting and bonding) of optical package products, it is necessary to align optical components and electronic components with the highest precision. Furthermore, in cases such as products that incorporate thermoelectric coolers (TECs), the assembly process becomes even more complex. This technical paper describes the assembly of general printed circuit board (PCB) based optical transceiver modules (40 Gbit/s to 400 Gbit/s) for data communication applications, specifically QSFP (Quad Small Form-factor Pluggable). *For more details, please refer to the PDF document or feel free to contact us.*

In applications such as cutting, welding, and marking, fiber laser solutions are increasingly replacing traditional methods. In recent years, the manufacturing costs of semiconductor laser chips have been continuously reduced, but the current single largest cost factor is in assembly and packaging, primarily due to the manual processes involved in second-level packaging where the CoS is attached to the heat sink. To address this issue, Finetech has developed, evaluated, and provided an automated solution for packaging CoS to heat sinks using new bonding technologies. This technical paper will explain this. *For more details, please refer to the PDF document or feel free to contact us.*

Fine Tech's laser-assisted die bonding technology is suitable for chip-to-substrate (C2S) and chip-to-wafer (C2W) applications that require precise control of process speed, accuracy, and localized heating. In particular, rapid temperature cycling minimizes the risk of surface oxidation and enables the shortening of process cycles in production environments where temporal optimization is required. In continuous bonding processes at the substrate or wafer level, each chip is heated only once. Additionally, unlike area heating, localized laser heating does not require extensive equipment to prevent thermal expansion. Laser-assisted die bonding with such features is an effective technology newly added to Fine Tech's assembly and packaging technology. *For more details, please refer to the PDF document or feel free to contact us.*

The packaging of optoelectronics (photoelectronic components) units is one of the important applications in microassembly. In the recent field of photonics, multiplex transmitters and receivers with high-density packaging targeting high bandwidth, as well as assemblies that combine them, have become crucial elements. Consequently, high placement accuracy is required for the bonding of these components, and various assembly technologies are utilized. This technical paper discusses the challenges associated with these components and Fine Tech's solutions for the assembly of VCSELs and photodiodes, as well as relative high-precision bonding for single components and array components, handling of small components, safe transfer of adhesives, and advanced tool design for components with contact prohibition areas. *For more details, please refer to the PDF document or feel free to contact us.*

Thermal compression bonding is a quick and easy method for reliably joining flip chips. Many bonding processes, such as eutectic soldering implemented with load in laser bar soldering, are fundamentally classified in this category. This technical paper focuses on specific thermal compression processes used in combination with gold stud bumps or indium bumps. Flip chip bonding using this bonding method has many advantages and excellent bonding characteristics. Nevertheless, as this document indicates, it is still a niche technology and not widely adopted. Here, we provide a general overview of the process and its parameters. We also address common challenges when adopting this technology and introduce ways to solve them using the FINEPLACER die bonding equipment. *For more details, please refer to the PDF document or feel free to contact us.*

In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.

In the development of electronic devices, there is a constant demand for increased speed, higher density, and optimization of device size and functional integration. Recent technological trends have made it a critical issue to incorporate three-dimensional stacked structures into the implementation of microprocessors, memory, image sensors, and IR sensors. In response to various demands such as the reduction of pitch size, the need for miniaturization of devices, and the pursuit of thermal and electrical mechanical stability, optimization of internal wiring is required. To accommodate the increasing number of bumps, miniaturization of pitch size, and demands for reduced device height, high-precision die bonders and flip chip bonders that guarantee large bonding loads and extensive flatness are needed.

The package of optical components consists of the implementation of optical systems (lenses, prisms, apertures, filters, etc.) and electronic components (LD, PD, amplifiers, controllers, etc.). These are widely used in communication technologies where optical signals are converted to electrical signals, or vice versa. High-precision positioning of the optical systems and electronic components during implementation is essential for the normal operation of the package.

In the implementation of optical devices such as VCSELs and PDs, the alignment target is an aperture with a diameter of only 7 micrometers. Achieving high-precision alignment of this within a millimeter-scale field of view is extremely challenging.

Fine Tech specializes in the manufacturing of high-precision die bonding equipment and is constantly pursuing cutting-edge technology. With its innovative know-how, it supports the mounting of fine components. The "FINEPLACER series" allows for flexible addition of bonding processes to manual, semi-automatic, and fully automatic machines, thanks to its modular structure, which is the basic concept of the equipment. The multi-purpose die bonding equipment offers configurations ranging from small-scale production at the prototype research and development level to fully automatic models that cater to production phases with high yield. 【Features】 ■ Mounting accuracy of 0.5μm ■ Based on the technology of the "FINEPLACER series" ■ Easy process transfer ■ Verification of rare processes ■ High-precision mounting facilitates rapid process establishment *For more details, please refer to the PDF document or feel free to contact us.