伸光製作所 List of Products and Services

【Exhibition Overview】 38th Nepcon Japan - Electronics Development and Implementation Exhibition - Exhibition Name: 24th Printed Circuit Board EXPO Dates: January 24, 2024 [Wed] to January 26, 2024 [Fri] 10:00 AM to 5:00 PM Venue: Tokyo Big Sight Booth Number: E27-37 At our booth, we will showcase cavity substrates suitable for various sensor devices, ultra-thin high-density substrates with a thickness of 0.0mm, via diameter of Φ0.04mm, and positional accuracy of ±0.025mm that enhance the performance of advanced electronic devices, as well as MSAP high-density substrates with a pattern width of 0.01mm and pattern spacing of 0.025mm achieved through selective plating methods. 【Exhibited Products】 ■ Thin high-density substrate processing technology ■ Cavity substrates ■ MSAP method We will be available for consultations at the technology, quality, and procurement booth. Please feel free to stop by. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

"Printed circuit boards" are used in very familiar items in our daily lives. This document provides an easy-to-understand explanation of the basic knowledge of "printed circuit boards." Their main role is to attach electronic components such as resistors, ICs, and capacitors to non-conductive materials through soldering, connecting the electronic components with conductive paths. By transmitting electricity through the electronic circuits of these products, we can conveniently use the electrical devices around us. It includes information on their roles, types, and where they are utilized. We encourage you to read it. [Contents] ■ What is a printed circuit board? ■ The role of printed circuit boards ■ Types of printed circuit boards ■ Places where they are utilized ■ Introduction to Shinko Seisakusho *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Our company primarily engages in the development, manufacturing, and sales of electronic circuit boards, offering double-sided boards, multilayer boards, and high-density interconnect (HDI) boards on a global scale. By providing consistent production from prototyping to mass production, we achieve high quality, high reliability, and low cost. Additionally, based on the trust and track record we have built over many years, we propose solutions that align with our customers' technical needs. We handle various types of cavity boards suitable for sensor devices, ultra-thin high-density boards with a thickness of 0.0mm, via diameter of Φ0.04mm, and positional accuracy of ±0.025mm that enhance the performance of advanced electronic devices, as well as MSAP high-density boards with a pattern width of 0.01mm and pattern spacing of 0.025mm achieved through selective plating methods. [Shinko Manufacturing's Technology] ■ Thin high-density board processing technology Supports narrow slits, free shapes, coil patterns, undercoating, and step-through holes. ■ Cavity boards Three-dimensional structures can be reproduced even with resin boards. ■ MSAP method Contributes to pattern miniaturization and product downsizing and high density through selective plating methods. *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

The Nikkei Sangyo Shimbun has featured our company's development of "MSAP." "MSAP" is a technology that forms wiring through plating on ultra-thin copper foil. It is a method advantageous for fine wiring of circuits, enabling the miniaturization of products. Shinko Seisakusho is developing high-density, high-reliability printed circuit boards that consider environmental impact using this technology. In addition to the developing "MSAP," we will provide thin, high-density printed circuit boards through processing technology for ultra-thin materials at the micron level and build-up technology. For more details, please download and view the PDF. 【MSAP Features】 ■ Copper is built up through plating to form wiring in necessary areas ■ A method advantageous for fine wiring of circuits ■ Enables product miniaturization ■ Efficient use of resources *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We would like to introduce 'MSAP', which is handled by Shinko Seisakusho Co., Ltd. The product is miniaturized through fine wiring, and environmental impact is reduced by adopting selective plating methods. The applications include module substrates and high-frequency compatible substrates. The PDF document below provides detailed information about 'MSAP', so please download it and take a look. 【Features】 ■ Miniaturization of products through fine wiring ■ Adoption of selective plating methods ■ Reduction of environmental impact ■ Applications include module substrates and high-frequency compatible substrates *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

A "printed circuit board" is an electronic component used in everyday items around us. Its main role is to attach electronic components such as resistors, ICs, and capacitors onto a non-conductive material through methods like soldering, connecting the components with conductive paths. By transmitting electricity through the electronic circuits of this product, it enables the convenient use of electrical devices in our surroundings. 【Types of Printed Circuit Boards】 ■ Rigid Board (PWB) = Hard, flat board ■ Flexible Board (FPC) = Bendable ■ Rigid-Flex Board = Rigid board + Flexible board ■ Metal Base Board = Board that enhances heat dissipation *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce the technology of printed circuit boards from Shinko Seisakusho Co., Ltd. We accommodate narrow slits, free shapes, coil patterns, undercoats, and step-through holes. We can manufacture small diameter vias of φ40μm/40μmt and multilayers of 20 layers/2.4mmt. Please feel free to consult us for more details. 【Product Lineup (Partial)】 ■ Narrow Slits ■ Free Shapes ■ Multi-Hole Vias ■ Heat Dissipation Vias ■ Cavities *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

Introducing Shinko Seisakusho Co., Ltd.'s "NB Hole Processing Technology." With a minimum hole diameter of φ0.06mm, a maximum hole diameter of φ3.20mm, and a minimum slit diameter of 0.1mm, we can process them all at once in about one minute. This is an all-in-one processing technology that challenges the limits of drills, lasers, and routers. As an alternative to NC/routers/lasers, it enables free shapes, small diameter vias, and high quality. 【Features】 ■ Capable of drilling holes in any shape ■ Mass production track record: φ40μm/t40μm ■ All holes processed at once ■ Hole position accuracy ±0.025mm ■ High insulation reliability ■ Dust-free outer edge surfaces *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

This year, we would like to introduce our technology related to cavity substrates, which have been newly adopted for optical sensor components. While printed circuit boards are generally flat, cavity substrates are a three-dimensional structure of printed circuit boards that have steps or recesses in certain areas. These steps are used for purposes such as: - Reducing the height of products by embedding components in the recessed areas - Light shielding between light-emitting and light-receiving elements - Side terminals cut from the recessed areas Having steps in the substrate increases the design flexibility for our customers' products. Additionally, by incorporating steps, it is possible to achieve a structure equivalent to that of ceramic substrates, allowing for replacement. 【Features】 - Various cavity substrates tailored to specific applications and purposes - The depth of the cavity can be set as desired - Possible replacement of ceramic substrates *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Shinko Manufacturing Co., Ltd. supplies products that satisfy our customers through technological development. We provide build-up substrates using ultra-thin materials, laser vias, via-fill plating, and via-stack technology. We have a proven track record in mass production of double-sided printed circuit boards, multilayer printed circuit boards, LED circuit boards, cavity printed circuit boards, and build-up printed circuit boards. 【Mass Production Achievements】 ■ Double-sided printed circuit boards ■ Multilayer printed circuit boards ■ LED circuit boards ■ Cavity printed circuit boards ■ Build-up printed circuit boards ■ Thin high-density printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

We would like to introduce the "Printed Circuit Boards" handled by Shinkou Seisakusho. We offer a lineup including "double-sided printed circuit boards" suitable for filters, capacitors, various devices, and communication modules, as well as "double-sided multi-layer LED circuit boards" and "thin high-density printed circuit boards." Additionally, we also provide "multi-layer printed circuit boards" and "thin high-density printed circuit boards" for LEDs, as well as "cavity printed circuit boards." 【Lineup (excerpt)】 <Applications: Filters, capacitors, various devices, communication modules, etc.> ■ Double-sided printed circuit boards ■ Multi-layer printed circuit boards ■ Double-sided multi-layer LED circuit boards ■ Thin high-density printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

The "Circuit Boards for Social Infrastructure" are products handled by Shinko Seisakusho Co., Ltd., which develops, designs, manufactures, and sells electronic circuit boards. Currently, smart grids are gaining attention as a measure against global warming. This refers to a new power transmission and distribution network that efficiently adjusts the demand and supply of electricity in homes and buildings using IT, by distributing various power generation devices. It is a tool for creating new urban developments. Circuit boards made by our company are also used in various environmentally friendly power generation devices. 【Examples of Achievements】 ■ Acceleration of power transmission and distribution ■ Smooth integration of distributed power sources ■ Demand-side management ■ Smart meters ■ Charging scheduling *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board

The "LED Mounting Board" is a product handled by Shinko Seisakusho Co., Ltd., which engages in the development, design, manufacturing, and sales of electronic circuit boards. This product is a dedicated printed circuit board that incorporates LED elements, which are the light-emitting parts, to efficiently utilize the generated light. To efficiently reflect and utilize LED light, white substrates and white solder resist are used, and surface treatments include silver plating and gold plating. 【Features】 ■ Equipped with LED elements ■ Uses white substrates and white solder resist ■ Surface treatment includes silver plating and gold plating ■ Heat generated by LED light emission can be managed through through-holes *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board

The "Printed Circuit Board for Mobile Devices (Build-Up Specification Module Board)" is a product handled by Shinko Seisakusho Co., Ltd., which develops, designs, manufactures, and sells electronic circuit boards. This product features a build-up specification using laser vias, incorporating prepreg in the build-up layers to achieve rigidity, dimensional stability, and insulation reliability in thin boards. Additionally, filled vias allow for random placement of vias and via stack structures, enhancing design flexibility. The vias are filled with metallic copper, improving heat dissipation characteristics. 【Features】 ■ A board suitable for packages that can accommodate multiple chip components ■ Designed for mobile devices ■ Two types of conductivity options for laser vias (conformal vias and filled vias) ■ Improved heat dissipation characteristics due to copper filling in the vias *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board

Shinko Manufacturing Co., Ltd. is a company primarily engaged in the design, manufacturing, and sales of printed circuit boards. By combining the know-how cultivated over many years with transmission line simulation, we conduct high-quality designs and provide circuit boards that maintain mass production quality from the prototype stage by manufacturing prototypes on a mass production line. Additionally, we respond to fluctuations in our customers' production plans by reorganizing our production schedules, accommodating not only quality but also delivery dates tailored to our customers' requests. 【Business Activities】 ■ Development, design, manufacturing, and sales of electronic circuit boards *For more details, please refer to our catalog or feel free to contact us.

• Printed Circuit Board